Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE
2010 ◽
Vol 426-427
◽
pp. 568-571
Keyword(s):
In the paper, C-Mold software was applied to the analysis of injecting molding of the notebook computer housing so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, the problem has been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.
Keyword(s):
2014 ◽
Vol 228
(15)
◽
pp. 2790-2798
◽
Keyword(s):
Keyword(s):
2013 ◽
Vol 816-817
◽
pp. 307-310
Keyword(s):
2013 ◽
Vol 690-693
◽
pp. 2772-2775
Keyword(s):
2012 ◽
Vol 430-432
◽
pp. 1352-1356
Keyword(s):
2019 ◽
Vol 33
(8)
◽
pp. 3803-3812
Keyword(s):