XPS Study on Barium Strontium Titanate (BST) Thin Films Etching in SF6/Ar Plasma

Subscript textReactive ion etching of barium strontium titanate (BST) thin films using an SF6/Ar plasma has been studied. BST surfaces before and after etching were analyzed by X-ray photoelectron spectroscopy to investigate the reaction ion etching mechanism, and chemical reactions had occurred between the F plasma and the Ba, Sr and Ti metal species. Fluorides of these metals were formed and some remained on the surface during the etching process. Ti can be removed completely by chemical reaction because the TiF4by-product is volatile. Minor quantities of Ti-F could still be detected by narrow scan X-ray photoelectron spectra, which was thought to be present in metal-oxy-fluoride(Metal-O-F). These species were investigated from O1sspectra, and a fluoride-rich surface was formed during etching because the high boiling point BaF2and SrF2residues are hard to remove. The etching rate was limited to 14.28nm/min. A 1-minute Ar/10 plasma physical sputtering was carried out for every 4 minutes of surface etching, which effectively removed remaining surface residue. Sequential chemical reaction and sputtered etching is an effective etching method for BST films.