Creep-Feed Grinding of Tungsten Carbide by Using Resin-Bonded Nickel-Coated Diamond Wheel

2011 ◽  
Vol 325 ◽  
pp. 165-170
Author(s):  
Abbas Pak ◽  
Amir Abdullah
Keyword(s):  
Tungsten Carbide ◽  
Specific Energy ◽  
Diamond Wheel ◽  
Grinding Force ◽  
Technological Parameters ◽  
Wheel Wear ◽  
Creep Feed Grinding ◽  
Creep Feed ◽  
Force Increase ◽  
Machining Operations

Force and specific energy are important factors in all abrasive machining operations especially in creep-feed grinding of hard materials. They have a high influence on the wheel wear, grinding accuracy, grinding temperature and surface integrity. This paper investigates the effect of grinding technological parameters on grinding force and specific energy in up-cut creep-feed grinding of cemented tungsten carbide with 20% cobalt using a resin-bonded nickel-coated diamond wheel. It was observed that increase of feed rate resulted in grinding force increase and specific energy decrease. Increased wheel-peripheral speed resulted in minor decrease of grinding force and specific energy increase.

scholarly journals Study on creep feed grinding with CBN wheels. Characteristics of wheel wear.

1989 ◽  
Vol 55 (8) ◽  
pp. 1468-1474 ◽  
Author(s):  
Yoshio ICHIDA ◽  
Kozo KISHI ◽  
Yuji SUYAMA ◽  
Junichiro OKUBO
Keyword(s):  
Wheel Wear ◽  
Creep Feed Grinding ◽  
Creep Feed

Investigation of Grinding Force and Surface Integrity of IC10 in Creep Feed Grinding

2020 ◽  
Author(s):  
Jun-chen Li ◽  
Wen-hu Wang ◽  
Rui-song Jiang ◽  
Xiao-fen Liu ◽  
Huang Bo ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal ◽  
Normal Force ◽  
Removal Rate ◽  
Tangential Force ◽  
Grinding Force ◽  
Wheel Speed ◽  
Creep Feed Grinding ◽  
Creep Feed

Abstract The IC10 superalloy material is one of the most important materials for aero-engine turbine blade due to its excellent performances. However, it is difficult to be machined because of its special properties such as terrible tool wear and low machined efficiency. The creep feed grinding is widely used in machining IC10 superalloy due to the advance in reducing tool wear, improving material removal rate and surface quality. The creep feed grinding is a promising machining process with the advantages of high material removal rate due to large cutting depth, long cutting arc and very slow workpiece, and its predominant features might have significant influence on the grinding force and surface quality for the workpiece. Hence, it is of great importance to study the grinding force and surface integrity in creep feed grinding IC10 superalloy. In this paper, a series of orthogonal experiments have been carried out and the effects of grinding parameters on the grinding force and the surface roughness are analyzed. The topographies and defects of the machined surface were observed and analyzed using SEM. The results of the experiments show that the tangential force is decreased with the workpiece speed increasing. However, there is no significant change in tangential force with the increasing of grinding depth and wheel speed. The normal force is decreased with the workpiece speed increasing when the workpiece speed is less than 150 mm/min, but when the workpiece speed is more than 150 mm/min the normal force is increased tardily. Moreover, the normal force is increased sharply with the increase of grinding depth and is increased slowly with the increase of wheel speed. In general, the surface roughness is increased with workpiece speed and grinding depth increasing, while the trend of increase corresponding that of workpiece speed is more evident. The value of the surface roughness is decreased with wheel speed increasing. And it is found out that the main defect is burning of the IC10 superalloy material in creep feed grinding by energy spectrum analysis of some typical topography in this study.

Finite Element Simulation of Axial Creep-Feed Grinding Engineering Ceramics Based on ANSYS/LS-DYNA

2012 ◽  
Vol 472-475 ◽  
pp. 927-931
Author(s):  
Xin Li Tian ◽  
Fu Qiang Li ◽  
Ya Tao Mao ◽  
Bao Guo Zhang ◽  
Jian Quan Wang
Keyword(s):  
Grinding Force ◽  
Grinding Forces ◽  
Engineering Ceramics ◽  
Creep Feed Grinding ◽  
Creep Feed ◽  
Element Simulation ◽  
Grinding Conditions ◽  
Grinding Mechanism ◽  
Single Grain ◽  
Diamond Grain

Introducing the grinding mechanism of axial creep-feed grinding ceramics with a single diamond grain. Establishing the simulation model of a single grain grinding engineering ceramics by axial creep-feed grinding and analyzing the simulation results of the grinding force in the X,Y,Z axis. Finally, the impacts of the wheel speed, axial feed rate and workpiece speed upon grinding forces were discussed by simulating the single diamond abrasive grinding process under different grinding conditions.

Grinding Force in Creep Feed Grinding of Titanium Alloy with Monolayer Brazed CBN Wheels

2012 ◽  
Vol 565 ◽  
pp. 94-99 ◽  
Author(s):  
Chang Yong Yang ◽  
Jiu Hua Xu ◽  
Wen Feng Ding
Keyword(s):  
Titanium Alloy ◽  
Boron Nitride ◽  
Cubic Boron Nitride ◽  
Grinding Force ◽  
Grinding Forces ◽  
Specific Grinding Energy ◽  
Creep Feed Grinding ◽  
Creep Feed ◽  
Force Ratio ◽  
Composite Filler

In this paper, grinding forces of titanium alloy Ti-6Al-4V are measured during creep feed grinding with brazed cubic boron nitride (CBN) wheels. The effects of process parameters on grinding force, force ratio and specific grinding energy are investigated in detail. The grinding force is low and force ratio is about 1.5, and the specific grinding energy of titanium alloys Ti-6Al-4V is about 65J/mm3. Also, CBN wheels brazed with composite filler of Ag-Cu-Ti and 0.5wt.% lanthanum show better grinding performance than the counterpart brazed with Ag-Cu-Ti filler in this investigation.

Some Aspects of Flat Surface Grinding with Intermittent Cross-Feed

1979 ◽  
Vol 101 (2) ◽  
pp. 135-146 ◽  
Author(s):  
J. K. Banerjee
Keyword(s):  
Wear Mechanism ◽  
Specific Energy ◽  
Flat Surface ◽  
Grinding Force ◽  
Wheel Wear ◽  
Material Combination ◽  
Force Relation ◽  
Wide Range ◽  
Constant Maximum ◽  
Force Equilibrium

Part I: A Wheel Wear Mechanism. Using a constant maximum grit-force hypothesis for a fixed wheel-work combination, a stable and progressive wear-land model is developed as a function of the machine settings and its mechanical and thermal limitations are discussed. Experiments conducted with several wheel-work materials, both during dry and wet grinding justify the proposed wear mechanism and its limitations with respect to the machine settings. Part II: The Force Equilibrium. Under a stable wear mechanism as proposed in Part I, the grinding force is shown to be a simple linear function of a combined machine settings’ parameter; the slope of the line gives, in the range of the machine settings used, a constant specific energy for a given wheel-work material combination. Thermal expansion as well as grit rubbing, while not necessarily altering the basic wear-land geometry, tend to change this force relation. Experimental results over a wide range of the machine settings and for different wheels and workpieces agree with the force relation, and the specific energy calculated therefrom coincides quantitatively with the other published results on similar workpiece materials.

High Efficiency Precision Surface Grinding of Fused Silica

2011 ◽  
Vol 418-420 ◽  
pp. 1132-1136 ◽  
Author(s):  
Peng Yao ◽  
Ya Dong Gong ◽  
Suo Xian Yuan ◽  
Nobuhito Yoshihara ◽  
Ji Wang Yan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Integrity ◽  
High Efficiency ◽  
High Surface ◽  
Chip Thickness ◽  
Diamond Wheel ◽  
Fused Silica ◽  
Wheel Wear ◽  
Undeformed Chip Thickness ◽  
Creep Feed

High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

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