Effects of Machining Fluid on Electric Discharge Machining of SiC Ingot
2014 ◽
Vol 778-780
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pp. 767-770
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Keyword(s):
The Wire
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Recently, ingots of silicon carbide have been adapted to be sliced by the wire-cut electrical discharge machining. Fast slicing, and the reduction in the loss are important for slicing of the wafer. In this paper, characteristic features of the electric discharge machining in the ion-exchange water and the fluorine-based fluid were compared for these improvement. The discharge was caused by a pulse voltage applied to a ingot of silicon carbide and the wire in machining fluid, and the slicing was proceeded. As a result, improvement of surface roughness and kerf loss was confirmed, for the first time. In addition, the improving methods for fast slicing were considered.
2011 ◽
Vol 399-401
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pp. 1667-1671
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2003 ◽
Vol 217
(5)
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pp. 633-642
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2019 ◽
Vol 102
(1-4)
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pp. 343-353
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Vol 50
(18)
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pp. 2575-2586
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2015 ◽
Vol 7
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2016 ◽
Vol 876
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pp. 36-42
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2012 ◽
Vol 566
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pp. 466-469
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2016 ◽
Vol 230
(12)
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pp. 1401-1414
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