High Throughput Thin Wafer Support Technology for 3DIC
The 3DIC market has been investigated for several years. As many companies investigate this business, more is understood about the challenges and cost. All existing commercial technologies use a spin-on adhesive applied to the device wafer, is bonded to a carrier, and after processing, de-bonded by widely different practices. One of the leading technologies is WaferBond(TM), a rubber-based adhesive, supplied by Brewer-Science, Inc. (BSI). In 2005, this technology was developed by Daetec as one of their first technology transfers. Daetec has developed numerous temporary bonding systems, including a rosin and a silicone, sold under the trade name GenTak(TM) for General Chemical. [1] At this year's 2013 Semicon- West gathering, a panel of global experts from KMPG, IMEC, Sematech, CEA-Leti, and CNSE were asked to identify the semiconductor industry's greatest technical challenges. [2] Next to lithography, these experts believed the top challenge is to reduce the barriers to 3DIC. Such barriers include: high cost, poor yield, and poor throughput. When only a few companies can afford 3DIC, progress is slow and growth towards >2 integration levels is pushed to the future. Daetec has developed a new technology, DaeBond 3DTM, allowing carrier de-bond to occur in a batch process and while thinned wafers are affixed to film frames (Fig. 1). Many other benefits exist and will be presented at the show.