Control of Void Formation in Adhesively Bonded Joints

2019 ◽  
Vol 2019 (1) ◽  
pp. 000295-000305
Author(s):  
Nina S. Dytiuk ◽  
Thomas F. Marinis ◽  
Joseph W. Soucy
Keyword(s):  
Moving Boundary ◽  
Void Formation ◽  
Adsorbed Water ◽  
Adhesive Joints ◽  
Diffusion Control ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Time Step ◽  
Adhesively Bonded Joints ◽  
Wide Range

Abstract Adhesively bonded joints are ubiquitous in electronic assemblies that are used in a wide range of applications, which include automotive, medical, military, space and communications. The steady drive to reduce the size of assemblies in all of these applications, while providing increased functionality, generates a need for adhesive joints of higher strength, improved thermal and electrical conductivity and better dielectric isolation. All of these attributes of adhesive joints are degraded by the presence of voids in them. The quest to minimize voids in bonded structures motivated this study of their formation in a solvent cast, die bond epoxy film, which undergoes a liquid phase transition during cure. Void formation is influenced by a number factors, which include wettability of the bonded surfaces, adsorbed water, amount of solvent retained in the film, volume of entrapped air, thermal profile of the cure schedule, and clamping pressure during cure. We have been exploring the interaction of these parameters and their impact on void retention in bonded joints with the aid of a moving boundary, finite difference model that tracks the movement of volatile species into and out of the void under diffusion control. The position of the void interface is updated at each discrete time step by integrating the product of the time step and flux of diffusing species over the area of the interface. The internal pressure of the void is determined by application of the Young-Laplace equation, while Henry's law is used to estimate the concentration of diffusing species adjacent to the void interface. The calculation proceeds for a time equivalent to the integral of the time temperature product required to achieve a 70% cure state of the adhesive, at which point the void interface is immobile. The adhesive we have chosen for this study is transparent in both the pre and post-cured states, so by sandwiching the material between glass slides we are able to observe void formation and evolution during cure. This allows us to directly observe the effects of various parameters for comparison with our predicted behavior.

Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler

2020 ◽  
Vol 2020 (1) ◽  
pp. 000246-000258
Author(s):  
Nina S. Dytiuk ◽  
Thomas F. Marinis ◽  
Joseph W. Soucy
Keyword(s):  
Finite Element ◽  
Open Source ◽  
Void Formation ◽  
Adhesive Joints ◽  
Bonded Joints ◽  
Volatile Species ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Open Source Program ◽  
Source Program

Abstract Adhesively bonded joints are ubiquitous in electronic assemblies that are used in a wide range of applications, which include automotive, medical, military, space and communications. The steady drive to reduce the size of assemblies in all of these applications, while providing increased functionality, generates a need for adhesive joints of higher strength, improved thermal and electrical conductivity and better dielectric isolation. All of these attributes of adhesive joints are degraded by the presence of voids in them. The quest to minimize voids in bonded structures motivated a previous study of their formation in a solvent cast, die bond epoxy film, which undergoes a liquid phase transition during cure. That work is extended in this study by including the effects of various filler morphologies in the adhesive. Fillers are added to adhesives to facilitate handling of thin sheet formats, control bond line thickness and reduce coefficient of thermal expansion. As such, fillers are selected to be inert with respect to the adhesive chemistry, while being readily wetted by it in the liquid state. Common filler morphologies include woven and molded open meshes, fibers chopped to uniform length, and spheres of uniform or distributed diameters. Void formation is influenced by a number factors, which include wettability of the bonded surfaces, adsorbed water, amount of solvent retained in the film, volume of entrapped air, thermal profile of the cure schedule, and clamping pressure during cure. The presence of fillers in the adhesive adds the additional factors of constrained diffusion paths and increased area for void nucleation. We have changed our approach to modeling the diffusion of volatile species in adhesive joints from a finite difference calculation in a uniform adhesive medium used previously, to a finite element model of a complex diffusion space. The open source program Gmsh is used to generate the diffusion space from a set of input parameters. The calculations of concentration profiles and diffusion fluxes of volatile species at the void interface are made using the open source finite element program elmer. As done previously, the position of the void interface is updated by integrating the product of time and flux of diffusing species over the area of the interface. The internal pressure of the void is determined by application of the Young-Laplace equation, while Henry’s law is used to estimate the concentration of diffusing species adjacent to the void interface. The calculation proceeds for a time equivalent to the integral of the time temperature product required to achieve a 70% cure state of the adhesive, at which point the void interface is immobile. The experimental approach is the same as used previously, with the filled adhesive sandwiched between glass slides and cured on a hot plate while imaged through a microscope. Images are automatically captured and analyzed by using the open source program imageJ, which allows us to track the evolution of individual voids as well as the time dependent distribution of the void population. We are working to correlate these experimental results with the predictions of our finite element calculations to allow us to make insightful choices of adhesives and optimize our bonding processes.

scholarly journals Defects and uncertainties of adhesively bonded composite joints

2021 ◽  
Vol 3 (9) ◽  
Author(s):  
Sadik Omairey ◽  
Nithin Jayasree ◽  
Mihalis Kazilas
Keyword(s):  
Composite Materials ◽  
Composite Structures ◽  
Production Efficiency ◽  
Adhesive Bonding ◽  
Detection Methods ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Wide Range ◽  
Bonded Composite

AbstractThe increasing use of fibre reinforced polymer composite materials in a wide range of applications increases the use of similar and dissimilar joints. Traditional joining methods such as welding, mechanical fastening and riveting are challenging in composites due to their material properties, heterogeneous nature, and layup configuration. Adhesive bonding allows flexibility in materials selection and offers improved production efficiency from product design and manufacture to final assembly, enabling cost reduction. However, the performance of adhesively bonded composite structures cannot be fully verified by inspection and testing due to the unforeseen nature of defects and manufacturing uncertainties presented in this joining method. These uncertainties can manifest as kissing bonds, porosity and voids in the adhesive. As a result, the use of adhesively bonded joints is often constrained by conservative certification requirements, limiting the potential of composite materials in weight reduction, cost-saving, and performance. There is a need to identify these uncertainties and understand their effect when designing these adhesively bonded joints. This article aims to report and categorise these uncertainties, offering the reader a reliable and inclusive source to conduct further research, such as the development of probabilistic reliability-based design optimisation, sensitivity analysis, defect detection methods and process development.

Polymer Interphases in Adhesively Bonded Joints – Origin, Properties and Methods for Characterization

2018 ◽  
Vol 941 ◽  
pp. 2249-2254
Author(s):  
Paul Ludwig Geiss ◽  
Melanie Schumann
Keyword(s):  
Cross Section ◽  
Chemical Imaging ◽  
Adhesive Joints ◽  
Array Detector ◽  
Infrared Analysis ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Cross Sectional ◽  
Adhesively Bonded Joints ◽  
The Cross

Chemically curing adhesives are formulations requiring reactions to convert from liquid to solid. Once cured, these adhesives carry the potential to create strong load bearing joints, resisting even severe detrimental service conditions. In adhesively bonded joints with chemically curing adhesives the term "interphase" relates to the adhesive volume adjacent to the surface of the adherent (interface), which generally will exhibit properties different from those of the adhesive bulk polymer. The properties of these interphases play an important role concerning the performance and durability of structural adhesive joints. Therefore localized strain analysis in the cross-section of shear-loaded adhesive joints was performed by combining a high-precision mechanical testing device with digital microscopy and by developing a method for preparing, marking, and digitally tracking the local deformations in micro shear specimen. Non-uniform shear profiles developing in the cross-section of the adhesive joints after exceeding the yield point serve as a sensitive indication for mechanical surface-affected interphase properties and it could be observed, that deranged crosslinking promotes strain softening of the polymer in the interphase. Infrared analysis of the cross-sectional interphase region in adhesively bonded joints was performed with a Bruker Tensor II Fourier Transform Infrared (FTIR) spectrometer equipped with a Hyperion 3000 microscope with a 20x ATR germanium crystal objective and a MCT-Focal-Plane-Array-Detector (FPA), allowing to conduct high resolution chemical imaging and localized chemical analysis.

scholarly journals Development of an integrated sacrificial sensor for damage detection and monitoring in composite materials and adhesively bonded joints

2021 ◽  
pp. 147592172198904
Author(s):  
G Ólafsson ◽  
RC Tighe ◽  
SW Boyd ◽  
JM Dulieu-Barton
Keyword(s):  
Crack Initiation ◽  
Electrical Resistance ◽  
Electrical Response ◽  
Lap Joints ◽  
Structural Performance ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Wide Range ◽  
Adhesively Bonded Joint

Quality assurance of adhesively bonded joints is of vital importance if their benefits are to be exploited across a wide range of industrial applications. A novel lightweight, low-cost, non-invasive embedded sacrificial sensor is proposed, capable of detecting damage within an adhesively bonded joint, which could also be used in a laminated composite structure. The sensor operation uses changes in electrical resistance, increasing as the sensing material area diminishes with damage progression. Initial tests prove the sensor concept by showing that the electrical resistance of the sensor increases proportionally with material removal, mimicking the sensor operation. Thermography is used to verify the current flow through the sensor and that any localised heating caused by the sensor is minimal. Short beam interlaminar shear strength (ILSS) tests show that embedding sensors in a composite laminates did not cause a reduction in material interfacial structural performance. Finally, the in situ performance of the sensor is demonstrated in quasi-static tensile tests to failure of adhesively bonded single lap joints (SLJs) with sensors embedded in the bond line. Prior to crack initiation, an electrical response occurs that correlates with increasing applied load, suggesting scope for secondary uses of the sensor for load monitoring and cycle counting. Crack initiation is accompanied by a rapid increase in electrical resistance, providing an indication of failure ahead of crack propagation and an opportunity for timely repair. As the crack damage propagated, the electrical response of the sensor increased proportionally. The effect of the sensor on the overall structural performance was assessed by comparing the failure load of joints with and without the embedded sensor with no measurable difference in ultimate strength. The research presented in the article serves as an important first step in developing a simple yet promising new technology for structural health monitoring with numerous potential applications.

Nonlinear Viscoelastic Finite Element Analysis of Adhesive Joints

1988 ◽  
Vol 16 (3) ◽  
pp. 146-170 ◽  
Author(s):  
S. Roy ◽  
J. N. Reddy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Viscoelastic Behavior ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Nonlinear Viscoelastic ◽  
Structural Failures ◽  
Updated Lagrangian

Abstract A good understanding of the process of adhesion from the mechanics viewpoint and the predictive capability for structural failures associated with adhesively bonded joints require a realistic modeling (both constitutive and kinematic) of the constituent materials. The present investigation deals with the development of an Updated Lagrangian formulation and the associated finite element analysis of adhesively bonded joints. The formulation accounts for the geometric nonlinearity of the adherends and the nonlinear viscoelastic behavior of the adhesive. Sample numerical problems are presented to show the stress and strain distributions in bonded joints.

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