Custom Micro Tooling for Mechanical Ductile-Mode Micro/Nano Machining of Hard and Brittle Materials

2012 ◽  
Vol 426 ◽  
pp. 20-23
Author(s):  
Xiang Cheng ◽  
Xi Zhang ◽  
J.Y. Liu ◽  
X.H. Yang ◽  
Z.Q. Tian
Keyword(s):  
Three Dimensional ◽  
Brittle Materials ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Factors Affecting ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Micro Tooling ◽  
Key Aspects ◽  
Micro Tools

Hard and brittle materials such as WC, SiC, and single crystal silicon or germanium are widely used in die/moulds for very high accuracy glass products, medical devices, and sensors for MEMS. Mechanical ductile-mode micro/nano milling is an effective method to create three dimensional geometries on these materials. One of the key factors affecting successfully ductile-mode machining is micro tooling. Due to limitations of commercially available micro tools, custom micro tooling is brought forward to give an active solution to this issue. This paper is a further study on custom micro tooling by the author, and several aspects associated with custom micro tooling have been discussed. Experimental results show the feasibility and effectiveness of the successful ductile-mode machining of hard and brittle materials by custom micro tooling. At last, this paper summarizes the techniques associated with custom micro tooling and point out the key aspects for further research on custom micro tooling.

scholarly journals Effect of Thermal Softening on Anisotropy and Ductile Mode Cutting of Sapphire Using Micro-Laser Assisted Machining

2017 ◽  
Vol 5 (1) ◽  
Author(s):  
Hossein Mohammadi ◽  
John A. Patten
Keyword(s):  
Removal Rate ◽  
Brittle Materials ◽  
Single Crystal Silicon ◽  
Thermal Softening ◽  
Depth Of Cut ◽  
Crystal Silicon ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Fracture Damage ◽  
Diamond Cutting Tool

Ceramics and semiconductors have many applications in optics, micro-electro-mechanical systems, and electronic industries due to their desirable properties. In most of these applications, these materials should have a smooth surface without any surface and subsurface damages. Avoiding these damages yet achieving high material removal rate in the machining of them is very challenging as they are extremely hard and brittle. Materials such as single crystal silicon and sapphire have a crystal orientation or anisotropy effect. Because of this characteristic, their mechanical properties vary significantly by orientation that makes their machining even more difficult. In previous works, it has been shown that it is possible to machine brittle materials in ductile mode. In the present study, scratch tests were accomplished on the monocrystal sapphire in four different perpendicular directions. A laser is transmitted to a diamond cutting tool to heat and soften the material to either enhance the ductility, resulting in a deeper cut, or reducing brittleness leading to decreased fracture damage. Results such as depth of cut and also nature of cut (ductile or brittle) for different directions, laser powers, and cutting loads are compared. Also, influence of thermal softening on ductile response and its correlation to the anisotropy properties of sapphire is investigated. The effect of thermal softening on cuts is studied by analyzing the image of cuts and verifying the depth of cuts which were made by using varying thrust load and laser power. Macroscopic plastic deformation (chips and surface) occurring under high contract pressures and high temperatures is presented.

Micro-Patterning of Silicon by Frictional Interaction and Chemical Reaction

1998 ◽  
Vol 120 (2) ◽  
pp. 353-357 ◽  
Author(s):  
Dae-Eun Kim ◽  
Jae-Joon Yi
Keyword(s):  
Chemical Reaction ◽  
Low Cost ◽  
Three Dimensional ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Micro Electro Mechanical Systems ◽  
Micro Patterning ◽  
Frictional Interaction ◽  
Micro Structures ◽  
Micro Patterns

In this paper a novel and economical method of generating three-dimensional micro-patterns on single crystal silicon without the need for a mask is presented. The technique is based on the fundamental understanding of frictional interaction at light loads. Micro-patterning is done through a two-step process that comprises mechanical scribing and chemical etching. The basic idea is to induce micro-plastic deformation along a prescribed track through frictional interaction between the tool and the workpiece. Then, by exposing the surface to a chemical under controlled conditions, preferential chemical reaction is induced along the track to form hillocks about 5 μm wide and 1 μm high. This method of micro-machining may be used for making patterns in micro-electro-mechanical systems (MEMS) at low cost. Furthermore, this process demonstrates how microtribological processes can be utilized in the fabrication of micro-structures.

A Three-Dimensional Monte Carlo Model for Phosphorus Implants into (100) Single-Crystal Silicon

1997 ◽  
Vol 490 ◽  
Author(s):  
Myung-Sik Son ◽  
Ho-Jung Hwang
Keyword(s):  
Monte Carlo ◽  
Single Crystal ◽  
Room Temperature ◽  
Monte Carlo Model ◽  
Three Dimensional ◽  
Single Crystal Silicon ◽  
Amorphous Region ◽  
Electronic Energy ◽  
Crystal Silicon ◽  
Dynamic Simulation Model

ABSTRACTAn alternative three-dimensional (3D) Monte Carlo (MC) dynamic simulation model for phosphorus implant into (100) single-crystal silicon has been developed which incorporates the effects of channeling and damage. This model calculates the trajectories of both implanted ions and recoiled silicons and concurrently and explicitly affects both ions and recoils due to the presence of accumulative damage. In addition, the model for room-temperature implant accounts for the self-annealing effect using our defined recombination probabilities for vacancies and interstitials saved on the unit volumes. Our model has been verified by the comparison with the previously published SIMS data over commonly used energy range between 10 and 180 keV, using our proposed empirical electronic energy loss model. The 3D formations of the amorphous region and the ultra-shallow junction around the implanted region could be predicted by using our model, TRICSI (TRansport Ions into Crystal-Silicon).

Applying Constant Pressure Unit to Ductile Mode Cutting of Hard and Brittle Materials

2013 ◽  
Vol 7 (3) ◽  
pp. 278-284 ◽  
Author(s):  
Kunitaka Kuriyama ◽  
◽  
Masahiko Fukuta ◽  
Katsuhiko Sekiya ◽  
Keiji Yamada ◽  
...  
Keyword(s):  
Cutting Forces ◽  
High Efficiency ◽  
Static Pressure ◽  
Constant Pressure ◽  
Brittle Materials ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Ductile Mode Cutting ◽  
Pressure Unit ◽  
Increasing Demand

It is strongly wished that hard and brittle materials could be used in a wide variety of fields because of their great material characteristics. For now, however, minute profiling or high-efficiency cutting of these materials has not yet been put into practice due to their hardness. At the same time, there have been numerous reports available on ductile mode cutting for hard and brittle materials in response to the increasing demand. Very smoothly finished surfaces can reportedly be generated through the work of a material removal mechanism similar to plastic deformation, done by microminiaturizing cutting units with the sharp cutting edges of tools. Because of the extremely narrow ductile mode regions, however, forced cutting processing, which includes cutting work, demands extremely high motion performance or rigidity of machine tools, and this makes it difficult to realize stable ductile mode cutting. On the other hand, pressure cutting processing similar to polishing is known to be capable of producing extremely smooth finished surfaces on hard and brittle materials; this suggests that we could realize stable ductile mode cutting that will always create the same depths of cut by controlling the insertion forces on the tools. In this paper, in order to realize stable ductile mode cutting, we have devised and prototyped a constant pressure cutting device which can regulate cutting forces by regulating supply pressure with air static pressure bearings. We have investigated the relationships between the pressure supplied in the cutting direction and the cutting forces in order to get static pressure characteristics of the prototype device. We have also carried out experiments to cut hard and brittle materials with the prototype constant pressure cutting device mounted on the tool post of an ultraprecision machine tool to prove the effectiveness of the constant pressure cutting device for the ductile mode cutting of hard and brittle materials.

Study on the Ductile-Mode Milling of Brittle Ceramics

2012 ◽  
Vol 490-495 ◽  
pp. 3654-3657
Author(s):  
Xiang Cheng ◽  
Bin Gao ◽  
Jun Ying Liu ◽  
Xian Hai Yang
Keyword(s):  
Experimental Study ◽  
Brittle Materials ◽  
Ceramic Materials ◽  
High Accuracy ◽  
Experimental Results ◽  
Machining Parameters ◽  
Machining Conditions ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Experimental Background

Hard and brittle materials such as silicon and ceramic materials are difficult to machining due to their brittle properties. By the ductile-mode machining, delicate features with high accuracy can be created on these materials by mechanical micro/nano machining. This paper introduced the experimental study on the ductile-mode milling of ceramics. First, the experimental background and plans have been introduced. Then, on the sub-micron milling center, experimental results show that ductile-mode machining can be achieved. Both machining parameters and machining conditions are very important in order to realize the ductile-mode machining

Study on ductile mode machining of single-crystal silicon by mechanical machining

2017 ◽  
Vol 113 ◽  
pp. 1-9 ◽  
Author(s):  
Dae-Hee Choi ◽  
Je-Ryung Lee ◽  
Na-Ri Kang ◽  
Tae-Jin Je ◽  
Ju-Young Kim ◽  
...  
Keyword(s):  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Ductile Mode ◽  
Mechanical Machining

Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw

2016 ◽  
Vol 1136 ◽  
pp. 350-356 ◽  
Author(s):  
Takaaki Suzuki ◽  
Toshinori Otsuki ◽  
Ji Wang Yan
Keyword(s):  
Single Crystal ◽  
High Precision ◽  
High Speed ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Wire Saw ◽  
Hard And Brittle Materials ◽  
Feeding Speed ◽  
Wire Feeding ◽  
Control Technologies

Precision slicing tests were performed for single-crystal silicon by using a newly developed dicing wire saw system and diamond wires. The developed dicing wire saw enables slicing thick workpiece of hard and brittle materials which could not be sliced by conventional dicing machines. To achieve high precision and efficiency, the dicing wire saw system adopted tension control and high speed control technologies which provides a maximum wire feeding speed of 2000m/min. In this study, the diamond wire was driven in a single direction at a speed of 750-1750m/min and the slicing force, wire wear and workpiece surface roughness after slicing were investigated experimentally. The results showed that as a new slicing system, the developed dicing wire saw was useable for high-precision slicing of thick workpiece.

Sign in / Sign up

Export Citation Format

Share Document