Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

2015 ◽  
Vol 754-755 ◽  
pp. 518-523 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Rita Mohd Said ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Phase Analysis ◽  
Solder Alloy ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Microstructural Observation ◽  
Micron Size ◽  
Free Solder

The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4(0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

2014 ◽  
Vol 803 ◽  
pp. 273-277 ◽  
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Nazree Derman ◽  
Arif Anuar Mohd Salleh ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Titanium Dioxide ◽  
Powder Metallurgy ◽  
Solder Alloy ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Physical Performances ◽  
Free Solder ◽  
Sac Solder ◽  
Solder Composite

This research has investigated the physical performances of low-silver Sn-Ag-Cu (SAC) lead-free composite solder reinforced with titanium dioxide (TiO2). The SAC/TiO2 composite solder were fabricated via powder metallurgy (PM) technique. The five different composition chosen were 0, 0.25, 0.5, 0.75, and 1.0. The results showed that distribution of TiO2 along the grain boundaries has increased the hardness of the SAC/TiO2 composite solders compared to monolithic SAC solder alloy.

Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

2015 ◽  
Vol 754-755 ◽  
pp. 530-534
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
M.N. Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Entire Range ◽  
Composite Solder ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Alloy Addition ◽  
Free Solder

This research has investigated the solder performances of Sn-0.7Cu lead-free solder reinforced with silicon nitride (Si3N4). The Sn-0.7Cu + Si3N4 composite solder were fabricated via powder metallurgy (PM) technique with five different weight percentages (0, 0.25, 0.5, 0.75 and 1.0). Results showed that distribution of Si3N4 along the grain boundaries has increased the hardness of the Sn-0.7Cu + Si3N4 composite solders compared to monolithic Sn-0.7Cu solder alloy. Addition of Si3N4 reinforcement had no significant effect to the melting temperature of the solder. Overall, the entire range of Sn-0.7Cu + Si3N4 composition greatly improves the microhardness of the eutectic solder.

Design of Experiment (DOE) of Powder Metallurgy Technique in Fabricating SnCu/Carbon Lead-Free Composite Solder with Different Mixing Parameters

2014 ◽  
Vol 803 ◽  
pp. 269-272
Author(s):  
Sayyidah Amnah Musa ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
High Performance ◽  
Composite Solder ◽  
Mixing Time ◽  
Physical And Mechanical Properties ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Best Parameter ◽  
Free Solder

Physical and mechanical properties of a solder joint will be improved by adding the high performance of reinforcement particulates in the monolithic lead-free solder. In this study, 0.1wt% of activated carbon (AC) was added into Sn-0.7Cu lead-free solder which fabricated via powder metallurgy (PM) techniques. Various parameters used in PM technique such as mixing time, compacting load and sintering temperature has been carried out in fabricating the composite solder. In this study, the best mixing time has been optimized. The distribution of carbon in SnCu matrix for each mixing time was observed by using optical microscope. Microstructural observation showed that the increasing in mixing time has increased the number of AC particles to become agglomerated. It is found out that 1hour of mixing time is the best parameter to fabricate SnCu/AC composite solder via powder metallurgy route since the distribution of reinforcement particles has distributed uniformly at the grain boundaries without any agglomeration.

Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

2015 ◽  
Vol 754-755 ◽  
pp. 166-170 ◽  
Author(s):  
Nurul Razliana Abdul Razak ◽  
Nisrin Adli ◽  
Norainiza Saud ◽  
Sayyidah Amnah Musa
Keyword(s):  
Powder Metallurgy ◽  
Grain Boundaries ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Weight Percentage ◽  
Aluminium Addition ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

2015 ◽  
Vol 754-755 ◽  
pp. 535-539
Author(s):  
Norhayanti Mohd Nasir ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
M.N. Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Microstructural Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sintering Process ◽  
Homogeneous Microstructure ◽  
Free Solder

This research has investigated the microstructural analysis and shear strength of Sn-1.0Ag-0.7Cu (SAC107) alloy used as matrix while silicon nitride (Si3N4) as reinforcement particles with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %). The composite solders were fabricated using powder metallurgy (PM) method consisting of mixing, compaction and sintering process. With additions of Si3N4 particles, the composite solders experienced a corresponding increase in strength due to fine and homogeneous microstructure. This is signified that the presence of Si3N4 particles effectively refines the microstructure.

Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

2012 ◽  
Vol 501 ◽  
pp. 160-164 ◽  
Author(s):  
Iziana Yahya ◽  
Noor Asikin Ab Ghani ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Hamidi Abd Hamid ◽  
Zainal Arifin Ahmad ◽  
...  
Keyword(s):  
Powder Metallurgy ◽  
Raw Materials ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
X Ray Diffraction ◽  
Copper Powders ◽  
Micron Size ◽  
Free Solder

The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.

Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder

2011 ◽  
Vol 277 ◽  
pp. 106-111 ◽  
Author(s):  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Hafiz Hazizi ◽  
Zainal Arifin Ahmad ◽  
Kamarudin Hussin ◽  
Khairel Rafezi Ahmad
Keyword(s):  
Mechanical Properties ◽  
Powder Metallurgy ◽  
Solder Alloy ◽  
Base Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Nano Size ◽  
Nanocomposite Solder ◽  
Powder Metallurgy Route

A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride particulates were introduced as reinforcements to obtain a novel lead-free nanocomposite solder alloy. Following fabrication, the sintered nanocomposite solder were cut into thin solder disc and were analyzed in terms of their wettability, electrical and mechanical properties. Wettability, electrical and mechanical properties of the nanocomposite solder were compared to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder which were fabricated with the same method using powder metallurgy route. Wettability property of the nanocomposite solder was found to be in the accepted range with wettability angle below 45° similar to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder. Besides wettability, the results of electrical and mechanical properties analysis showed that additions of nano size Si3N4 had enhanced the strength and electrical conductivity of nanocomposite solder comparing to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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