Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

2008 ◽  
Vol 389-390 ◽  
pp. 18-23
Author(s):  
Jian Qiang Guo ◽  
Hitoshi Ohmori ◽  
Kazutoshi Katahira ◽  
Yoshihiro Uehara
Keyword(s):  
Comparative Study ◽  
Material Removal ◽  
Ground Surface ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
Dressing Method ◽  
The Difference ◽  
Induced Defects

Ceramics has many advantages that cannot be substituted by metals, but its machining induced defects, such as crack and crater, are the obstacle of using ceramics in engineering. Thus, the further studies on the materials removal mechanism of ceramics should be done. As known, the cutting theory of metals is very successful and it is helpful to understand the material removal mechanism of ceramics. Through doing comparative experiments, the material removal mechanism of ceramics may be more deeply ascertained. Four types of material, such as ZrO2, SiC, STAVAX and SKD11, were ground by ELID (ELectrolytic In-process Dressing) method in this study. The grinding forces, roughness and topography of the ground surface were investigated. On the basis of this experiment, the difference of material removal mechanism between ceramics and steels was explained.

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

Force and Energy in Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels

2011 ◽  
Vol 487 ◽  
pp. 80-83
Author(s):  
Shu Sheng Li ◽  
Jiu Hua Xu ◽  
Y.C. Fu ◽  
H.J. Xu
Keyword(s):  
Material Removal ◽  
Chip Thickness ◽  
Ground Surface ◽  
Morphological Features ◽  
Removal Mechanism ◽  
Zirconia Ceramics ◽  
Grinding Forces ◽  
Thickness Change ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms

An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.

scholarly journals Experimental Research on Material Removal Mechanism and Grinding Force of FeCoNiCrMo0.1 High Entropy Alloy (HEA)

2021 ◽  
Author(s):  
Ruchu Xu ◽  
Xuelong Wen ◽  
Yadong Gong ◽  
Xingchen Yu
Keyword(s):  
Material Removal ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Entropy Alloy ◽  
Force Model ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
High Entropy ◽  
Cbn Grinding Wheel

Abstract High entropy alloy (HEA) is an advanced alloy material, which has a wide application prospect due to its excellent properties. However, the material removal mechanism and change rule of grinding force of HEA in the grinding process have seldom been studied. The main work of this paper is that the material removal mechanism of the FeCoNiCrMo0.1 HEA is obtained by analyzing grinding debris and subsurface microstructure after grinding, the theoretical grinding force model of HEAs in plane grinding process is established on the basis of the force of a single abrasive grain, and the experimental verification is performed. According to the experimental results, the influences of different grinding parameters on grinding force are discussed, the influences of different types of grinding wheels on grinding force are analyzed, and the grinding forces generated by grinding different FeCoNiCr HEAs are compared. The results indicate that the material removal mechanism of FeCoNiCrMo0.1 HEA is the plastic removal. With the increase of grinding speed and the decrease of grinding depth and feed speed, both normal and tangential grinding forces decrease. Under the same grinding parameters, the grinding force produced by electroplated CBN grinding wheel is greater, followed by resin-bonded CBN grinding wheel and vitrified CBN grinding wheel. The grinding force produced by grinding FeCoNiCrAl0.1 HEA is lower than that produced by grinding FeCoNiCrMo0.1 HEA under the same grinding conditions. The calculated value of grinding force model is consistent with the experimental value, which can scientifically reflect the variation law of HEA grinding force.

Research on the Topography Features of the Densely Bonded Diamond Grinding Wheel Dressed by Elliptical Ultrasonic Vibration

2011 ◽  
Vol 188 ◽  
pp. 330-335
Author(s):  
Bo Zhao ◽  
C.Y. Zhao ◽  
G.F. Gao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Bonding Agent ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Wheel Surface ◽  
Dressing Method ◽  
Diamond Grinding Wheel ◽  
Abrasive Grains

In this paper, on the influence of different dressing methods, such as elliptical ultrasonic vibration, on the grinding wheel bonded delta, the morphology of abrasive grains of wheel, the protrusion height and the grinding wheel topography was studied by experiment. The experiment shows that the abrasive grains of grinding wheel surface dressed by elliptical ultrasonic vibration are great in protrusion height and trench depth, and the bonded delta grain after grinding is narrow, short, and irregular with significant reduced semi-surrounded area compared with by ordinary dressing method. The abrasive grains of metal-bonded diamond grinding wheel surface dressed by elliptical ultrasonic vibration are basically intact, and due to the high-speed collision between abrasive grains, local micro-break is easy to occur on the abrasive grains to form multiple micro-cutting edges. The abrasive grains of grinding wheel surface dressed by ordinary dressing method are fractured and broken, while that of resin-bonded grinding wheel surface have a high ratio to be loose and shedding. For the metal or resin-bonded grinding wheel surface dressed by elliptical ultrasonic vibration, its material removal mechanism may primarily be the removal of bonding ductility and the fine-crushing of abrasive grains; for the metal-bonded grinding wheel surface dressed by ordinary method, its material removal mechanism may primarily be the fracture and break of abrasive grains, secondly be the fracture of bonding agent; and for the resin-bonded grinding wheel surface, its material removal mechanism may mainly be the looseness and shedding of abrasive grains caused by the fracture of bonding agent, secondly be the fracture of abrasive grains. Compared with ordinary dressing method, elliptical ultrasonic vibration dressed abrasive grains are dense at shaft and sparse in periphery, with a large quantity of static effective abrasive grains, great protrusion height and an excellent nature of contour.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision
Sign in / Sign up

Export Citation Format

Share Document