Research of Micro-Abrasive Suspension Jet Erosion Morphology and Material Removal Mechanism

2013 ◽  
Vol 797 ◽  
pp. 79-84 ◽  
Author(s):  
Zhuo Luo ◽  
Cheng Yong Wang ◽  
Rong Juan Wang
Keyword(s):  
Material Removal ◽  
Incident Angle ◽  
Precision Machining ◽  
Work Piece ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Blade Shape ◽  
Impact Angles ◽  
Abrasive Suspension

This paper introduces the micro-abrasive suspension jet polishing technology in precision machining technology. In order to understand the micro-abrasive suspension jet erosion morphology and material removal mechanism, the erosion experiments of micro-abrasive suspension jet on 40CrMnMo7 special steel work-piece were taken. We found that when the incident angles are 90°, 60°, 30°, the polishing area is respectively annular shape, horseshoe shape and blade shape. During the erosion process, as the incident angle becomes smaller, most amounts of abrasive particles impact angles will also be small, and these cause more material removal. When the particles impact the work-piece with small angles, most particles play shearing action on the work-piece and leave the work-piece nanoscale scratches; while the particles impact the work-piece at large angles, extrusion and blow are formed by the majority of the particles on the work-piece, leaving different small size pits.

Modeling of Material Removal Mechanism in Micro Electric Discharge Milling of Ti-6Al-4V

2014 ◽  
Vol 592-594 ◽  
pp. 516-520 ◽  
Author(s):  
Basil Kuriachen ◽  
Jose Mathew
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Milling Process ◽  
Work Piece ◽  
Machining Parameters ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Electric Discharge Milling

Micro EDM milling process is accruing a lot of importance in micro fabrication of difficult to machine materials. Any complex shape can be generated with the help of the controlled cylindrical tool in the pre determined path. Due to the complex material removal mechanism on the tool and the work piece, a detailed parametric study is required. In this study, the influence of various process parameters on material removal mechanism is investigated. Experiments were planned as per Response Surface Methodology (RSM) – Box Behnken design and performed under different cutting conditions of gap voltage, capacitance, electrode rotation speed and feed rate. Analysis of variance (ANOVA) was employed to identify the level of importance of machining parameters on the material removal rate. Maximum material removal rate was obtained at Voltage (115V), Capacitance (0.4μF), Electrode rotational Speed (1000rpm), and Feed rate (18mm/min). In addition, a mathematical model is created to predict the material removal

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

1722 Study on material removal mechanism in SiO_2-CMP : Adsorption characteristics of abrasive particles in SiO_2-CMP

2012 ◽  
Vol 2012.18 (0) ◽  
pp. 509-510
Author(s):  
Akiho TANAKA ◽  
Keisuke SUZUKI ◽  
Panart KHAJORNRUNGRUANG ◽  
Yuichi TAKANO ◽  
Keiichi KIMURA
Keyword(s):  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Adsorption Characteristics

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision
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