Thermal and Dielectric Properties of Inorganic-Organic Nanocomposites Involving Epoxy Resin and Polyhedral Oligomeric Silsesquioxanes

2012 ◽  
Vol 476-478 ◽  
pp. 665-669 ◽  
Author(s):  
Li Yang ◽  
Miao Yin ◽  
Xiu Yun Li ◽  
Han Bing Ma
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Functional Groups ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Diglycidyl Ether ◽  
Polyhedral Oligomeric Silsesquioxanes

In this paper, a type of nanoporous polyhedral oligomeric silisesquioxanes (POSS) containing eight functional groups have been synthesized and mixed with diglycidyl ether of bisphenol A (DGEBA) to form epoxy resin networks with nanostructures. The cured octa(aminophenyl) silsesquioxane (1c-POSS) and DGEBA system inherently possesses higher thermal stability and higher char yield than the control epoxy resins. Furthermore, the dielectric constant of the 1c-POSS/DGEBA material (4.36) is substantially lower than that of the neat epoxy resins (4.64) as a consequence the presence of nanoporous POSS cubes in the epoxy matrix.

scholarly journals Sustainable access to fully biobased epoxidized vegetable oil thermoset materials prepared by thermal or UV-cationic processes

RSC Advances ◽  
2020 ◽  
Vol 10 (68) ◽  
pp. 41954-41966 ◽  
Author(s):  
Samuel Malburet ◽  
Chiara Di Mauro ◽  
Camilla Noè ◽  
Alice Mija ◽  
Marco Sangermano ◽  
...  
Keyword(s):  
Bisphenol A ◽  
Epoxy Resin ◽  
Vegetable Oil ◽  
Epoxy Resins ◽  
Diglycidyl Ether

Beyond the need to find a non-toxic alternative to DiGlycidyl Ether of Bisphenol-A (DGEBA), the serious subject of non-epichlorohydrin epoxy resins production remains a crucial challenge that must be solved for the next epoxy resin generations.

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Research on Hybrid UV-Curing G-POSS/Epoxy Resin /Unsaturated Polyester Insulation Nanocomposites

2013 ◽  
Vol 380-384 ◽  
pp. 4344-4347
Author(s):  
Jun Gang Gao ◽  
Gui Xiang Hou
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Electrical Resistivity ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Cationic Polymerization ◽  
Unsaturated Polyester ◽  
Uv Curing ◽  
Curing Process ◽  
Polyhedral Oligomeric Silsesquioxanes

Polyhedral oligomeric silsesquioxanes epoxy resin (G-POSS) was prepared from 2,3-glycidyloxypropyl-trimethoxysilane (GTMS) by hydrolytic condensation. Thermal properties and electrical properties and UV-curing gel rate of G-POSS/epoxy resin (ER)/unsaturated polyester (UP) nanocomposites using diphenyliodide hexafluorophosphate (DPI·PF6) as initiator of curing reaction were investigated. The results showed that curing process of G-POSS/ER/UP is the double hybrid free radical/cationic polymerization. The gel rate of all the samples is more than 90%. G-POSS would decrease the electrical resistivity and increases the dielectric constant of the complex curing materials. Thermal stability is increased with the addition of G-POSS.

The Effect of Octa(Maleimidophenyl)Silsesquioxane on Thermal and Dielectric Properties of Bismaleimide-Triazine Resins

2008 ◽  
Vol 47-50 ◽  
pp. 1161-1164
Author(s):  
Ding Sheng Yu ◽  
Hong Wei Cao ◽  
Ri Wei Xu
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Bisphenol A ◽  
Hybrid Materials ◽  
Polymer Matrix ◽  
Diglycidyl Ether ◽  
Cyanate Ester ◽  
Onset Temperature ◽  
Ft Ir

BT resins composed of 4,4’-bismaleimidodiphenylmethane (BMI) and 2,2’-bis-(4-cyanatophenyl)propane (BCE) were modified by octa(maleimidophenyl) silsesquioxane (OMPS). It was found that the curing reaction of BCE were accelerated by OMPS, and the onset temperature of the cyclotrimerization was reduced up to 95.5°C (by DSC). As demonstrated by DSC and FT-IR, there was no evidence indicated the co-reaction between maleimide and cyanate ester. 2,2’-diallyl bisphenol A (DBA) and diglycidyl ether of bisphenol A (E-51) were also used to enhance the toughness of BT resins, and the formulated BTA and BTE resins were obtained. The results of DMA and TG show that the BT, BTA, and BTE resins containing 1wt% of OMPS exhibit enhanced thermal properties in comparison with pristine BT0, BTA0, and BTE0 resins, while more content of OMPS may impair the polymer matrix, though the effect of OMPS was slight. The dielectric constant of these hybrid materials were reduced by incorporation of OMPS, while overmuch contents of OMPS were disadvantageous for dielectric constant due to the aggregation of OMPS.

Development and Characterisation of a Oxazolidone-Isocyanurate-Urethane Modified Diglycidyl Ether of Bisphenol A Epoxy Resin

1999 ◽  
Author(s):  
K. S. Chian ◽  
S. Yi
Keyword(s):  
Thermal Stability ◽  
Fracture Toughness ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Thermomechanical Behaviour ◽  
Structural Applications ◽  
Chemical Groups ◽  
Mechanical Strengths ◽  
Modified Epoxy

Abstract Epoxy resins are very versatile polymers generally known not only for their adhesive and mechanical strengths but also their inherent thermo-oxidative stability. These properties have been widely exploited in many applications ranging from composites used aerospace components to electronics packaging. However neat epoxy materials suffer from relatively poor strain bearing ability and attempts to improve this brittle behaviour have been an area of many research interests. Toughening of epoxy using elastomers is not new and this is reflected in numerous publications and some have been successfully commercialised. This paper presents a relatively new method of incorporating a rubber modifier into Diglycidyl ether of Bisphenol A (DEGBA) epoxy resin via the formation of an isocyanurate-oxazolidone-urethane structure. The synthesis involves several simultaneous reactions involving the following reactions: (a) epoxide and the isocyanate to form the oxazolidone, (b) trimerisation of the isocyanate to form isocyanurate and (c) isocyanate with polyols to form polyurethane. The synthesis and characterisation of the modified DEGBA resin will be presented. In addition, the effects of rubber content on the thermomechanical behaviour of the cured resin will also be discussed. In summary, it was found that the introduction of the isocyanurate-oxazolidone-urethane chemical groups into the epoxy molecular chain not only enhances the fracture toughness of the final resin but also improves on the thermal stability. This rubber-modified epoxy system shows excellent promise for adhesive and structural applications where thermal stability and fracture toughness are pre-requisites.

High char yields of DOPO/organosilicon-modified epoxy resins and phosphorus–silicon synergism of thermal stability

2018 ◽  
Vol 31 (7) ◽  
pp. 800-809 ◽  
Author(s):  
Jiemin Luo ◽  
Rui Li ◽  
Huawei Zou ◽  
Yang Chen ◽  
Mei Liang
Keyword(s):  
Thermal Stability ◽  
Epoxy Resin ◽  
Ring Opening ◽  
Epoxy Resins ◽  
Diglycidyl Ether ◽  
Nitrogen Atmosphere ◽  
Char Layer ◽  
Air Atmosphere ◽  
Ring Opening Reaction ◽  
Modified Epoxy

The phosphorus/silicon-modified epoxy resin (ED231) was prepared via a two-step reaction process. Firstly, the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO)-modified epoxy was synthesized by ring-opening reaction between DOPO and epoxy resin of diglycidyl ether of bisphenol A (E51). Afterward, the organic silicone intermediate (SY231) was grafted onto the DOPO-modified epoxy to obtain the ED231 product. The thermal stability and thermal–mechanical properties of ED231 systems were characterized by thermogravimetric analysis (TGA) and dynamic mechanical thermal analysis, respectively. TGA results indicated that the phosphorus/silicon-modified epoxy resin (ED231) exhibited high char yields. For example, the solid residue for ED231-40 (5 phr DOPO and 40 phr SY231) at 800°C increased from 16.77% for the pure epoxy resin to 36.25% under nitrogen atmosphere and from 0% to 14.29% under air atmosphere, respectively. Scanning electron microscopy observations suggested that the ED231 systems could form an intact and continuous char layer which could significantly improve the thermal properties.

The Mechanical Properties of Organic Modified Epoxy Resin

2020 ◽  
Vol 43 (3) ◽  
pp. 10-14
Author(s):  
Georgel MIHU ◽  
Claudia Veronica UNGUREANU ◽  
Vasile BRIA ◽  
Marina BUNEA ◽  
Rodica CHIHAI PEȚU ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Materials ◽  
Epoxy Resin ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Mechanical Tests ◽  
Organic Modification ◽  
Three Point Bending ◽  
Modified Epoxy

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.

scholarly journals Effect of Terminal Groups on Thermomechanical and Dielectric Properties of Silica–Epoxy Composite Modified by Hyperbranched Polyester

Polymers ◽  
2021 ◽  
Vol 13 (15) ◽  
pp. 2451
Author(s):  
Jianwen Zhang ◽  
Dongwei Wang ◽  
Lujia Wang ◽  
Wanwan Zuo ◽  
Lijun Zhou ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Binding Energy ◽  
Epoxy Resin ◽  
Volume Fraction ◽  
Epoxy Composite ◽  
Mean Square Displacement ◽  
Mean Square ◽  
Hyperbranched Polyester ◽  
Free Volume Fraction

To study the effect of hyperbranched polyester with different kinds of terminal groups on the thermomechanical and dielectric properties of silica–epoxy resin composite, a molecular dynamics simulation method was utilized. Pure epoxy resin and four groups of silica–epoxy resin composites were established, where the silica surface was hydrogenated, grafted with silane coupling agents, and grafted with hyperbranched polyester with terminal carboxyl and terminal hydroxyl, respectively. Then the thermal conductivity, glass transition temperature, elastic modulus, dielectric constant, free volume fraction, mean square displacement, hydrogen bonds, and binding energy of the five models were calculated. The results showed that the hyperbranched polyester significantly improved the thermomechanical and dielectric properties of the silica–epoxy composites compared with other surface treatments, and the terminal groups had an obvious effect on the enhancement effect. Among them, epoxy composite modified by the hyperbranched polyester with terminal carboxy exhibited the best thermomechanical properties and lowest dielectric constant. Our analysis of the microstructure found that the two systems grafted with hyperbranched polyester had a smaller free volume fraction (FFV) and mean square displacement (MSD), and the larger number of hydrogen bonds and greater binding energy, indicating that weaker strength of molecular segments motion and stronger interfacial bonding between silica and epoxy resin matrix were the reasons for the enhancement of the thermomechanical and dielectric properties.

Thermal Stabilities and the Thermal Degradation Kinetics Study of the Flame Retardant Epoxy Resins

2014 ◽  
Vol 1053 ◽  
pp. 263-267 ◽  
Author(s):  
Xiu Juan Tian
Keyword(s):  
Thermal Stability ◽  
Thermal Degradation ◽  
Flame Retardant ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Degradation Kinetics ◽  
Thermal Degradation Kinetics ◽  
Thermal Stabilities ◽  
Degradation Kinetic ◽  
Modified Epoxy

Thermal stability and thermal degradation kinetics of epoxy resins with 2-(Diphenylphosphinyl)-1, 4-benzenediol were investegated by thermogravimetric analysis (TGA) at different heating rates of 5 K/min, 10 K/min, 20 K/min and 40 K/min. The thermal degradation kinetic mechanism and models of the modified epoxy resins were determined by Coast Redfern method.The results showed that epoxy resins modified with the flame retardant had more thermal stability than pure epoxy resin. The solid-state decomposition mechanism of epoxy resin and the modified epoxy resin corresponded to the controlled decelerating ځ˽̈́˰̵̳͂͆ͅ˼˰̴̱̾˰̸̵̈́˰̵̸̳̱̹̽̾̓̽˰̶̳̹̾̈́̿̾̓ͅ˰̶˸ځ˹˰̵̵͇͂˰̃˸́˽ځ˹2/3. The introduction of phosphorus-containing flame retardant reduced thermal degradation rate of epoxy resins in the primary stage, and promote the formation of carbon layer.

Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane

2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Thermal Polymerization ◽  
Curing Process ◽  
Thermal Stabilities ◽  
Curing Reaction ◽  
Air Atmosphere ◽  
Ft Ir ◽  
Dsc Analyses

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.

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