Theoretical Research on Contact Length in the Rocking Motion Wire Saw

2016 ◽  
Vol 1136 ◽  
pp. 343-349 ◽  
Author(s):  
Hui Huang ◽  
Sheng Long Zheng ◽  
Xi Peng Xu
Keyword(s):  
Line Segment ◽  
Feed Rate ◽  
Contact Length ◽  
Theoretical Research ◽  
Theoretical Equation ◽  
Motion Path ◽  
Wire Saw ◽  
Rocking Motion ◽  
The Wire ◽  
Wire Motion

Rocking motion wire saw with the additional rocking motion of either the wire or the workpiece is a new machining method compared with the traditional wire saw. The length of contact between the wire and the workpiece changes in this new saw process. In this paper, the wire motion and the contact length were theoretically researched. Wire motion path equation with the rocking motion was established. The theoretical equation of the contact length in half a swing period was derived out. The results indicated that the wire motion was a single pendulum movement with a length line segment, which the swing pivot was moved with a feed rate. The contact length had significant changes in half a swing period in the rocking motion wire saw. The contact length varied periodically with the same amplitude in the square ingot sawing, which varied periodically with the variation amplitude in the circle ingot sawing. The contact length with the rocking motion was obviously shorter than the case without the rocking motion for either the square ingot or the circle ingot.

Force Modeling and Control of SiC Monocrystal Wafer Processing

2015 ◽  
Vol 137 (6) ◽  
Author(s):  
Shujuan Li ◽  
Siming Du ◽  
Aofei Tang ◽  
Robert G. Landers ◽  
Yang Zhang
Keyword(s):  
Surface Roughness ◽  
Cutting Force ◽  
Feed Rate ◽  
Normal Force ◽  
Control Variable ◽  
Contact Length ◽  
Machining Process ◽  
Model Parameters ◽  
Wire Saw ◽  
The Wire

Wire saws with fixed diamond abrasive are often used to cut hard and brittle materials owning to the wire saw's narrow kerf, low cutting force, and minimal material waste. Typically, the cutting force changes during the operation since the part diameter and the contact length between the wire saw and part (i.e., contact length) continuously change, even if the process parameters (i.e., wire saw velocity, part feed rate, part rotation speed, and wire saw tension) are fixed, leading to wire saw breakage, wafer collapse, and inferior surface roughness. This study addresses this issue by regulating the force via feedback control. The most significant process parameter affecting the normal force, namely, part feed rate, is taken as the control variable. A system identification routine is used to obtain the transfer function relating the normal force and commanded part feed rate and the model parameters are identified online. An adaptive force controller is designed, and simulation and experimental studies for SiC monocrystal wafer wire saw machining are conducted. The results show the dynamic model well characterizes the normal force generated when wire saw machining SiC monocrystal, and the adaptive controller can effectively track various normal reference force trajectories (i.e., constants, ramps, and sine waves). The experimental results demonstrate that the wire saw machining process with adaptive force control can improve the cutting productivity and significantly decrease wafer surface roughness as compared to the cutting process with a constant part feed rate.

Wire Vibration Modeling and Experimental Analysis for Wire Saw Machining

2019 ◽  
Vol 141 (12) ◽  
Author(s):  
Aofei Tang ◽  
Shujuan Li ◽  
Guigeng Yang ◽  
Lun Li ◽  
Robert G. Landers
Keyword(s):  
Surface Quality ◽  
Process Parameters ◽  
Feed Rate ◽  
Processing Time ◽  
Experimental Studies ◽  
Wire Tension ◽  
Wire Saw ◽  
Part Surface ◽  
Wire Vibration ◽  
The Wire

Abstract Surface roughness is the key index point of wire saw processing silicon carbide (SiC). Many factors influence wafer surface quality, which is determined by the motion of the wire relative to the part. The vibration characteristic of wire saw and the process parameters are concerned factors in this paper, which presents a wire vibration model to study the wire saw vibration law. Experimental studies of a stationary wire are conducted to calibrate the damping coefficient and experimental studies of a moving wire are used to validate the developed model. Simulation, theoretical, and experimental data for wire vibrations during a variety of machining processes are found to compare very well, and the effects of various wire saw process parameters are investigated to analyze the influences of process parameters on wire vibration. It was shown that increasing the wire tension and feed rate, or decreeing the wire length, decreases the wire's first dominant frequency, and that changes in the wire velocity had a negligible effect. Finally, the measurement of the surface morphology and wire saw vibrations for different processing parameters was conducted, and it was seen that increases in the wire velocity and wire tension increases part surface quality and decreases processing time, while an increase in the feed rate decreases both part surface quality and processing time. The results show a clear correlation between the amplitude of the wire vibration outside of the processing zone and the part surface quality.

Use of the AO Wire Passer to Aid Placement of Obstetrical Saw Wire for Osteotomy

1994 ◽  
Vol 07 (04) ◽  
pp. 180-182
Author(s):  
N. Gofton ◽  
Joanne Cockshutt
Keyword(s):  
Soft Tissue ◽  
Close Contact ◽  
Soft Tissue Trauma ◽  
Wire Saw ◽  
Tissue Dissection ◽  
The Wire ◽  
Tissue Trauma

The AO wire passer can be used as an effective guide for passage of obstetrical saw wire for osteotomy. Use of the wire saw and passer reduces soft tissue trauma by minimizing tissue dissection, and promoting positioning of the saw in close contact with the bone.

scholarly journals A Method For Cutting And Preparing Thin-Sections Of Frozen Soil

1977 ◽  
Vol 18 (78) ◽  
pp. 143-144 ◽  
Author(s):  
T.E. Osterkamp
Keyword(s):  
Cutting Forces ◽  
Frozen Soil ◽  
Operating Conditions ◽  
Operating Parameters ◽  
Thin Sections ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire

Abstract A diamond wire saw was modified for cutting thin sections of frozen soil and suitable operating conditions were determined experimentally. It was found that a lubricated wire, 0.34 mm in diameter, operaied at cutting velocities of 100-300 mm s-1 and cutting forces 0.02-0.1 kg produced smooth cut surfaces un thin sections 0.4-0.5 mm in thickness. The; temperature and wire size were not critical operating parameters and the wire tensions recommended by the manufacturer were satisfactory. A method of mounting the thin sections is also described.

Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

2007 ◽  
Vol 359-360 ◽  
pp. 450-454 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge ◽  
Zhi Jian Hou
Keyword(s):  
Monocrystalline Silicon ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Surface Formation ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
The Wire ◽  
Fixed Abrasive

The physical model of fixed-abrasive diamond wire-sawing monocrystalline silicon was founded to analyze the elastic deformation of the wire, supposing that every grit was connected to the surface of the wire by a spring. Ignoring lateral vibration of the wire, the geometrical model of wire-sawing was founded; the average cut depth of single grit was calculated theoretically. Based the indentation fracture mechanics and investigations on brittle-ductile transition of machining monocrystalline silicon, the removal mechanism and surface formation was studied theoretically. It shows that in the case of wire-sawing velocity of 10m/s or higher, infeed velocity of 0.20mm/s and diamond grain size of 64μm or smaller, the chip formation and material removal is in a brittle regime mainly, but the silicon wafer surface formation is sawed in a ductile regime. The size of the abrasives, the wire-saw velocity and infeed velocity can influence the sawing process obviously.

Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis

2009 ◽  
Vol 416 ◽  
pp. 311-315 ◽  
Author(s):  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Shao Jie Li ◽  
Zhi Jian Hou
Keyword(s):  
Current Density ◽  
High Performance ◽  
Experimental Studies ◽  
Cathode Current Density ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cathode Current ◽  
The Wire ◽  
Electroplating Process

Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.

Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

2012 ◽  
Vol 588-589 ◽  
pp. 1694-1697 ◽  
Author(s):  
Wen Bo Bi ◽  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Zhen Jie Zhu
Keyword(s):  
Kdp Crystal ◽  
Wire Saw ◽  
The Wire ◽  
Diamond Abrasive

This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm2 per meter in the experiment of KDP crystal slicing.

Pelvic Canal Narrowing Caused by Triple Pelvic Osteotomy in the Dog

1994 ◽  
Vol 07 (03) ◽  
pp. 114-117 ◽  
Author(s):  
D. L. Holmberg ◽  
A. G. Binnington ◽  
C. W. Miller ◽  
H. R. Sukhiani
Keyword(s):  
Postoperative Complications ◽  
Pelvic Osteotomy ◽  
Wire Saw ◽  
The Wire

SummaryTo reduce postoperative complications due to pelvic canal narrowing following triple pelvic osteotomy, it is important to minimize the length of the pubic remnant on the acetabular segment. Three different techniques for performing the pubic osteotomy were compared: a lateral wire saw technique, a lateral osteotome technique and a ventral osteotome ostectomy technique. The lateral wire saw and ventral ostectomy techniques resulted in significantly shorter pubic remnants than the lateral osteotome technique. The osteotomies performed with the wire saw were more accurate and precise than those performed with the osteotome. The lateral wire saw technique is a practical alternative to the ventral ostectomy technique for performing the pubic osteotomy.A comparison of three different pubic osteotomy techniques for the triple pelvic osteotomy showed that minimal pubic remnants can be achieved with either the lateral wire saw or ventral ostectomy technique. Osteotomies made by the wire saw were more accurate and precise than those made by the osteotome.

Experiment Study on Micro-Seam in Electrochemical Machining

2013 ◽  
Vol 584 ◽  
pp. 15-19
Author(s):  
Zhi Yong Li ◽  
Pei Yu Dong ◽  
Yi Gang Wang
Keyword(s):  
Applied Voltage ◽  
Feed Rate ◽  
Electrochemical Machining ◽  
Machining Accuracy ◽  
Micro Machining ◽  
Wire Electrode ◽  
Process Stability ◽  
Electrode Shape ◽  
The Wire ◽  
Better Than

In this study, we firstly developed a numerical electrochemical micro-machining (EMM) setup. Furthermore, the effects of five vital process parameters, applied voltage, electrolyte type, electrode shape and diameter, electrode feed rate on micro-seams machining accuracy and process stability were evaluated. The experimental results show that: Wire electrodes machining accuracy is higher than that of sheet electrode. With the wire electrodes diameter decreased from 0.2mm to 0.06mm, micro-seam width is reduced by 36.55%. With the wire electrode feed rate increased from 0.2mm/min to 0.6mmm/min, micro-seam width is reduced by 44.2%. Sheet electrodes machining stability is better than that of wire electrode. The number of machining stability of sheet electrode is 25% higher than that of wire electrode in the condition of 8V applied voltage.

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