Thermal Design of Automotive Headlamp with High Power LED

2013 ◽  
Vol 457-458 ◽  
pp. 649-654
Author(s):  
Jing Wang ◽  
Yi Xi Cai ◽  
Chun Zhang ◽  
Xin Jie Zhao ◽  
Xiao Hua Li ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Fluorescent Lamps ◽  
Beam System ◽  
Cooling Devices ◽  
High Power Led ◽  
Led Headlamp ◽  
Volume Method

With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent or fluorescent lamps with high-power LEDs is growing more and more popular. However, heat dissipation of high-power LED is the main bottleneck for its application. In this research, a kind of automotive headlamp low beam system model is designed with high power LED chips. Several different cooling devices are designed for headlamp cooling, the heat dissipation performances are simulated and analyzed both by the finite volume method (FVM) in FloEFD and experimental measurements. The obtained results indicate that loop heat pipe combined with fined heat sink is the most effective way for heat dissipation in the designed automotive low beam system, even in 80¡æ environmental temperature can ensure the LED headlamp system working stability. The research lays a theoretical basis for the follow-up study.

Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

The Design of High Power LED Headlamp

2013 ◽  
Vol 423-426 ◽  
pp. 2098-2103
Author(s):  
Wen Lin Chen ◽  
Zhen An ◽  
Chao Qun Xiang ◽  
Chen Yang Liu ◽  
Li Na Hao
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Current Drive ◽  
Constant Current ◽  
Light Emitting ◽  
High Power Led ◽  
Drive Circuit ◽  
Led Headlamp ◽  
The Stability

With the continuous development of LED(Light-Emitting Diode) manufacturing technology, the high power white LED is gradually applied in the field of all kinds of lighting .But with working time increasing of LED chips, their junctions temperature continue increasing, which lead to decrease light-emitting efficiency and reliability of LED chip, and even be failure. According to the serious heating of LED chip, this paper has been designed a fin-type aluminum radiator panels using Pro/E software. A LED constant current drive circuit is designed by using LTC3783 chip. With the ANSYS software, thermal analysis was carried out on the fin-type aluminum radiator panels, and eventually the mode of high power LED headlamps is determined. The stability of the LED constant current drive circuit is verified through experiments. The LED headlamps of 90W worked for ten hours, and the results of the experiments showed that the LED chip junctions temperature measured are less than 75°Cso we can solve heat dissipation of high power LED headlamps effectively.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Analysis and Optimization of Heat Dissipation Characteristics of High-power LED

2021 ◽  
Author(s):  
Pingfeng Wu ◽  
Runji Fang ◽  
Xuanjun Dai ◽  
Anak Agung Ayu Putri
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Power Led

scholarly journals Systematic Research on the Heat Dissipation Channel of High Power LED Street Lamps

2021 ◽  
Vol 1952 (3) ◽  
pp. 032003
Author(s):  
Zhao Wang ◽  
Qijun Bao ◽  
Yuefeng Li ◽  
Jun Zou ◽  
Hao Zheng ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Systematic Research ◽  
High Power Led

Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

2011 ◽  
Vol 32 (11) ◽  
pp. 1171-1175 ◽  
Author(s):  
柴伟伟 CHAI Wei-wei ◽  
陈清华 CHEN Qing-hua ◽  
李琳红 LI Ling-hong ◽  
唐文勇 TANG Wen-yong ◽  
张学清 ZHANG Xue-qing ◽  
...  
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
High Power Led

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

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