A Preparation Method of Patterned Nanoporous Copper

2013 ◽  
Vol 663 ◽  
pp. 322-325 ◽  
Author(s):  
Heng Yue ◽  
Cong Chun Zhang ◽  
Zhuo Qing Yang ◽  
Hong Wang ◽  
Gui Fu Ding ◽  
...  
Keyword(s):  
Thin Film ◽  
Preparation Method ◽  
Alloy Thin Film ◽  
Fabrication Technique ◽  
Micro Fabrication ◽  
Electro Deposition ◽  
Nanoporous Copper ◽  
Plating Solution ◽  
Alloy Plating ◽  
Precursor Alloy

Graphic nanoporous copper (NPC) was prepared by a new method. Cu68Zn32 and Cu36Zn64 (atomic percentages) precursor alloy thin film was deposited by electro-deposition in acidic alloy plating solution and then dealloyed in hydrochloric acid to fabricate nanoporous copper (NPC) with pore size from 30nm to 100nm. The results show that the microstructure of NPC can be controlled by changing alloy plating solution and dealloying process, this process also maintains compatibility with micro-fabrication technique.

Effect of Surface Property on Transfer-Print of Au Thin-Film to Micro-Structured Substrate

2015 ◽  
Vol 9 (4) ◽  
pp. 411-417 ◽  
Author(s):  
Arata Kaneko ◽  
◽  
Hiromichi Murakami ◽  
Takahiro Yamashita
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Property ◽  
Mechanical Test ◽  
Adhesive Force ◽  
Fabrication Technique ◽  
Micro Fabrication ◽  
Mechanical Structure ◽  
Mechanical Elements ◽  
Effect Of Surface

This present study describes a novel micro-fabrication technique using transfer-print of thin-film for micro-mechanical structure. Some thin-films of Au have been transferred from a stamp onto pre-structured micro-ridges of polymer substrate. These thin-films successfully form into an array of fixed micro-beams as a mechanical structure. The fabricated micro-beams typically have a thickness of less than 100 nm and a tens micro-meter long. This present paper also reports an investigation about effects of stamp surface properties. A modification of stamp surface wettability and roughness improves adhesive force (releasability) of thin-film to provide flat micro-beam without undesired deformations. Hydrophobic stamp with micro-roughness results in an increase of production yield of micro-beams to reach more than 90%. Simple mechanical test shows that the fabricated micro-beam is transversely tensioned by the supporting micro-ridges of substrate. It is clarified that the proposed process can be applied to fabricate micro/nano-mechanical elements.

Fabrication and Performance Investigation of Karma Alloy Thin Film Strain Gauge

2021 ◽  
Author(s):  
Peng Lei ◽  
Congchun Zhang ◽  
Yawen Pang ◽  
Shenyong Yang ◽  
Meiju Zhang
Keyword(s):  
Thin Film ◽  
Strain Gauge ◽  
Alloy Thin Film ◽  
And Performance

Optimum Growth Conditions of Ge–Sb–Te Alloy Thin Film Investigated by Ellipsometry

2004 ◽  
Vol 43 (3) ◽  
pp. 1006-1012 ◽  
Author(s):  
Sung Hyuck An ◽  
Xuezhe Li ◽  
Sang Youl Kim
Keyword(s):  
Thin Film ◽  
Growth Conditions ◽  
Alloy Thin Film ◽  
Optimum Growth

The Influences of the Plating’s Hardness, Abrasion and Antifriction Property Caused by the Adding of Nano- Al2O3 and PTFE

2012 ◽  
Vol 557-559 ◽  
pp. 1683-1686 ◽  
Author(s):  
Xiao Feng Xu ◽  
Wen Bin Yao ◽  
Jiu Hua Xu ◽  
Wei Zhang ◽  
Lin Yang ◽  
...  
Keyword(s):  
Wear Resistance ◽  
Antifriction Property ◽  
Chemical Plating ◽  
Composite Plating ◽  
Plating Solution ◽  
Alloy Plating

Composite plating Ni-P-PTFE- nano- Al2O3was made by adding nano-scaled Al2O3and PTFE into chemical plating Ni-P alloy plating solution. The influences of the plating material’s hardness, abrasion and antifriction property caused by the additive amount of nano- Al2O3and PTFE were studied in the paper. The results indicate that the composite plating’s hardness, wear resistance and antifriction can be greatly improved by adding nano- Al2O3and PTFE into it.

A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

2005 ◽  
Vol 297-300 ◽  
pp. 521-526
Author(s):  
Insu Jeon ◽  
Masaki Omiya ◽  
Hirotsugu Inoue ◽  
Kikuo Kishimoto ◽  
Tadashi Asahina
Keyword(s):  
Thin Film ◽  
The Finite Element Method ◽  
Si Substrate ◽  
Detailed Structure ◽  
Micro Fabrication ◽  
Interfacial Toughness ◽  
Linear Elastic ◽  
Elastic Fracture ◽  
Cu Thin Film ◽  
Research Show

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

Overcoats and Lubrication for Thin Film Disks

MRS Bulletin ◽  
1990 ◽  
Vol 15 (3) ◽  
pp. 45-52 ◽  
Author(s):  
A.M. Homola ◽  
C.M. Mate ◽  
G.B. Street
Keyword(s):  
Thin Film ◽  
Data Storage ◽  
Magnetic Particles ◽  
Areal Density ◽  
Magnetic Film ◽  
Alloy Thin Film ◽  
Magnetic Media ◽  
Disk Interface ◽  
Storage Devices ◽  
Particulate Media

Metallic alloy thin film media and ever decreasing head-to-media spacing make severe demands on storage devices. Decreasing head-to-media separation is critical for high storage densities but it also leads to increased slider-disk interactions, which can cause slider and disk wear or even head crashes. Wear can also occur when drives start and stop when the slider contacts the disk at relatively high speeds. The reliability and durability of thin film disks, which provide much higher areal density than conventional oxide disks with particulate media, are achieved by the use of very thin overcoat materials and surface lubricants. This article summarizes the approaches taken in the industry to enhance the tribological performance of magnetic media, with special emphasis on the basic understanding of the processes occurring at the slider-disk interface.The continuous rise in the demand for storage capacity at a competitive price is the prime motivator of the changes we have seen in the data storage industry. It is clearly stimulating the present move away from particulate media, which has long dominated all fields of data storage, i.e., tape, rigid, and flexible disks, to the thin film storage media. Particulate storage devices use magnetic media formulated by dispersing magnetic particles, usually iron oxides, in an organic binder. In thin film storage devices, the storage medium is a continuous magnetic film, usually a cobalt alloy, made either by sputtering or by electroless plating.

A Real Time Electrochemical Analysis of Co-Sputtered (Co-Cr) and (Co-Cr-Mo) Alloy Thin Film Libraries in Ringer’s Solution at 37 oc

2021 ◽  
Vol MA2021-01 (18) ◽  
pp. 797-797
Author(s):  
Shaukat Ali Lone ◽  
Cezarina Cela Mardare ◽  
Andrei Ionut Mardare ◽  
Achim Walter Hassel
Keyword(s):  
Thin Film ◽  
Real Time ◽  
Electrochemical Analysis ◽  
Alloy Thin Film ◽  
Ringer’S Solution
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