Laser-Assisted Waterjet Micro-Grooving of Silicon Wafers for Minimizing Heat Affected Zone

2016 ◽  
Vol 861 ◽  
pp. 133-138
Author(s):  
Xiang Ning Pan ◽  
Chuan Zhen Huang ◽  
Jun Wang ◽  
Hong Tao Zhu ◽  
Peng Yao
Keyword(s):  
Heat Affected Zone ◽  
Predictive Models ◽  
Functional Materials ◽  
Groove Depth ◽  
Silicon Wafers ◽  
Machining Process ◽  
Laser Machining ◽  
Micro Machining ◽  
Micro Grooving ◽  
Haz Width

Laser-assisted waterjet micro-machining can significantly reduce the thermal damages to the workpiece as compared to the traditional laser machining process, and hence can overcome the problems associated with laser machining, such as the formation of heat-affected zone, which is a serious issue for thermal sensitive and functional materials. An experimental study on micro-grooving of monocrystalline silicon wafers is reported in this study to explore the effects of process parameters on the groove depth and width as well as the heat-affected zone (HAZ) width. Predictive models based on dimensionl analysis are then developed for estiamting the groove characteristics.

A Study of Abrasive Jet Micro-Grooving of Quartz Crystals

2010 ◽  
Vol 443 ◽  
pp. 645-651 ◽  
Author(s):  
Alireza Moridi ◽  
Jun Wang ◽  
Yasser M. Ali ◽  
Philip Mathew ◽  
Xiao Ping Li
Keyword(s):  
Predictive Models ◽  
Deep Understanding ◽  
Machining Process ◽  
Micro Machining ◽  
Machining Performance ◽  
Quartz Crystals ◽  
Abrasive Jet Machining ◽  
Model Predictions ◽  
Micro Grooving ◽  
Good Agreement

Owing to its various distinct advantages over the other machining technologies, abrasive jet machining has become a promising machining technology for brittle and hard-to-machine materials. An experimental study is presented on the micro-grooving of quartz crystals using an abrasive airjet. The effect of the various process parameters on the major machining performance measures are analysed to provide a deep understanding of this micro-machining process. Predictive models are then developed for quantitatively estimating the machining performance. The models are finally verified by an experiment. It shows that the model predictions are in good agreement with the experimental results under the corresponding conditions.

scholarly journals Microgrooving of Germanium Wafers Using Laser and Hybrid Laser-Waterjet Technologies

2014 ◽  
Vol 1017 ◽  
pp. 193-198 ◽  
Author(s):  
Hao Zhu ◽  
Jun Wang ◽  
Wei Yi Li ◽  
Huai Zhong Li
Keyword(s):  
Experimental Study ◽  
Laser Pulse ◽  
Heat Affected Zone ◽  
Pulse Energy ◽  
Focal Plane ◽  
Laser Pulse Energy ◽  
Machining Process ◽  
Laser Machining ◽  
Nanosecond Laser ◽  
Energy Pulse

Lasers have the potential for the micromachining of germanium (Ge). However, the thermal damages associated with the laser machining process need to be properly controlled. To minimize the thermal damages, a hybrid laser-waterjet ablation technology has recently been developed for micromachining. This paper presents an experimental study to assess the machining performances in microgrooving of Ge by using a nanosecond laser and the hybrid laser-waterjet technology. The effects of laser pulse energy, pulse overlap and focal plane position on the groove geometry and heat affected zone (HAZ) size are analyzed and discussed. It is shown that the hybrid laser-waterjet technology can give rise to narrow and deep microgrooves with minimum HAZ.

Fundamental Micro-Grooving Characteristics of Hard and Brittle Materials with a Fine Wire Tool

2016 ◽  
Vol 1136 ◽  
pp. 299-304 ◽  
Author(s):  
Satoshi Sakamoto ◽  
Keitoku Hayashi ◽  
Yasuo Kondo ◽  
Kenji Yamaguchi ◽  
Tsuyoshi Fujita ◽  
...  
Keyword(s):  
Relative Velocity ◽  
Large Diameter ◽  
Small Diameter ◽  
Groove Depth ◽  
Silicon Wafers ◽  
Production Costs ◽  
Fine Wire ◽  
Hard And Brittle Materials ◽  
Micro Grooving ◽  
Lower Production

Thinning of the silicon wafers and decrease in kerf loss can minimize the production costs of semiconductor products. Currently, the quantity of kerf loss is about the same as the volume of the wafer itself. If we drastically reduce kerf loss, we can easily lower production costs. Therefore, we studied techniques for slicing silicon wafers with reduced kerf loss using a wire tool. As a first step, we performed micro-grooving with a fine wire tool. In this paper, we discuss the micro-grooving performance of a fine wire tool made of tungsten. A borosilicate glass is used as the work material. The main conclusions are as follows: When a fine wire tool and small-diameter abrasives are used, the kerf loss decreases. However, the strength of fine wire tools is very low. The relative velocity and abrasive diameters have a significant influence on the micro-grooving characteristics. Fine wire tools are easily fractured at fast relative velocities and with large-diameter abrasives. However, the grooving rate increases. Groove depth and grooving efficiency do not depend on the relative velocity and are dependent on the abrasive diameter.

Challenges and Issues in the Design of Micro-Machined Antennas - A Review

2020 ◽  
Vol 13 ◽  
Author(s):  
Ashish Kumar ◽  
Amar Partap Singh Pharwaha
Keyword(s):  
Patch Antenna ◽  
Ground Plane ◽  
Substrate Material ◽  
Review Article ◽  
High Index ◽  
Performance Characteristics ◽  
Machining Process ◽  
Patch Antennas ◽  
Micro Machining ◽  
The Impact

Background: Patch antennas are composed of the substrate material with patch and ground plane on the both sides of the substrate. The dimensions and performance characteristics of the antenna are highly influenced by the choice of the appropriate substrate depending upon the value of their dielectric constant. Generally, low index substrate materials are used to design the patch antenna but there are also some of the applications, which require the implementation of patch antenna design on high index substrate like silicon and gallium arsenide. Objective: The objective of this article is to review the design of antennas developed on high index substrate and the problems associated with the use of these materials as substrate. Also, main challenges and solutions have been discussed to improve the performance characteristics while using the high index substrates. Method: The review article has divided into various sections including the solution of the problems associated with the high index substrates in the form of micro-machining process. Along with this, types of micro machining and their applications have discussed in detail. Results: This review article investigates the various patch antennas designed with micro-machining technology and also discusses the impact of micro-machining process on the performance parameters of the patch antennas designed on high index substrates. Conclusion: By using the micro-machining process, the performance of patch antenna improves drastically but fabrication and tolerances at such minute structures is very tedious task for the antenna designers.

Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers

2005 ◽  
Vol 242 (1-2) ◽  
pp. 162-167 ◽  
Author(s):  
M.S. Amer ◽  
M.A. El-Ashry ◽  
L.R. Dosser ◽  
K.E. Hix ◽  
J.F. Maguire ◽  
...  
Keyword(s):  
Structural Changes ◽  
Silicon Wafers ◽  
Laser Machining ◽  
Nanosecond Laser ◽  
Induced Stresses

Marathon für kleinen Bohrer

VDI-Z ◽  
2019 ◽  
Vol 161 (Special-II) ◽  
pp. 38-39
Keyword(s):  
Machining Process ◽  
Micro Machining

Damit die Firma Werner Rau hohen Qualitätsansprüchen gerecht werden kann, setzt der Geschäftsführer auf Werkzeuge von Fritz Hartmann Präzisionswerkzeuge – mit Erfolg: Bei der Bearbeitung mehrerer Druckplatten mit je 38 000 Bohrungen stellte ein 3 mm-Spiralbohrer mit MMP (Micro Machining Process)- Technologie von HAM seine Präzision seine Qualität vorbildlich unter Beweis.

scholarly journals Micro Machining Process Selection: An Integrated Theory

2016 ◽  
Vol 25 ◽  
pp. 862-868 ◽  
Author(s):  
Sandeep Kuriakose ◽  
Anil Varghese Mangalan ◽  
Babu Namboothiri ◽  
Amitava Ray
Keyword(s):  
Machining Process ◽  
Micro Machining ◽  
Process Selection ◽  
Integrated Theory

Micro-grooving on quartz crystals by an abrasive air jet

2011 ◽  
Vol 225 (9) ◽  
pp. 2161-2173 ◽  
Author(s):  
J Wang ◽  
A Moridi ◽  
P Mathew
Keyword(s):  
Performance Measures ◽  
Process Parameters ◽  
Traverse Speed ◽  
Groove Depth ◽  
Impact Angle ◽  
Quartz Crystals ◽  
Air Jet ◽  
Jet Impact ◽  
Mass Flowrate ◽  
Micro Grooving

An investigation of the micro-grooving performance of abrasive air jet (AAJ) on quartz crystals is presented and discussed. An experimental study was carried out first to understand the effect of process parameters on the major grooving performance measures such as groove depth, groove width, kerf taper, and surface roughness. Plausible trends for these grooving performance measures with respect to the various process variables, such as air pressure, nozzle traverse speed, jet impact angle, and abrasive mass flowrate, are discussed. It is found that AAJ is an effective technology for micromachining of quartz crystals and the grooving performance can be improved or optimized by selecting the process parameters properly. Predictive models are then developed for quantitatively estimating the micro-grooving performance. The models are finally verified by an experiment. It shows that the model predictions are in good agreement with the experimental results under the corresponding conditions.

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