Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

2014 ◽  
Vol 925 ◽  
pp. 96-100
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Uda Hashim ◽  
Aaron Koay Terr Yeow ◽  
Steven Taniselass ◽  
...  
Keyword(s):  
Electroless Nickel ◽  
Bath Temperature ◽  
Gold Wire ◽  
Process Time ◽  
Reflow Process ◽  
Bump Height ◽  
Electroless Nickel Immersion Gold ◽  
Solder Bumps ◽  
Higher Temperature ◽  
Bond Pads

Conventional gold wire bonding to alunimium bond pads leads to the formation of intermetallic compound. Electroless Nickel Immersion Gold (ENIG) has been proposed as surface finish for aluminium bond pads to improve high temperature reliability. In order to create acceptable solder bumps prior to reflow process, a particular bump height for ENIG bumps need to be obtained. This paper reports the effects of chemical bath temperature in response to the bump height using a shorter process time. Analysis was done by using a design of experiment (DOE). The results suggest that higher temperature increases the bump height. Electroless nickel temperature has more influence to the bump height compared to immersion gold temperature.

Effect of High Temperature during Electroless Nickel Process

2014 ◽  
Vol 925 ◽  
pp. 88-91
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Uda Hashim ◽  
Rajendaran Vairavan ◽  
Aaron Koay Terr Yeow ◽  
...  
Keyword(s):  
Electroless Nickel ◽  
Process Time ◽  
Reflow Process ◽  
Bump Height ◽  
Factors Analysis ◽  
Solder Bumps ◽  
Two Factors ◽  
Electroless Process ◽  
Main Effects ◽  
Full Factorial

This paper presents the correlation between electroless process time, immersion gold process time and the bump height in electroless nickel immersion gold (ENIG). A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 100 °C. It can be concluded that electroless nickel time has more influence to the bump height compared to immersion gold time.

Bump Height at Low Temperature Analysis

2013 ◽  
Vol 404 ◽  
pp. 77-81
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Fairul Afzal Ahmad Fuad ◽  
Phaklen Ehkan ◽  
Steven Taniselass
Keyword(s):  
Electroless Nickel ◽  
Process Time ◽  
Reflow Process ◽  
Bump Height ◽  
Factors Analysis ◽  
Solder Bumps ◽  
Two Factors ◽  
Electroless Process ◽  
Main Effects ◽  
Full Factorial

The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70 °C. Electroless nickel time has more influence to the bump height compared to immersion gold time.

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

2014 ◽  
Vol 896 ◽  
pp. 660-663
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Phaklen Ehkan ◽  
Fairul Afzal Ahmad Fuad ◽  
Aaron Koay Terr Yeow
Keyword(s):  
Design Of Experiment ◽  
Flip Chip ◽  
Electroless Nickel ◽  
Bump Height ◽  
Process Robustness ◽  
Electroless Nickel Immersion Gold ◽  
Optimization Of Process Parameters ◽  
Chip Technology ◽  
Higher Temperature

Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

Effect of solder bump geometry on the microstructure of Sn–3.5 wt% Ag on electroless nickel immersion gold during solder dipping

2005 ◽  
Vol 20 (3) ◽  
pp. 649-658 ◽  
Author(s):  
Zhiheng Huang ◽  
Paul P. Conway ◽  
Changqing Liu ◽  
Rachel C. Thomson
Keyword(s):  
Printed Circuit Board ◽  
Solder Bump ◽  
Dissolution Kinetics ◽  
Electroless Nickel ◽  
Bulk Solder ◽  
Circuit Board ◽  
Service Reliability ◽  
Electroless Nickel Immersion Gold ◽  
Solder Microstructure ◽  
Bond Pads

Continuous miniaturization of solder joints in high-density packaging makes it important to study how the joint size could affect the solder microstructure and thereby the subsequent in-service reliability. In this study, a printed circuit board with electroless nickel immersion gold (i.e., Au/Ni–P) over Cu bond pads of size approximately ∼80 μm and ∼1500 μm in diameter was dipped into a Sn–3.5Ag solder bath. The study shows that the smaller bumps, which cool more quickly, include much finer Ag3Sn particles. In addition, substantial differences in the thickness of the interfacial intermetallics and the microstructure for different dipping times are observed for different bump sizes. The results from a combined thermodynamic–kinetic model also suggest that the solder bump geometry can influence the dissolution kinetics of the pad metal into the molten solder and therefore the microstructure at the solder-pad interface and within the bulk solder.

Reliability of electronics assembled using SAC + Zn solder pastes

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000051-000057 ◽  
Author(s):  
H.R. Kotadia ◽  
A. Panneerselvam ◽  
M.A. Green ◽  
M.P. Clode ◽  
S.H. Mannan ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Electroless Nickel ◽  
Temperature Cycling ◽  
Solder Paste ◽  
Reflow Process ◽  
Reliable Operation ◽  
Interfacial Imcs ◽  
Electroless Nickel Immersion Gold ◽  
Reliability Of Electronics ◽  
Sac Solder

A method of preparing SAC solder with addition of 1.0-1.5wt.% Zn to Sn-3.8Ag-0.7Cu solder alloy such that a standard solder paste reflow process results in good soldering is described. Solder-substrate couples were aged at 150°C for 1000h, and results on temperature cycling (−20 to 175°C) and shear testing of solder joints is also described. The added Zn segregated to the interfacial IMCs so that Cu6Sn5 became (Cu,Zn)6Sn5 and (Cu,Ni)6Sn5 became (Cu,Ni,Zn)6Sn5. The reliability of assemblies utilizing Electroless Nickel Immersion Gold (ENIG) using the Zn enhanced solder is compared to that of standard SAC solder alloy for potentially reliable operation at temperature up to 185°C.

Relationship between Controllable Process Parameters on Bump Height in ENIG

2013 ◽  
Vol 404 ◽  
pp. 62-66
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Fairul Afzal Ahmad Fuad ◽  
Phaklen Ehkan ◽  
Muhamad Hafiz Ab Aziz
Keyword(s):  
Process Parameters ◽  
Design Of Experiment ◽  
Electroless Nickel ◽  
Critical Issue ◽  
Process Variables ◽  
Soldering Process ◽  
Bump Height ◽  
Electroless Nickel Immersion Gold ◽  
Controllable Process

This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a certain quality and requirements of bump height needs to be achieved prior to reflow oven soldering process. A total of four controllable process variables, with 16 sets of experiments were studied using a systematically designed design of experiment (DOE). The result suggests that the electroless nickel bath time has the most significant effect on the formation on bump height and consequently provide larger area for conductivity.

Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire Bonding

2010 ◽  
Vol 2010 (1) ◽  
pp. 000675-000681 ◽  
Author(s):  
Mustafa Oezkoek ◽  
Hugh Roberts ◽  
Joe McGurran
Keyword(s):  
Physical Properties ◽  
Electroless Nickel ◽  
Gold Wire ◽  
Wire Bonding ◽  
Electroless Nickel Immersion Gold ◽  
Surface Finishes ◽  
Gold Thickness ◽  
Palladium Surface ◽  
Joint Integrity ◽  
Pure Palladium

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows the benefits of using a pure palladium layer in ENEPIG and ENEP (Electroless Nickel / Electroless Palladium) surface finishes in terms of physical properties and in terms of gold wire bonding and solder joint integrity.

Effect of copper incorporation on phase transformation behavior of electroless nickel–phosphorous coating and its effect on the tribological behavior

2020 ◽  
pp. 146442072098160
Author(s):  
Abhijit Biswas ◽  
Suman Kalyan Das ◽  
Prasanta Sahoo
Keyword(s):  
Heat Treatment ◽  
Phase Transformation ◽  
Tribological Behavior ◽  
Electroless Nickel ◽  
Two Phase ◽  
Microstructural Changes ◽  
Treatment Conditions ◽  
Heat Treated ◽  
Higher Temperature ◽  
Effect Of Copper

The microstructural changes of electroless Ni–P–Cu coating at various heat-treatment conditions are investigated to understand its implications on the tribological behavior of the coating. Coatings are heat-treated at temperatures ranging between 200°C and 800 °C and for 1–4 h duration. Ni–P–Cu coatings exhibit two-phase transformations in the temperature range of 350–450 °C and the resulting microstructural changes are found to significantly affect their thermal stability and tribological attributes. Hardness of the coating doubles when heat-treated at 452 °C, due to the formation of harder Ni3P phase and crystalline NiCu. Better friction and wear performance are also noted upon heat treatment of the coating at the phase transformation regime, particularly at 400 °C. Wear mechanism is characterized by a mixed adhesive cum abrasive wear phenomena. Heat treatment at higher temperature (600 °C and above) and longer duration (4 h) results in grain coarsening phenomenon, which negatively influences the hardness and tribological characteristics of the coating. Besides, diffusion of iron from the ferrous substrate as well as greater oxide formation are noticed when the coating is heat-treated at higher temperatures and for longer durations (4 h).

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