scholarly journals Experimental Research on Material Removal Mechanism and Grinding Force of FeCoNiCrMo0.1 High Entropy Alloy (HEA)

2021 ◽  
Author(s):  
Ruchu Xu ◽  
Xuelong Wen ◽  
Yadong Gong ◽  
Xingchen Yu
Keyword(s):  
Material Removal ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Entropy Alloy ◽  
Force Model ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
High Entropy ◽  
Cbn Grinding Wheel

Abstract High entropy alloy (HEA) is an advanced alloy material, which has a wide application prospect due to its excellent properties. However, the material removal mechanism and change rule of grinding force of HEA in the grinding process have seldom been studied. The main work of this paper is that the material removal mechanism of the FeCoNiCrMo0.1 HEA is obtained by analyzing grinding debris and subsurface microstructure after grinding, the theoretical grinding force model of HEAs in plane grinding process is established on the basis of the force of a single abrasive grain, and the experimental verification is performed. According to the experimental results, the influences of different grinding parameters on grinding force are discussed, the influences of different types of grinding wheels on grinding force are analyzed, and the grinding forces generated by grinding different FeCoNiCr HEAs are compared. The results indicate that the material removal mechanism of FeCoNiCrMo0.1 HEA is the plastic removal. With the increase of grinding speed and the decrease of grinding depth and feed speed, both normal and tangential grinding forces decrease. Under the same grinding parameters, the grinding force produced by electroplated CBN grinding wheel is greater, followed by resin-bonded CBN grinding wheel and vitrified CBN grinding wheel. The grinding force produced by grinding FeCoNiCrAl0.1 HEA is lower than that produced by grinding FeCoNiCrMo0.1 HEA under the same grinding conditions. The calculated value of grinding force model is consistent with the experimental value, which can scientifically reflect the variation law of HEA grinding force.

scholarly journals Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1918
Author(s):  
Dongpo Wang ◽  
Shouxiang Lu ◽  
Dong Xu ◽  
Yuanlin Zhang
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Failure Modes ◽  
High Efficiency ◽  
Abrasive Particle ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Cutting Test ◽  
Sic Composites

C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the a p with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.

On Material Removal Mechanism in High Speed Single Grit Scratch-Grinding of Cryo-Treated Al2024-T351 Aluminium Alloy

2020 ◽  
Vol 1009 ◽  
pp. 123-128
Author(s):  
Sweety Satpathy ◽  
Amitava Ghosh
Keyword(s):  
Tensile Strength ◽  
Material Removal ◽  
High Speed ◽  
Scratch Test ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Tool ◽  
Side Flow ◽  
Single Grit Scratch

Feasibility of utilizing cryogenic technology to improve the shearability of Al2024-T351 alloy is experimentally investigated by carrying out a single grit scratch-grinding test. A single grit brazed diamond grinding tool is developed for the study. Al2024-T351 work specimens are treated with liquid nitrogen for 6 hours before the scratch test. Although there was no significant change in the tensile strength of the material, the surface experiences change in the microhardness. It helps in arresting the side flow and ploughing of the material during high speed scratch grinding. The scratched grooves on cryo-treated samples, compare to those of untreated specimens, shows signs of cleaner shear-cuts, superior finish and produces less grinding force during grinding

Study on Grinding Force of High Volume Fraction SiCp/Al Composites with Rotary Ultrasonic Vibration Grinding

2014 ◽  
Vol 1027 ◽  
pp. 48-51 ◽  
Author(s):  
Dao Hui Xiang ◽  
Yu Long Zhang ◽  
Guang Bin Yang ◽  
Song Liang ◽  
Yan Feng Wang ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Volume Fraction ◽  
High Volume ◽  
Grinding Force ◽  
High Volume Fraction ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Parameters ◽  
Ultrasonic Grinding

High volume fraction SiCp/Al composites were grinded in rotary ultrasonic vibration aided grinding in this experiment, exploring the effects of different grinding parameters (grinding depth, grinding wheel speed, feed rate) on grinding force and the material removal mechanism with ultrasonic grinding. The results showed that grinding force of ultrasonic grinding is lower than the ordinary grinding in the same grinding parameters. Studying on material removal mechanism of ultrasonic vibration grinding is bound to have important theoretical and practical significance for the improvement of grinding processes and the development of mechanical according to the advantages of grinding and ultrasonic machining. Keywords: High volume fraction SiCp/Al composites; ultrasonic grinding; grinding force

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels

2008 ◽  
Vol 389-390 ◽  
pp. 18-23
Author(s):  
Jian Qiang Guo ◽  
Hitoshi Ohmori ◽  
Kazutoshi Katahira ◽  
Yoshihiro Uehara
Keyword(s):  
Comparative Study ◽  
Material Removal ◽  
Ground Surface ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
Dressing Method ◽  
The Difference ◽  
Induced Defects

Ceramics has many advantages that cannot be substituted by metals, but its machining induced defects, such as crack and crater, are the obstacle of using ceramics in engineering. Thus, the further studies on the materials removal mechanism of ceramics should be done. As known, the cutting theory of metals is very successful and it is helpful to understand the material removal mechanism of ceramics. Through doing comparative experiments, the material removal mechanism of ceramics may be more deeply ascertained. Four types of material, such as ZrO2, SiC, STAVAX and SKD11, were ground by ELID (ELectrolytic In-process Dressing) method in this study. The grinding forces, roughness and topography of the ground surface were investigated. On the basis of this experiment, the difference of material removal mechanism between ceramics and steels was explained.

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

2008 ◽  
Vol 389-390 ◽  
pp. 459-464 ◽  
Author(s):  
Dong Ming Guo ◽  
Y.B. Tian ◽  
Ren Ke Kang ◽  
Li Bo Zhou ◽  
M.K. Lei
Keyword(s):  
Electron Microscope ◽  
Cross Section ◽  
Material Removal ◽  
Process Model ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Mechanical Grinding ◽  
Study Results ◽  
Si Wafer

An innovative fixed abrasive grinding process of chemo-mechanical grinding (CMG) by using soft abrasive grinding wheel (SAGW) has been recently proposed to achieve a damage-free ground workpiece surface. The basic principle, ideas and characteristics of CMG with SAGW are briefly introduced in this paper. The CMG experiments using newly developed SAGW for Si wafer are conducted at the condition of dry grinding. The grinding performances are evaluated and analyzed in terms of surface roughness, surface topography and surface/subsurface damage of ground wafer by use of Zygo interferometer, Scan Introduction ning Electron Microscope (SEM) and Cross-section Transmission Electron Microscope (Cross-section TEM). The component of product of ground Si surface is studied by X-ray Photoelectron Spectroscopy (XPS) to verify chemical reaction between the abrasive / additives of grinding wheel and Si wafer. The CMG process model by using SAGW is developed to understand the material removal mechanism and generation principle of damage-free surface. The study results show that the material removal mechanism of CMG by using SAGW can be explained as a hybrid process of chemical and mechanical action.

A Study on Residual Stresses in Machined Brittle Material

2016 ◽  
Vol 1136 ◽  
pp. 509-514
Author(s):  
Pei Lum Tso ◽  
Tsung Yun Tsai
Keyword(s):  
Residual Stresses ◽  
Material Removal ◽  
Surface Defects ◽  
Fused Silica ◽  
Grinding Wheel ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Photoelastic Method ◽  
Diamond Blade ◽  
Measuring Tool

Residual stresses in fused silica induced by two machining methods, diamond blade saw cutting and GC grinding wheel grinding, are studied in this study. Photoelastic method would be applied as measuring tool analyzing the gradient of residual stresses caused by different machining condition. This sentence is strange with analyzing the chips of grinding and observation of surface defects, it is assumed that the stresses gradient differs probably cause by the different material removal mechanism.

Theoretical Model of Grinding Force in Quick-Point Grinding

2009 ◽  
Vol 626-627 ◽  
pp. 75-80 ◽  
Author(s):  
Jian Qiu ◽  
Ya Dong Gong ◽  
Yue Ming Liu ◽  
J. Cheng
Keyword(s):  
Material Removal ◽  
Tangential Velocity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Equivalent Diameter ◽  
Grinding Forces ◽  
Cutting Depth ◽  
Force Ratio ◽  
Grinding Mechanism ◽  
Material Removal Mode

Separating the workpiece velocity on the plane of grinding wheel, it is helpful to analyze Quick-point grinding mechanism. There are some relations among wheel’s deflective angle, workpiece feed velocity and tangential velocity. In this research, the resultant workpiece speed, grinding contact zone and material removal mode is analyzed. And a model is established which is helpful to analyze the tendency of component grinding forces and force ratio. It is found the grinding force is influenced by the factors such as cutting depth, wheel velocity, grinding angle as well as equivalent diameter, respectively. Finally, a theoretical basis for actual processing is provided.

scholarly journals Analytical and Experimental Investigation on Cutting Force in Longitudinal-Torsional Coupled Rotary Ultrasonic Machining Zirconia Ceramics

2021 ◽  
Author(s):  
Fan Chen ◽  
Wenbo Bie ◽  
Yingli Chang ◽  
Bo Zhao ◽  
Xiaobo Wang ◽  
...  
Keyword(s):  
Cutting Force ◽  
Material Removal ◽  
Processing Parameters ◽  
Force Model ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Zirconia Ceramics ◽  
The Impact

Abstract Ceramics and other hard-and-brittle materials are very effectively processed by longitudinal-torsional coupled rotary ultrasonic machining (LTC-RUM). However, the cutting force evolution and the effects of processing parameters on the material removal mechanism in LTC-RUM need to be clarified for machining optimization. This paper proposes a cutting force model of the LTC-RUM of zirconia ceramics via the brittle material removal mechanism. Firstly, the kinematic analysis of a single abrasive grain was performed, with further consideration of the material removal volume, the effective contact time, and the impact force per one ultrasonic vibration cycle. Then, the longitudinal-torsional coupled vibration of the core tool was analyzed from the standpoint of wave energy conversion. The analytical model was finalized and experimentally verified by LTC-RUM tests. The cutting force curves predicted via the proposed model were in good agreement with the experimental results. The results obtained are considered instrumental in predicting the effects of processing parameters on cutting force during LTC-RUM of ceramics and their further optimization.

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