Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19
Author(s):  
Raquel Pinto ◽  
André Cardoso ◽  
Sara Ribeiro ◽  
Carlos Brandão ◽  
João Gaspar ◽  
...  
Keyword(s):  
Structural Material ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Process Conditions ◽  
Processing Temperature ◽  
Wafer Level ◽  
Fast Growing ◽  
Wide Range ◽  
Different Types

Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.

Glycans in scaffold design in tissue reconstruction

2021 ◽  
pp. 088391152199784
Author(s):  
Nipun Jain ◽  
Shashi Singh
Keyword(s):  
Cell Attachment ◽  
Low Cost ◽  
Growth Conditions ◽  
Downstream Signaling ◽  
Cell Carrier ◽  
Wide Range ◽  
Proliferation And Differentiation ◽  
Different Types ◽  
Tissue Reconstruction ◽  
A Cell

Development of an artificial tissue by tissue engineering is witnessed to be one of the long lasting clarified solutions for the damaged tissue function restoration. To accomplish this, a scaffold is designed as a cell carrier in which the extracellular matrix (ECM) performs a prominent task of controlling the inoculated cell’s destiny. ECM composition, topography and mechanical properties lead to different types of interactions between cells and ECM components that trigger an assortment of cellular reactions via diverse sensing mechanisms and downstream signaling pathways. The polysaccharides in the form of proteoglycans and glycoproteins yield better outcomes when included in the designed matrices. Glycosaminoglycan (GAG) chains present on proteoglycans show a wide range of operations such as sequestering of critical effector morphogens which encourage proficient nutrient contribution toward the growing stem cells for their development and endurance. In this review we discuss how the glycosylation aspects are of considerable importance in everyday housekeeping functions of a cell especially when placed in a controlled environment under ideal growth conditions. Hydrogels made from these GAG chains have been used extensively as a resorbable material that mimics the natural ECM functions for an efficient control over cell attachment, permeability, viability, proliferation, and differentiation processes. Also the incorporation of non-mammalian polysaccharides can elicit specific receptor responses which authorize the creation of numerous vigorous frameworks while prolonging the low cost and immunogenicity of the substance.

scholarly journals Applicability of Cork as Novel Modifiers to Develop Electrochemical Sensor for Caffeine Determination

Materials ◽  
2020 ◽  
Vol 14 (1) ◽  
pp. 37
Author(s):  
Mayra K. S. Monteiro ◽  
Djalma R. Da Silva ◽  
Marco A. Quiroz ◽  
Vítor J. P. Vilar ◽  
Carlos A. Martínez-Huitle ◽  
...  
Keyword(s):  
Electrochemical Sensor ◽  
Linear Response ◽  
High Performance ◽  
Low Cost ◽  
Pharmaceutical Formulations ◽  
Caffeine Concentration ◽  
Real Samples ◽  
Wide Range ◽  
Potential Use

This study aims to investigate the applicability of a hybrid electrochemical sensor composed of cork and graphite (Gr) for detecting caffeine in aqueous solutions. Raw cork (RAC) and regranulated cork (RGC, obtained by thermal treatment of RAC with steam at 380 °C) were tested as modifiers. The results clearly showed that the cork-graphite sensors, GrRAC and GrRGC, exhibited a linear response over a wide range of caffeine concentration (5–1000 µM), with R2 of 0.99 and 0.98, respectively. The limits of detection (LOD), estimated at 2.9 and 6.1 µM for GrRAC and GrRGC, suggest greater sensitivity and reproducibility than the unmodified conventional graphite sensor. The low-cost cork-graphite sensors were successfully applied in the determination of caffeine in soft drinks and pharmaceutical formulations, presenting well-defined current signals when analyzing real samples. When comparing electrochemical determinations and high performance liquid chromatography measurements, no significant differences were observed (mean accuracy 3.0%), highlighting the potential use of these sensors to determine caffeine in different samples.

scholarly journals Towards a Glass New World: The Role of Ion-Exchange in Modern Technology

2021 ◽  
Vol 11 (10) ◽  
pp. 4610
Author(s):  
Simone Berneschi ◽  
Giancarlo C. Righini ◽  
Stefano Pelli
Keyword(s):  
Ion Exchange ◽  
Communication Networks ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Modern Technology ◽  
Historical Background ◽  
Wide Range ◽  
Happy Marriage

Glasses, in their different forms and compositions, have special properties that are not found in other materials. The combination of transparency and hardness at room temperature, combined with a suitable mechanical strength and excellent chemical durability, makes this material indispensable for many applications in different technological fields (as, for instance, the optical fibres which constitute the physical carrier for high-speed communication networks as well as the transducer for a wide range of high-performance sensors). For its part, ion-exchange from molten salts is a well-established, low-cost technology capable of modifying the chemical-physical properties of glass. The synergy between ion-exchange and glass has always been a happy marriage, from its ancient historical background for the realisation of wonderful artefacts, to the discovery of novel and fascinating solutions for modern technology (e.g., integrated optics). Getting inspiration from some hot topics related to the application context of this technique, the goal of this critical review is to show how ion-exchange in glass, far from being an obsolete process, can still have an important impact in everyday life, both at a merely commercial level as well as at that of frontier research.

scholarly journals Optimization of Plant Extract Purification Procedure for Rapid Screening Analysis of Sixteen Phenolics by Liquid Chromatography

Separations ◽  
2021 ◽  
Vol 8 (2) ◽  
pp. 13
Author(s):  
Petra Ranušová ◽  
Ildikó Matušíková ◽  
Peter Nemeček
Keyword(s):  
Liquid Chromatography ◽  
High Performance ◽  
Solid Phase ◽  
Low Cost ◽  
Sinapic Acid ◽  
Rapid Screening ◽  
Coumaric Acid ◽  
Laboratory Equipment ◽  
Wide Range ◽  
Methoxycinnamic Acid

A solid-phase extraction (SPE) procedure was developed for simultaneous monitoring of sixteen different phenolics of various polarity, quantified by high-performance liquid chromatography (HPLC). The procedure allowed screening the accumulation of intermediates in different metabolic pathways that play a crucial role in plant physiology and/or are beneficial for human health. Metabolites mostly involved in phenylpropanoid, shikimate, and polyketide pathways comprise chlorogenic acid, gentisic acid, vanillic acid, caffeic acid, protocatechuic acid, ferulic acid, rutin, quercetin, epicatechin, gallic acid, sinapic acid, p-coumaric acid, o-coumaric acid, vanillin; two rarely quantified metabolites, 2,5-dimethoxybenzoic acid and 4-methoxycinnamic acid, were included as well. The procedure offered low cost, good overall efficiency, and applicability in laboratories with standard laboratory equipment. SPE recoveries were up to 99.8% at various concentration levels. The method allowed for routine analysis of compounds with a wide range of polarity within a single run, while its applicability was demonstrated for various model plant species (tobacco, wheat, and soybean), as well as different tissue types (shoots and roots).

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

scholarly journals Process Design Kit and Design Automation for Flexible Hybrid Electronics

2019 ◽  
Vol 16 (3) ◽  
pp. 117-123
Author(s):  
Tsung-Ching Huang ◽  
Ting Lei ◽  
Leilai Shao ◽  
Sridhar Sivapurapu ◽  
Madhavan Swaminathan ◽  
...  
Keyword(s):  
Process Design ◽  
Design Automation ◽  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Solution Process ◽  
Oxide Semiconductor ◽  
Wearable Electronics ◽  
Wide Range

Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers, and sense amplifiers, can be printed and hybrid-integrated with thinned (<50 μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications, from flexible displays to wearable medical devices. Here, we report (1) a process design kit (PDK) to enable FHE design automation for large-scale FHE circuits and (2) solution process-proven intellectual property blocks for TFT circuits design, including Pseudo-Complementary Metal-Oxide-Semiconductor (Pseudo-CMOS) flexible digital logic and analog amplifiers. The FHE-PDK is fully compatible with popular silicon design tools for design and simulation of hybrid-integrated flexible circuits.

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

Creating Semiconductor Value through Advanced Package Technology

2016 ◽  
Vol 2016 (S1) ◽  
pp. S1-S46
Author(s):  
Ron Huemoeller
Keyword(s):  
Big Five ◽  
Flip Chip ◽  
Microelectromechanical Systems ◽  
Technology Innovation ◽  
Low Cost ◽  
Semiconductor Industry ◽  
Significant Shift ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Advanced Packaging

Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In fact, the overall packaging industry is doing quite well today as a result, with solid growth expected to create a market value in excess of $30B USD by 2020. This is largely due to the technology innovation in the semiconductor industry continuing to march forward at an incredible pace, with silicon advancements in new node technologies continuing on one end of the spectrum and innovative packaging solutions coming forward on the other in a complementary fashion. The pace of innovation has quickened as has the investments required to bring such technologies to production. At the packaging level, the investments required to support the advancements in silicon miniaturization and heterogeneous integration have now reached well beyond $500M USD per year. Why has the investment to support technology innovation in the packaging community grown so much? One needs to look no further than the complexity of the most advanced package technologies being used today and coming into production over the next year. Advanced packaging technologies have increased in complexity over the years, transitioning from single to multi-die packaging, enabled by 3-dimensional integration, system-in-package (SiP), wafer-level packaging (WLP), 2.5D/3D technologies and creative approached to embedding die. These new innovative packaging technologies enable more functionality and offer higher levels of integration within the same package footprint, or even more so, in an intensely reduced footprint. In an industry segment that has grown accustomed to a multitude of package options, technology consolidation seems evident, producing “The Big Five” advanced packaging platforms. These include low-cost flip chip, wafer-level chip-scale package (WLCSP), microelectromechanical systems (MEMS), laminate-based advanced system-in-package (SiP) and wafer-based advanced SiP designs. This presentation will address ‘The Big Five’ packaging platforms and how they are adding value to the Semiconductor Industry.

Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing

2013 ◽  
Vol 2013 (1) ◽  
pp. 000001-000006
Author(s):  
F. Roozeboom ◽  
M. Smets ◽  
B. Kniknie ◽  
M. Hoppenbrouwers ◽  
G. Dingemans ◽  
...  
Keyword(s):  
High Speed ◽  
Room Temperature ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Industrial Process ◽  
Atomic Layer ◽  
Single Step ◽  
Thermal Mode ◽  
Different Types ◽  
Sidewall Passivation

The current industrial process of choice for Deep Reactive Ion Etching (DRIE) of 3D features, e.g. Through-Silicon Vias (TSVs), Microelectromechanical Systems (MEMS), etc., is the Bosch process, which uses alternative SF6 etch cycles and C4F8-based sidewall passivation cycles in a time-sequenced mode. An alternative, potentially faster and more accurate process is to have wafers pass under spatially-divided reaction zones, which are individually separated by so-called N2-gas bearings ‘curtains’ of heights down to 10–20 μm. In addition, the feature sidewalls can be protected by replacing the C4F8-based sidewall passivation cycles by cycles forming chemisorbed and highly uniform passivation layers of Al2O3 or SiO2 deposited by Atomic Layer Deposition (ALD), also in a spatially-divided mode. ALD is performed either in thermal mode, or plasma-assisted mode in order to achieve near room-temperature processing. For metal filling of 3D-etched TSVs, or for deposition of 2D metal conductor lines one can use Laser-Induced Forward Transfer (LIFT) of metals. LIFT is a maskless, ‘solvent’-free deposition method, utilizing different types of pulsed lasers to deposit thin material (e.g. Cu, Au, Al, Cr) layers with μm-range resolution from a transparent carrier (ribbon) onto a close-by acceptor substrate. It is a dry, single-step, room temperature process in air, suitable for different types of interconnect fabrication, e.g. TSV filling and redistribution layers (RDL), without the use of wet chemistry.

scholarly journals A High Q-Factor Outer-Frame-Anchor Gyroscope Operating at First Resonant Mode

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1071
Author(s):  
Bo Jiang ◽  
Yan Su ◽  
Guowen Liu ◽  
Lemin Zhang ◽  
Fumin Liu
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Resonant Mode ◽  
Low Noise ◽  
Silicon On Insulator ◽  
Q Factor ◽  
Wafer Level ◽  
High Q ◽  
Ring Structures ◽  
Static Performance

Disc gyroscope manufactured through microelectromechanical systems (MEMS) fabrication processes becomes one of the most critical solutions for achieving high performance. Some reported novel disc constructions acquire good performance in bias instability, scale factor nonlinearity, etc. However, antivibration characteristics are also important for the devices, especially in engineering applications. For multi-ring structures with central anchors, the out-of-plane motions are in the first few modes, easily excited within the vibration environment. The paper presents a multi-ring gyro with good dynamic characteristics, operating at the first resonant mode. The design helps obtain better static performance and antivibration characteristics with anchor points outside of the multi-ring resonator. According to harmonic experiments, the nearest interference mode is located at 30,311 Hz, whose frequency difference is 72.8% far away from working modes. The structures were fabricated with silicon on insulator (SOI) processes and wafer-level vacuum packaging, where the asymmetry is 780 ppm as the frequency splits. The gyro also obtains a high Q-factor. The measured value at 0.15 Pa was 162 k, which makes the structure have sizeable mechanical sensitivity and low noise.

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