Convection Condition Variation Analysis on Thermal Dissipation of High Power Single Chip LED

2014 ◽  
Vol 1082 ◽  
pp. 336-339
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Input Power ◽  
Thermal Dissipation ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Single Chip ◽  
Operating Life ◽  
Constant Input ◽  
Convection Condition

High power light emitting diodes (LEDs) characteristics in terms of efficiency, long operating life and reliability which has lead to its application as lighting systems. However, the high power LEDs are subjected to thermal challenges due to it high input power. This work reports simulation analysis on a single chip high power LED to where thermal performances of the LED package were evaluated under varied convection condition. The simulation was carried out using Ansys version 11. The heat dissipation evaluated and compared in terms of junction temperature, von Mises stress and thermal resistance at each respective convection condition with constant input power of 1 W.

Natural Heat Convection Analysis on Cylindrical Al Slug of LED

2014 ◽  
Vol 487 ◽  
pp. 536-539 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Nazuhusna Khalid ◽  
K. Anwar ◽  
...  
Keyword(s):  
Natural Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Single Chip ◽  
Von Mises ◽  
Natural Heat Convection

This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

2014 ◽  
Vol 893 ◽  
pp. 811-814
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Comparison Analysis ◽  
Single Chip ◽  
High Power Led ◽  
Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug

2014 ◽  
Vol 893 ◽  
pp. 803-806 ◽  
Author(s):  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy
Keyword(s):  
Natural Convection ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Light Emitting Diode ◽  
Input Power ◽  
Junction Temperature ◽  
Simulation Platform ◽  
Single Chip ◽  
Light Emitting ◽  
Convection Condition

The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

2014 ◽  
Vol 1082 ◽  
pp. 319-322
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Steven Taniselass ◽  
Hussin Kamarudin
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Method ◽  
Packaging Material ◽  
Thermal Dissipation ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Variation Analysis ◽  
High Power Led ◽  
Von Mises

Accession of power in high power LED light source has resulted in thermal issue which causes reliability malfunction due to deficient heat dissipation. However, the heat disspation of high power LED can be enhance by improving packaging material selection.Thus, in this work, the connotation of heat slug material on the thermal performance of high power LED package was analyzed through simulation method. The significance of two heat slug materials, copper (Cu) and copper diamond (CuDia) were evaluated in terms of junction temperature, von Mises stress and thermal resistance. The simulation was executed using Ansys version 11 at ambient temperature of 25 °C with natural convection condition.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

5mm × 5mm Sized Slug on High Power LED Stress and Junction Temperature Analysis

2013 ◽  
Vol 404 ◽  
pp. 460-464
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Fairul Afzal Ahmad Fuad ◽  
Phaklen Ehkan ◽  
Rajendaran Vairavan ◽  
...  
Keyword(s):  
High Power ◽  
Light Emitting Diode ◽  
Input Power ◽  
Junction Temperature ◽  
Temperature Analysis ◽  
Single Chip ◽  
Physical Size ◽  
Light Emitting ◽  
Simulation Results ◽  
Incandescent Lamps

Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm x5mmx 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively.

CuDia Slug Size Variation Analysis on Heat Dissipation of High Power LED

2014 ◽  
Vol 487 ◽  
pp. 33-36 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli
Keyword(s):  
Natural Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Size Variation ◽  
Simulation Method ◽  
Point Of View ◽  
Junction Temperature ◽  
Variation Analysis ◽  
Single Chip ◽  
Simulation Results

The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug.

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

2014 ◽  
Vol 1082 ◽  
pp. 315-318
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Rotation Speed ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Cooling Fan ◽  
High Power Led ◽  
Von Mises

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

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