The Effect of Octa(Maleimidophenyl)Silsesquioxane on Thermal and Dielectric Properties of Bismaleimide-Triazine Resins

2008 ◽  
Vol 47-50 ◽  
pp. 1161-1164
Author(s):  
Ding Sheng Yu ◽  
Hong Wei Cao ◽  
Ri Wei Xu
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Bisphenol A ◽  
Hybrid Materials ◽  
Polymer Matrix ◽  
Diglycidyl Ether ◽  
Cyanate Ester ◽  
Onset Temperature ◽  
Ft Ir

BT resins composed of 4,4’-bismaleimidodiphenylmethane (BMI) and 2,2’-bis-(4-cyanatophenyl)propane (BCE) were modified by octa(maleimidophenyl) silsesquioxane (OMPS). It was found that the curing reaction of BCE were accelerated by OMPS, and the onset temperature of the cyclotrimerization was reduced up to 95.5°C (by DSC). As demonstrated by DSC and FT-IR, there was no evidence indicated the co-reaction between maleimide and cyanate ester. 2,2’-diallyl bisphenol A (DBA) and diglycidyl ether of bisphenol A (E-51) were also used to enhance the toughness of BT resins, and the formulated BTA and BTE resins were obtained. The results of DMA and TG show that the BT, BTA, and BTE resins containing 1wt% of OMPS exhibit enhanced thermal properties in comparison with pristine BT0, BTA0, and BTE0 resins, while more content of OMPS may impair the polymer matrix, though the effect of OMPS was slight. The dielectric constant of these hybrid materials were reduced by incorporation of OMPS, while overmuch contents of OMPS were disadvantageous for dielectric constant due to the aggregation of OMPS.

Thermal and Dielectric Properties of Inorganic-Organic Nanocomposites Involving Epoxy Resin and Polyhedral Oligomeric Silsesquioxanes

2012 ◽  
Vol 476-478 ◽  
pp. 665-669 ◽  
Author(s):  
Li Yang ◽  
Miao Yin ◽  
Xiu Yun Li ◽  
Han Bing Ma
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Functional Groups ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Diglycidyl Ether ◽  
Polyhedral Oligomeric Silsesquioxanes

In this paper, a type of nanoporous polyhedral oligomeric silisesquioxanes (POSS) containing eight functional groups have been synthesized and mixed with diglycidyl ether of bisphenol A (DGEBA) to form epoxy resin networks with nanostructures. The cured octa(aminophenyl) silsesquioxane (1c-POSS) and DGEBA system inherently possesses higher thermal stability and higher char yield than the control epoxy resins. Furthermore, the dielectric constant of the 1c-POSS/DGEBA material (4.36) is substantially lower than that of the neat epoxy resins (4.64) as a consequence the presence of nanoporous POSS cubes in the epoxy matrix.

Preparation and Dielectric Properties of POSS-NH2/Cyanate Ester Resin Organic-Inorganic Hybrids

2011 ◽  
Vol 216 ◽  
pp. 635-639 ◽  
Author(s):  
Zeng Ping Zhang ◽  
Jian Zhong Pei ◽  
Shuan Fa Chen ◽  
Hong Zhao Du ◽  
Yong Wen
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Cyanate Ester ◽  
Cyanate Ester Resin ◽  
Curing Reaction ◽  
Ft Ir ◽  
Different Content

In order to improve the dielectric and overal properties of cyanate ester (CE) resin, a functional POSS monomer(octa(aminopropyl)silsesquioxane, POSS-NH2), was employed to modify CE. A series of POSS-NH2/CE hybrids (CE, CE1, CE2, CE3 and CE4) containing different content of POSS have been prepared by melt casting and then curing. The curing reaction of the resin systems were monitored by FT-IR. Dielectric properties of the hybrids were investigated in detail. FT-IR results showed the almost disappearance of the –OCN for all resin systems, suggesting the complete curing of CE using the experimental curing technique. Dielectric investigation indicates that CE1 which contains 1 wt% of POSS has the best dielectric properties with not only lowest dielectric constant but also lowest dielectric loss.

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.

Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane

2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Thermal Polymerization ◽  
Curing Process ◽  
Thermal Stabilities ◽  
Curing Reaction ◽  
Air Atmosphere ◽  
Ft Ir ◽  
Dsc Analyses

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.

scholarly journals Preparation and Characterization of Green Epoxy Resin Composites and Its Use in Corrosion Resistance

2018 ◽  
Author(s):  
Abbas Hassan Faris
Keyword(s):  
Bisphenol A ◽  
Epoxy Resin ◽  
Electrolyte Solutions ◽  
Kraft Lignin ◽  
Diglycidyl Ether ◽  
Kraft Pulping ◽  
Palm Tree ◽  
Scanning Calorimetry ◽  
Ft Ir ◽  
Nano Titanium Dioxide

In this work, appropriate alternative for diglycidyl ether bisphenol A (DGEBA) was found to avoid the destructive effects of bisphenol A. Lignin, an aromatic compound from palm tree leaves, was used as a renewable material to synthesize a bio-based epoxy resin. Lignin extracted using Kraft pulping process. Kraft Lignin was epoxidized with epichlorohydrin in alkaline medium. Nano-titanium dioxide was used as filler with ratio of 10% to prepare the green epoxy composite. The structure of the Kraft lignin and lignin-based epoxy resin was proven via Infrared spectra (FT-IR) were recorded using solid KBr disk by testing Shimadzu (FT-IR-8300) spectrophotometer. The thermal properties of the curing process of lignin-based epoxy resin and composite were investigate using Differential scanning calorimetry (DSC) analysis. Potentiodynamic measurements data revealed that the anti-corrosion performance of the lignin based epoxy resin. The study demonstrates successful of epoxidation of Kraft lignin. In addition, lignin based eopxy resin showed effective inhibitor for carbon steel in 3.5 wt. % NaCl electrolyte solutions

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Synthesis of a Novel Low Dielectric Constant Fluorine Containing Epoxy

2012 ◽  
Vol 262 ◽  
pp. 448-453 ◽  
Author(s):  
Jian Yong Lv ◽  
Yan Meng ◽  
Li Fan He ◽  
Teng Qiu ◽  
Xiao Yu Li ◽  
...  
Keyword(s):  
Weight Loss ◽  
Dielectric Constant ◽  
Bisphenol A ◽  
Water Absorption ◽  
Diglycidyl Ether ◽  
Dielectric Constants ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Degradation Temperature

A novel fluorine containing epoxy 4-fluoro-4′,4″-diepoxypropoxy triphenyl methane (FDE) was designed and synthesized. The synthesized epoxy was cured by methyl nadic anhydride (MNA) and diglycidyl ether of bisphenol A (DGEBA) was chosen for comparison. Both glass transfer temperature (Tg) and 5% weight loss degradation temperature (Td5%) of cured FDE are over 60°C higher than that of DGEBA. Dielectric constants of the cured FDE at 106 Hz and 107 Hz are 3.09 and 2.91, comparing to 3.50 and 3.24 of the cured DGEBA, respectively. Furthermore, water absorption of the cured FDE is lower than that of DGBEA.

scholarly journals Surface Properties of Poly(Hydroxyurethane)s Based on Five-Membered Bis-Cyclic Carbonate of Diglycidyl Ether of Bisphenol A

Materials ◽  
2020 ◽  
Vol 13 (22) ◽  
pp. 5184
Author(s):  
Mariusz Tryznowski ◽  
Zuzanna Żołek-Tryznowska
Keyword(s):  
Bisphenol A ◽  
Surface Properties ◽  
Rheological Characteristic ◽  
13C Nmr Spectroscopy ◽  
Cyclic Carbonate ◽  
Contact Angles ◽  
Diglycidyl Ether ◽  
Scanning Calorimetry ◽  
Static Contact ◽  
Ft Ir

Poly(hydroxyurethane)s (PHU) are alternatives for conventional polyurethanes due to the use of bis-cyclic dicarbonates and diamines instead of harmful and toxic isocyanates. However, the surface properties of poly(hydroxyurethane)s are not well known. In this work, we focus on the analysis of the surface properties of poly(hydroxyurethane) coatings. Poly(hydroxyurethane)s were obtained by a catalyst-free method from commercially available carbonated diglycidyl ether of bisphenol A (Epidian 6 epoxy resins) and various diamines: ethylenediamine, trimethylenediamine, putrescine, hexamethylenediamine, 2,2,4(2,4,4)-trimethyl-1,6-hexanediamine, m-xylylenediamine, 1,8-diamino-3,6-dioxaoctane, 4,7,10-trioxa-1,13-tridecanediamine, and isophorone diamine, using a non-isocyanate route. The structures of the obtained polymers were confirmed by FT-IR, 1H NMR and 13C NMR spectroscopy, and thermogravimetric (TGA) and differential scanning calorimetry (DSC) analyses were performed. The rheological characteristic of the obtained polymers is presented. The static contact angles of water, diidomethane, and formamide, deposited on PHU coatings, were measured. From the measured contact angles, the surface free energy was calculated using two different approaches: Owens–Wendt and van Oss–Chaudhury–Good. Moreover, the wetting envelopes of PHU coatings were plotted, which enables the prediction of the wetting effect of various solvents. The results show that in the investigated coatings, a mainly dispersive interaction occurs.

The synthesis, photophysical and dielectric properties of ball-type dinuclear zinc phthalocyanine

2012 ◽  
Vol 16 (07n08) ◽  
pp. 826-832 ◽  
Author(s):  
Mevlüde Canlıca ◽  
Ahmet Altındal ◽  
Tebello Nyokong
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Temperature Dependence ◽  
Zinc Phthalocyanine ◽  
Frequency Range ◽  
H Nmr ◽  
Peripheral Position ◽  
Ft Ir ◽  
Polarizability Contribution

The synthesis of ball-type dinuclear Zn(II) phthalocyanine containing four 4,4′-(9H-fluorene-9,9-diyl)diphenol substituents at the non-peripheral position is presented. The structure of the synthesized compound was characterized using elemental analyzes, and UV-vis, FT-IR,1H NMR and mass spectroscopies. The ΦFvalue was 0.16 and ΦTvalue was 0.72. The complex showed reasonably long triplet lifetimes with τT7210 μs in DMSO. The frequency and temperature dependence of the dielectric properties of ZnPc were also investigated in the frequency range of 40–105Hz and in the temperature range of 300–440 °K. It has been observed that both dielectric constant ε′ and dielectric loss ε″ decrease with the rise in frequency as they increase with the rise in temperature. The decrease in ε′ with increasing frequency is attributed to the fact that as the frequency increases, the polarizability contribution from orientation sources decreases and finally disappears.

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