Improved Thermal Conductivity of Compostie Particles Filled Epoxy Resin

2011 ◽  
Vol 217-218 ◽  
pp. 439-444 ◽  
Author(s):  
Xiu Ju Zhang ◽  
Zhi Dan Lin ◽  
Bo Li ◽  
Shao Zao Tan
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Silicon Nitride ◽  
Boron Nitride ◽  
Epoxy Resin ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Curing Agent ◽  
Conductive Property ◽  
Conductive Properties

E-44 epoxy resin was used as matrix，and silicon nitride，boron nitride，alumina and silicon carbide were used as heat-conducting insulating fillers. By selecting the amounts and types of the insulting fillers, the heat conductive properties of E-44 could be adjusted. In addition, by choosing the curing agent and accelerator the viscosity of E-44 could also be readily controlled. The relation among the adhesive viscosity，heat conductive property and prescription was studied. When the amounts of silicon nitride, alumina and boron nitride were 25%, 25%, 10% (based on the mass of epoxy resin matrix), respectively, the thermal conductivity of this system was 2.66 W/mK.

Enhanced Thermal Conductivity for Graphene Nanoplatelets/Epoxy Resin Composites

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Dahai Zhu ◽  
Yu Qi ◽  
Wei Yu ◽  
Lifei Chen ◽  
Mingzhu Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Great Influence ◽  
Graphene Nanoplatelets ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Factors Affecting ◽  
Molding Method ◽  
Ep Matrix

Graphene nanoplatelets (GNPs) have excellent thermal conductivity. It can significantly improve the heat-conducting property of epoxy resin (EP) matrix. In this paper, the GNPs/EP composites were successfully prepared by using ultrasonication and the cast molding method. The prepared GNPs/EP composites were systematically characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and thermal conductivity analyzer. Some factors affecting the thermal transfer performance of the composites were discussed. The defoamation has great influence on the thermal conductivity of composite. There is a nearly linear relationship between the mass fraction and the thermal conductivity of composite when the mass fraction of GNPs is below 4.3%. The results show that when the mass fraction of GNPs is 4.3% with crushing time of 2 s, the thermal conductivity of GNPs/EP composite is up to 0.99 W/m K. The thermal conductivity is increased by 9.0% compared with that without pulverization treatment (0.91 W/m K). When it is ground three times, the thermal conductivity of composite reaches the maximum (1.06 W/m K) and it is increased by 307.7% compared with that of epoxy resin matrix.

Graphene Nanoplatelets/Epoxy Resin Composites With High Thermal Conductivity

2016 ◽  
Author(s):  
Yu Qi ◽  
Wei Yu ◽  
Li-Fei Chen ◽  
Hua-qing Xie ◽  
Ming-Zhu Wang
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Mass Fraction ◽  
Graphene Nanoplatelets ◽  
Resin Matrix ◽  
Heat Conducting ◽  
Molding Method ◽  
Thermal Transfer ◽  
Conducting Property ◽  
Ep Matrix

Graphene nanoplatelets (GNPs) are a kind of material with excellent thermal conductivity. It can significantly improve the heat-conducting property of epoxy resin (EP) matrix. In this study, GNPs/EP composites were prepared by ultrasonication and the cast molding method. The effect of optimization in the preparation process on the thermal transfer performance of the composites was discussed. The pulverizing time of GNPs and three-roll grinder grinding of composites were considered. The results indicated that when the mass fraction of GNPs was 4.3%, in its pulverizing time of 2s, the thermal conductivity of GNPs/EP composites was up to 0.99 W/m·K, and it was increased by 9% compared with non-pulverization treatment. However, after pulverizing two seconds and grinding three times, the thermal conductivity of the composite reached the maximum (1.06 W/m·K) when the mass fraction of GNPs was 4.3%, and it was finally increased by 307.7% compared with epoxy resin matrix.

Boron nitride‐graphene sponge as skeleton filled with epoxy resin for enhancing thermal conductivity and electrical insulation

2019 ◽  
Vol 40 (S2) ◽  
pp. E1600-E1611 ◽  
Author(s):  
Yulan Guo ◽  
Jing He ◽  
Hua Wang ◽  
Zheng Su ◽  
Qiqi Qu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Epoxy Resin ◽  
Electrical Insulation ◽  
Graphene Sponge

Thermal conductivity epoxy resin composites filled with boron nitride

2011 ◽  
Vol 23 (6) ◽  
pp. 1025-1028 ◽  
Author(s):  
Junwei Gu ◽  
Qiuyu Zhang ◽  
Jing Dang ◽  
Chao Xie
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Epoxy Resin ◽  
Resin Composites ◽  
Epoxy Resin Composites

Micromechanical characterization of chemically vapor deposited ceramic films

1994 ◽  
Vol 9 (8) ◽  
pp. 2072-2078 ◽  
Author(s):  
J.M. Grow ◽  
R.A. Levy
Keyword(s):  
Silicon Carbide ◽  
Silicon Nitride ◽  
Boron Nitride ◽  
Silicon Dioxide ◽  
Boron Carbide ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Ceramic Films ◽  
Chemically Vapor Deposited ◽  
Micromechanical Characterization

In this study, nanoindentation is used to determine Young's modulus of chemically vapor deposited films consisting of silicon carbide, silicon nitride, boron carbide, boron nitride, and silicon dioxide. Diethylsilane and ditertiarybutylsilane were used as precursors in the synthesis of the silicon-based material, while triethylamine borane complex was used for the boron-based material. The modulus of these films was observed to be dependent on the processing conditions and resulting composition of the deposits. For the silicon carbide, silicon nitride, boron carbide, and boron nitride films, the carbon content in the films was observed to increase significantly with higher deposition temperatures, resulting in a corresponding decrease in values of Young's modulus. The composition of the silicon dioxide films was near stoichiometry over the investigated deposition temperature range (375–475 °C) with correspondingly small variations in the micromechanical properties. Subsequent annealing of these oxide films resulted in a significant increase in the values of Young's modulus due to hydrogen and moisture removal.

Sign in / Sign up

Export Citation Format

Share Document