pvT-Behavior of Polymers under Processing Conditions and Implementation in the Process Simulation

2015 ◽  
Vol 825-826 ◽  
pp. 677-684 ◽  
Author(s):  
Rotraud Freytag ◽  
José Antonio Pérez Gil ◽  
Reinhard Forstner
Keyword(s):  
Process Simulation ◽  
Specific Volume ◽  
High Performance ◽  
Process Conditions ◽  
Crystalline Polymers ◽  
Pvt Data ◽  
Process Simulations ◽  
Pvt Measurements ◽  
Pvt Behavior ◽  
Couette Rheometer

The development of high performance products at lowest possible product development-time and costs is the demand of the plastics industry today. A successful use of process simulation to describe the behavior of complex structures and to minimize the technical and economic risks for companies requires application and process-relevant material data.The pvT-behavior of polymers is an essential parameter for process simulations. Especially the dependence of the specific volume of pressure and temperature [1, 2] under process conditions is not mapped to the existing measurement methods.In this study pvT measurements were performed on selected amorphous and semi-crystalline polymers (PP, HDPE, POM, PBT, and ABS) with a Pirouette pvT device, a combination of a dilatometer and Couette rheometer. The specific volume was determined as a function of temperature (25-300°C) and at pressures ranging between 200-1000 bar. On top of that, the influence of the cooling rate was also investigated by pvT measurements performed at cooling rates of 0.1°C/s, 1°C/s and 100°C/s.The coefficients for the 2nd domain Tait pvT-model, which is implemented in the software Autodesk Moldflow, were determined by fitting the experimental pvT data and comparing them with the measured curves. As a result, the semi-crystalline polymers show a shift of the transition temperature to lower temperatures and a reduction in the specific volume in the melt is observed. For validation, in a case study shrinkage results in real were compared with the simulation.

Special Issue on Process Simulation

2013 ◽  
Vol 7 (1) ◽  
pp. 5-5
Author(s):  
Takashi Matsumura
Keyword(s):  
Process Simulation ◽  
Machine Tools ◽  
High Performance ◽  
Advanced Materials ◽  
Manufacturing Processes ◽  
Special Issue ◽  
Process Simulations ◽  
Investment Returns ◽  
Manufacturing Technologies ◽  
Effective Use

High production rates and low costs in manufacturing process should be considered in the manufacturing design divisions. Process simulation, therefore, plays an important role in implementing high performance manufacturing. Simulation is expected to improve the manufacturing processes and the human activities without production faults and downtime of the manufacturing facilities. The production simulation has become diversified with requirements for the manufacturing processes. Then, the effective use of the simulation is also an important issue for the simulation users considering investment returns. Recently advanced materials have been applied to products with developments in material science. The machining systems have also become complicated with progress in the machine tools. Therefore, the process simulations should be developed in terms of materials and machine tools. This special issue includes 9 papers for providing innovative approaches to advanced modeling and simulations in manufacturing technologies and machine tool systems. The special issue also includes discussions in the simulation with the advanced materials for future manufacturing processes. I thank the authors for their generous cooperation and the editing staff for its many contributions.

Matlab and Parallel Computing

2012 ◽  
Vol 17 (4) ◽  
pp. 207-216 ◽  
Author(s):  
Magdalena Szymczyk ◽  
Piotr Szymczyk
Keyword(s):  
Image Processing ◽  
Signal Processing ◽  
Parallel Computing ◽  
Distributed Computing ◽  
Control Systems ◽  
High Performance ◽  
Parallel Applications ◽  
Process Simulations ◽  
Key Features ◽  
Financial Process

Abstract The MATLAB is a technical computing language used in a variety of fields, such as control systems, image and signal processing, visualization, financial process simulations in an easy-to-use environment. MATLAB offers "toolboxes" which are specialized libraries for variety scientific domains, and a simplified interface to high-performance libraries (LAPACK, BLAS, FFTW too). Now MATLAB is enriched by the possibility of parallel computing with the Parallel Computing ToolboxTM and MATLAB Distributed Computing ServerTM. In this article we present some of the key features of MATLAB parallel applications focused on using GPU processors for image processing.

scholarly journals Rheological Basics for Modeling of Extrusion Process of Wood Polymer Composites

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 622
Author(s):  
Krzysztof Wilczyński ◽  
Kamila Buziak ◽  
Adrian Lewandowski ◽  
Andrzej Nastaj ◽  
Krzysztof J. Wilczyński
Keyword(s):  
Polymer Composites ◽  
Process Modeling ◽  
Slip Flow ◽  
Extrusion Process ◽  
Process Conditions ◽  
Rheological Models ◽  
Wood Polymer ◽  
Slip Effects ◽  
Process Simulations ◽  
Wood Polymer Composites

Wood polymer composites are materials with pseudoplastic and viscoelastic properties. They have yield stress and exhibit slip during flow. Studies on extrusion and rheology, as well as on process modeling of these highly filled materials are limited. Extensive rheological and extrusion modeling studies on the wood polymer composite based on the polypropylene matrix were performed. Viscous and slip flow properties were determined (with Rabinowitsch, Bagley, and Mooney corrections) at broad (extrusion) range of shear rate and temperature, using a high-pressure capillary rheometer. Rheological models of Klein and power-law were used for flow modeling, and Navier model was applied for slip modeling. A novel global computer model of WPC extrusion with slip effects has been developed, and process simulations were performed to compute the extrusion parameters (throughput, power consumption, pressure, temperature, etc.), and to study the effect of the material rheological characteristics on the process flow. Simulations were validated experimentally, and were discussed with respect to both rheological and process modeling aspects. It was concluded that the location of the operating point of extrusion process, which defines the thermo-mechanical process conditions, is fundamentally dependent on the rheological materials characteristics, including slip effects.

scholarly journals Process Simulation and Environmental Aspects of Dimethyl Ether Production from Digestate-Derived Syngas

2021 ◽  
Vol 18 (2) ◽  
pp. 807
Author(s):  
Aristide Giuliano ◽  
Enrico Catizzone ◽  
Cesare Freda
Keyword(s):  
Dimethyl Ether ◽  
Process Simulation ◽  
Carbon Capture ◽  
Energy Transition ◽  
Process Conditions ◽  
Co2 Absorption ◽  
Environmental Aspects ◽  
Dme Synthesis ◽  
Water Gas ◽  
Synthesis Of Dimethyl Ether

The production of dimethyl ether from renewables or waste is a promising strategy to push towards a sustainable energy transition of alternative eco-friendly diesel fuel. In this work, we simulate the synthesis of dimethyl ether from a syngas (a mixture of CO, CO2 and H2) produced from gasification of digestate. In particular, a thermodynamic analysis was performed to individuate the best process conditions and syngas conditioning processes to maximize yield to dimethyl etehr (DME). Process simulation was carried out by ChemCAD software, and it was particularly focused on the effect of process conditions of both water gas shift and CO2 absorption by Selexol® on the syngas composition, with a direct influence on DME productivity. The final best flowsheet and the best process conditions were evaluated in terms of CO2 equivalent emissions. Results show direct DME synthesis global yield was higher without the WGS section and with a carbon capture equal to 85%. The final environmental impact was found equal to −113 kgCO2/GJ, demonstrating that DME synthesis from digestate may be considered as a suitable strategy for carbon dioxide recycling.

High Performance Capacitors Using BaTiO3 Nanowires Engineered by Rigid Liquid-crystalline Polymers

2017 ◽  
Vol 121 (37) ◽  
pp. 20075-20083 ◽  
Author(s):  
Dou Zhang ◽  
Chao Ma ◽  
Xuefan Zhou ◽  
Sheng Chen ◽  
Hang Luo ◽  
...  
Keyword(s):  
High Performance ◽  
Liquid Crystalline ◽  
Liquid Crystalline Polymers ◽  
Crystalline Polymers

On the Extraction of Milling Tools Out of Shrink Fit Chucks

2012 ◽  
Vol 523-524 ◽  
pp. 445-450 ◽  
Author(s):  
Berend Denkena ◽  
Dennis Heinisch
Keyword(s):  
High Performance ◽  
Experimental Investigations ◽  
Process Conditions ◽  
Geometrical Parameters ◽  
Dynamic Force ◽  
Unique Type ◽  
Milling Operations ◽  
Torque Transmission ◽  
Shrink Fit ◽  
Milling Tools

Thermal shrink fit chucks are widely used in high performance machining where excellent concentricity and high torque transmission are required. It was reported that in those milling operations, severe damage of tools, workpieces, and also machine tools occurs due to an extraction of the milling tool out of the shrink fit chuck during the process. Although, theoretically the interference fit assembly should withstand certain process forces, milling tools are apparently pulled out under special process conditions. The resulting increase of the cutting depth often leads to tool overload and breakage. So far, the phenomenon of tool extraction could not be explained. This paper presents an experimental approach of the investigation of the phenomenon of axial tool extraction. Therefore, a unique type of test rig for main spindles and tool interfaces is used. Experimental investigations on dynamic force and torque combinations leading to tool extraction are described. Results show, that the holding force is not only affected by geometrical parameters of the shrink fit chuck, but also by the applied dynamic load.

High performance liquid crystalline physical gels prepared by side chain liquid crystalline polymers

Polymer ◽  
2018 ◽  
Vol 151 ◽  
pp. 75-83 ◽  
Author(s):  
Jianhang Zhao ◽  
Yongjie Yuan ◽  
Lei Chen ◽  
Ye Li ◽  
Hailiang Zhang
Keyword(s):  
High Performance ◽  
Liquid Crystalline ◽  
Liquid Crystalline Polymers ◽  
Side Chain ◽  
Crystalline Polymers

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002018-002053
Author(s):  
Swapan Bhattacharya ◽  
Fei Xie ◽  
Daniel F. Baldwin ◽  
Han Wu ◽  
Kelley Hodge ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
Process Development ◽  
High Reliability ◽  
Optimum Process ◽  
Process Conditions ◽  
Harsh Environment ◽  
Mechanical Shock ◽  
Large Area ◽  
Reliability Performance

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19
Author(s):  
Raquel Pinto ◽  
André Cardoso ◽  
Sara Ribeiro ◽  
Carlos Brandão ◽  
João Gaspar ◽  
...  
Keyword(s):  
Structural Material ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Process Conditions ◽  
Processing Temperature ◽  
Wafer Level ◽  
Fast Growing ◽  
Wide Range ◽  
Different Types

Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.

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