Wettability, Surface Tension and Work of Adhesion of Cu-Ti Alloys on Yttria Partially-Stabilized Zirconia at 1273K
The wetting behavior of molten Cu-Ti alloys with titanium content of 10mass%, 20mass% and 30mass% on the Yttria Partially-Stabilized Zirconia (Y-PSZ) substrates was investigated at 1273K using the sessile drop method. The wettability improved with increasing the titanium content of the alloy. The stabilized contact angles of Cu-10mass%Ti, Cu-20mass%Ti and Cu-30mass%Ti alloys on the Y-PSZ substrate were measured to be 69°, 47°and 30°, respectively. The surface tension of the molten Cu-Ti alloys and the work of adhesion of alloy/substrate interface increased with increasing the titanium content. A larger work of adhesion attributes to firmer bonding between the molten Cu-Ti alloy and the Y-PSZ substrate, and can greatly improve the wettability.