A Life Prediction Model for Nickel-Base Single Crystal Superalloy DD3

2004 ◽  
Vol 261-263 ◽  
pp. 1123-1128 ◽  
Author(s):  
T. Li ◽  
Zhu Feng Yue
Keyword(s):  
Prediction Model ◽  
Single Crystal ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Hold Time ◽  
Turbine Blades ◽  
Single Crystal Superalloy ◽  
Main Factors ◽  
Nickel Base ◽  
Life Prediction Model

The possibility of the life prediction model for nickel-base single crystal blades has been studied. The fatigue-creep (FC) and thermal fatigue-creep (TMFC) as well as creep experiments have been carried out with different hold time of DD3. The hold time and the frequency as well as the temperature range are the main factors influencing on the life. An emphasis has been put on the micro mechanism of the rupture of creep, FC and TMFC. Two main factors are the voiding and degeneration of the material for the creep, FC and TMFC experiments. There are voids in the fracture surfaces, and size of the voids is dependent on the loading condition. Generally, the rupture mechanism is the same for creep, FC and TMFC. If the loading can be simplified to the working conditions of the turbine blades, i.e. the hold time is at the top temperature and maximum stress, a linear life model is satisfactory to the life prediction of nickel-base single crystal superalloy from the experimental study in this paper. The temperature and the stress level of the nickel-base single crystal (SC)blades are not uniform. To predict the life of SC blades, one should consider the cycles of the temperature and stress as well as the oxidation simultaneously. In the past 30 years, there are many works on the mechanical behavior and description, such as the inelastic constitutive relationships, plastic, fracture, isothermal creep and fatigue and thermal fatigue as well as oxidation[1-3]. There are also special software (program) to analyze the deformation and life of nickel-base single crystal structures, such as blades. In order to apply to the engineering more conveniently, there should be a life prediction model for the blades. The model should not be too complex, but take more influential factors as possible into consideration.

A Life Prediction Model for Single-Crystal Nickel-Base Alloys Under Low-Cycle Fatigue

2020 ◽  
Author(s):  
Firat Irmak ◽  
Navindra Wijeyeratne ◽  
Taejun Yun ◽  
Ali Gordon
Keyword(s):  
Single Crystal ◽  
Gas Turbine ◽  
Life Prediction ◽  
Low Cycle Fatigue ◽  
Turbine Blades ◽  
Deformation Model ◽  
Cycle Fatigue ◽  
Nickel Base Superalloys ◽  
Nickel Base ◽  
Prediction Approach

Abstract In the development and assessment of critical gas turbine components, simulations have a crucial role. An accurate life prediction approach is needed to estimate lifespan of these components. Nickel base superalloys remain the material of choice for gas turbine blades in the energy industry. These blades are required to withstand both fatigue and creep at extreme temperatures during their usage time. Nickel-base superalloys present an excellent heat resistance at high temperatures. Presence of chromium in the chemical composition makes these alloys highly resistant to corrosion, which is critical for turbine blades. This study presents a flexible approach to combine creep and fatigue damages for a single crystal Nickel-base superalloy. Stress and strain states are used to compute life calculations, which makes this approach applicable for component level. The cumulative damage approach is utilized in this study, where dominant damage modes are capturing primary microstructural mechanism associated with failure. The total damage is divided into two distinctive modules: fatigue and creep. Flexibility is imparted to the model through its ability to emphasize the dominant damage mechanism which may vary among alloys. Fatigue module is governed by a modified version of Coffin-Manson and Basquin model, which captures the orientation dependence of the candidate material. Additionally, Robinson’s creep rupture model is applied to predict creep damage in this study. A novel crystal visco-plasticity (CVP) model is used to simulate deformation of the alloy under several different types of loading. This model has capability to illustrate the temperature-, rate-, orientation-, and history-dependence of the material. A user defined material (usermat) is created to be used in ANSYS APDL 19.0, where the CVP model is applied by User Programmable Feature (UPF). This deformation model is constructed of a flow rule and internal state variables, where the kinematic hardening phenomena is captured by back stress. Octahedral, cubic and cross slip systems are included to perform simulations in different orientations. An implicit integration process that uses Newton-Raphson iteration scheme is utilized to calculate the desired solutions. Several tensile, low-cycle fatigue (LCF) and creep experiments were conducted to inform modeling parameters for the life prediction and the CVP models.

scholarly journals A Fatigue Life Prediction Model Based on Modified Resolved Shear Stress for Nickel-Based Single Crystal Superalloys

Metals ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 180 ◽  
Author(s):  
Jialiang Wang ◽  
Dasheng Wei ◽  
Yanrong Wang ◽  
Xianghua Jiang
Keyword(s):  
Shear Stress ◽  
Fatigue Life ◽  
Prediction Model ◽  
Single Crystal ◽  
Life Prediction ◽  
Stress Amplitude ◽  
Damage Parameter ◽  
Fatigue Life Prediction ◽  
Model Based ◽  
Life Prediction Model

In this paper, the viewpoint that maximum resolved shear stress corresponding to the two slip systems in a nickel-based single crystal high-temperature fatigue experiment works together was put forward. A nickel-based single crystal fatigue life prediction model based on modified resolved shear stress amplitude was proposed. For the four groups of fatigue data, eight classical fatigue life prediction models were compared with the model proposed in this paper. Strain parameter is poor in fatigue life prediction as a damage parameter. The life prediction results of the fatigue life prediction model with stress amplitude as the damage parameter, the fatigue life prediction model with maximum resolved shear stress in 30 slip directions as the damage parameter, and the McDiarmid (McD) model, are better. The model proposed in this paper has higher life prediction accuracy.

Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

2007 ◽  
Author(s):  
T. E. Wong ◽  
C. Chu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Temperature Cycling ◽  
Test Results ◽  
Electronic Package ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simplified method was developed to determine the fatigue life of a ceramic column grid array (CCGA) solder joint when exposed to thermal environments. The CCGA package with 90Pb/10Sn solder columns is soldered onto the printed circuit board with a tin-lead solder paste. Failure of the solder joint occurs at the CCGA solder column. A closed-form solution with the equilibrium of displacements of electronic package assembly was first derived to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CCGA test results, obtained from various sources, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 625- and 1657-pin CCGA test results, which were cycled between 20°C/90°C, 0°C/100°C, −55°C/110°C, or −55°C/125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by a finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to make a preliminarily estimate at the CCGA solder joint thermal fatigue life. It is also recommended to 1) select more study cases with various solder joint configurations, package sizes, environmental profiles, etc. to further calibrate this life prediction model, 2) use this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seeking an optimum design, and 3) develop a similar life prediction model for lead-free solder materials.

Life Prediction Modeling of Combined High-Cycle Fatigue and Creep

2020 ◽  
Author(s):  
Thomas Bouchenot ◽  
Kirtan Patel ◽  
Ali P. Gordon ◽  
Sachin Shinde
Keyword(s):  
Prediction Model ◽  
Turbine Blade ◽  
Life Prediction ◽  
High Cycle Fatigue ◽  
Prediction Models ◽  
Turbine Blades ◽  
Operating Conditions ◽  
Test Method ◽  
Cycle Fatigue ◽  
Life Prediction Model

Abstract Industrial gas turbine blades are subjected to high temperatures and an array of mechanical and dynamic loads, making creep and high-cycle fatigue critical aspects of turbine blade design. The combination of creep and high-cycle fatigue produces a synergistic interaction effect whose explicit consequence to turbine life has been the subject of very little research. This interaction remains unaccounted for by current, decoupled life prediction models, which traditionally incorporate such interactions into conservative design safety factors. Improved lifing models capable of capturing these effects are now needed in order to maintain current reliability standards in next-generation operating conditions. This research identifies the life-limiting aspect of a combined high-cycle fatigue and creep response in conventionally cast Alloy 247 LC, and captures the interaction of the two loads in a novel life prediction model. The proposed model is created from a comprehensive collection of experimental data obtained using an unconventional two-part test method, where test specimens pre-deformed to a prescribed creep strain are fatigue loaded at an elevated temperature and high frequency until failure. A variety of temperatures, creep strains, and fatigue loading conditions are explored to ensure that the resulting model is applicable to the myriad of potential turbine blade operating conditions. Rigorous metallographic assessments accompanying each test are leveraged to create a microstructurally-informed combined life prediction model.

CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method

2003 ◽  
Author(s):  
T. E. Wong ◽  
C. Y. Lau ◽  
H. S. Fenger
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Test Results ◽  
Electronic Package ◽  
Eutectic Solder ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic solder on both top and bottom of the ball. Failure of the solder joint occurs at the eutectic solder. A closed-form solution with the equilibrium of displacements of electronic package assembly was first developed to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CBGA test results, obtained from Motorola, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 255- and 304-pin CBGA test results, which were cycled between 0°C and 100°C or −40°C and 125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to preliminarily estimate the CBGA solder joint thermal fatigue life.

scholarly journals GA-BP in Thermal Fatigue Failure Prediction of Microelectronic Chips

Electronics ◽  
2019 ◽  
Vol 8 (5) ◽  
pp. 542 ◽  
Author(s):  
Zhongying Han ◽  
Xiaoguang Huang
Keyword(s):  
Genetic Algorithm ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Hybrid Genetic Algorithm ◽  
Back Propagation ◽  
Fem Analysis ◽  
Bp Network ◽  
Searching Ability ◽  
Life Prediction Model

A thermal fatigue life prediction model of microelectronic chips based on thermal fatigue tests and solder/substrate interfacial singularity analysis from finite element method (FEM) analysis is established in this paper. To save the calculation of interfacial singular parameters of new chips for life prediction, and improve the accuracy of prediction results in actual applications, a hybrid genetic algorithm–artificial neural network (GA–ANN) strategy is utilized. The proposed algorithm combines the local searching ability of the gradient-based back propagation (BP) strategy with the global searching ability of a genetic algorithm. A series of combinations of the dimensions and thermal mechanical properties of the solder and the corresponding singularity parameters at the failure interface are used to train the proposed GA-BP network. The results of the network, together with the established life prediction model, are used to predict the thermal fatigue lives of new chips. The comparison between the network results and thermal fatigue lives recorded in experiments shows that the GA-BP strategy is a successful prediction technique.

Thermal fatigue behavior of a nickel-base single crystal superalloy DD5 with secondary orientation

2018 ◽  
Vol 5 (10) ◽  
pp. 106516 ◽  
Author(s):  
Jinjuan Lv ◽  
Andong Wang ◽  
Caifeng Chen ◽  
Weitai Xu ◽  
Luxiang Zhang
Keyword(s):  
Single Crystal ◽  
Thermal Fatigue ◽  
Fatigue Behavior ◽  
Single Crystal Superalloy ◽  
Thermal Fatigue Behavior ◽  
Nickel Base
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