Inkjet Printing as Technology for In-Situ Blending of Thick-Film Resistor Inks

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000142-000151
Author(s):  
Marcel Waßmer ◽  
Waldemar Diel ◽  
Klaus Krüger
Keyword(s):  
Thick Film ◽  
Inkjet Printing ◽  
Production Method ◽  
Circuit Boards ◽  
Passive Components ◽  
Long Term Stability ◽  
Efficient Alternative ◽  
Thickness Variations ◽  
New Applications

The integration of passive components directly into circuit boards is an efficient alternative to surface mounted devices. Digital printing methods are more and more emerging technologies for the fabrication of microelectronic circuits. Inkjet printing is a technology for the deposition of a variety of particles with the unique selling proposition of in-situ ink blending. Resistors are one of the most frequently required passive components in electronic circuits. In LTCC technology the integration and additionally the embedding of resistors promises new applications. Integrated resistors are usually screen printed. Inkjet printing has several advantages to compete seriously with screen printing as production method. This study investigates the opportunities of in-situ blending in inkjet printing of thick-film resistors. In a first step, the different options of ink blending are analyzed theoretically. In order to have a basis for further calculations five compositions with a wide resistivity range are printed purely. Afterwards the printed resistors are passed through a post-fire process and the electrical properties are recorded. Reliability and long term stability in drop formation are fundamental for production process. In a second step, the different options of ink blending are analyzed. The five compositions are blended to four combinations of neighbouring inks and are printed and blended with two inkjet printheads. The effect of blending is characterized towards the change in electrical behaviour and the different blending techniques are compared. Additionally, the opportunity of layer thickness variations is investigated and its influence is analyzed. Further, the influences of printing conditions on morphology and resistivity are discussed.

Inkjet Printing of Thick-Film Resistors

2010 ◽  
Vol 2010 (1) ◽  
pp. 000771-000778
Author(s):  
Marcel Wassmer ◽  
Waldemar Diel ◽  
Klaus Krueger
Keyword(s):  
Thick Film ◽  
Inkjet Printing ◽  
Digital Fabrication ◽  
Production Method ◽  
Circuit Board ◽  
Passive Components ◽  
Long Term Stability ◽  
Efficient Alternative ◽  
New Applications

The integration of passive components directly into circuit board is an efficient alternative to surface mounted devices. Inkjet printing is the emerging technology for the deposition of a variety of particles and therefore for digital fabrication of microelectronic circuits. Resistors are one of the most frequently required passive components in electronic circuits. In LTCC-technology the integration and additionally the embedding of resistors promises new applications. Integrated resistors are usually screen printed. Inkjet printing has several advantages to compete seriously with screen printing as production method. This study investigates the possibilities and reliability of inkjet printing of thick-film resistors. In a first step, different resistive compositions are characterised towards compatibility with a commercial inkjet print head. The reliability and long term stability in drop formation are fundamental for production process. Further on, the interaction between ink and substrate has to be taken into account to reach the desired morphology. In a second step, the advantages of using inkjet for printing resistors are shown. A measure of ink amount is introduced for exact dosing of the ink. Afterwards, compositions with a wide resistivity range are printed with different print heads. The printed resistors are further passed alternatively through a post-fire or through a co-fire process. The effect of variations in particle composition and ink amount are characterized towards the change in electrical behaviour. Further, the influences of printing conditions on morphology and resistivity are discussed.

Inkjet Printing of Fine-Line Thick-Film Inductors

2010 ◽  
Vol 7 (4) ◽  
pp. 205-213
Author(s):  
Marcel Wassmer ◽  
Waldemar Diel ◽  
Klaus Krueger
Keyword(s):  
Thick Film ◽  
Inkjet Printing ◽  
Digital Fabrication ◽  
Production Method ◽  
Passive Components ◽  
Construction Methods ◽  
Ferrite Particle ◽  
Main Challenge ◽  
The Stability ◽  
New Applications

Inkjet printing is the emerging technology for the deposition of a variety of particles. The reliable printing of nano-silver inks shows the possibilities of digital fabrication of microelectronic circuits and raises the question for further use with other particles. To compete with common thick-film screen printing as a production method it is consequential and necessary to investigate the inkjet printing of all passive electronic thick-film components. Inductors are frequently required in electronic circuits, yet they represent a main challenge for thick-film printing. With the development of new materials, which are suitable for low-temperature cofired ceramic processes, the integration of passive components promises new applications. In a first step, different ferrite particle compositions are dispersed to stabilized inks that can be used with a commercial inkjet print head. The stability of the ink is fundamental for reliable drop formation. In addition, the viscosity must fit to the print heads' operational ranges and the magnetic properties must be taken into account. In a second step, the effect of substrate coating and drop volume variation toward the shape of the printed structures are defined and shown. The fundamental construction methods of inkjet-printed inductors on fired ceramic are investigated. First, silver coils are printed without ferrite to optimize the printing pattern. Subsequently, coils are embedded in inkjet printed ferrite layers. Depending on the geometrical layout, several drying and firing steps are necessary, leading to a more complex production process and influencing the electrical properties. Finally, it is shown that inkjet printing is very effective for built-up of multilayer thick-film inductors, and the high accuracy of the printing process promises accurate electrical values.

In-Situ Blending of Inkjet-Printed Thick-Film Resistors

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000211-000220 ◽  
Author(s):  
Dietrich Jeschke ◽  
Mathias Niemann ◽  
Klaus Krüger
Keyword(s):  
Linear Model ◽  
Thick Film ◽  
Circuit Design ◽  
Inkjet Printing ◽  
Passive Components ◽  
Electric Behavior ◽  
Printing System

Thick-film resistors are widely used passive components. Considering circuit design and layout, decoupling the resistance from geometry is desirable. Inkjet printing offers an approach to reach this aim by allowing for in-process blending of resistor inks. To model the electric behavior of printed resistors, a conductance based linear model is derived, that is both, physically plausible and mathematically convenient. Generally the model is based on resistor layers connected in parallel. To allow for fine graduation the parallel layers are not just realized with different decadic inks but with a discrete number of ink mixtures (“virtual inks”) which are generated in-situ during printing. Both, the conductance model and the in-process ink blending are proven by real inkjet-printed resistors. For manufacturing these resistors, the used inkjet printing system was improved.

Degradation Analysis of Thick Film Chip Resistors

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Negative Resistance ◽  
Circuit Board ◽  
High Humidity ◽  
Circuit Boards ◽  
Chemical Modifications ◽  
Current Leakage ◽  
Printed Circuit ◽  
Degradation Analysis

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.

scholarly journals Fabrication of a liquid cell for in situ transmission electron microscopy

Microscopy ◽  
2020 ◽  
Author(s):  
Xiaoguang Li ◽  
Kazutaka Mitsuishi ◽  
Masaki Takeguchi
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Cost Effective ◽  
Production Method ◽  
Microscopy Imaging ◽  
Transmission Electron ◽  
In Situ Electron Microscopy ◽  
Liquid Cell ◽  
Si Wafer

Abstract Liquid cell transmission electron microscopy (LCTEM) enables imaging of dynamic processes in liquid with high spatial and temporal resolution. The widely used liquid cell (LC) consists of two stacking microchips with a thin wet sample sandwiched between them. The vertically overlapped electron-transparent membrane windows on the microchips provide passage for the electron beam. However, microchips with imprecise dimensions usually cause poor alignment of the windows and difficulty in acquiring high-quality images. In this study, we developed a new and efficient microchip fabrication process for LCTEM with a large viewing area (180 µm × 40 µm) and evaluated the resultant LC. The new positioning reference marks on the surface of the Si wafer dramatically improve the precision of dicing the wafer, making it possible to accurately align the windows on two stacking microchips. The precise alignment led to a liquid thickness of 125.6 nm close to the edge of the viewing area. The performance of our LC was demonstrated by in situ transmission electron microscopy imaging of the dynamic motions of 2-nm Pt particles. This versatile and cost-effective microchip production method can be used to fabricate other types of microchips for in situ electron microscopy.

scholarly journals In-Situ Annealed Ti3C2Tx MXene Based All-Solid-State Flexible Zn-Ion Hybrid Micro Supercapacitor Array with Enhanced Stability

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
La Li ◽  
Weijia Liu ◽  
Kai Jiang ◽  
Di Chen ◽  
Fengyu Qu ◽  
...  
Keyword(s):  
High Energy ◽  
High Rate ◽  
High Energy Density ◽  
Electrochemical Performances ◽  
Integrated Electronics ◽  
Long Term Stability ◽  
Hybrid Supercapacitors ◽  
Portable Electronics

AbstractZn-ion hybrid supercapacitors (SCs) are considered as promising energy storage owing to their high energy density compared to traditional SCs. How to realize the miniaturization, patterning, and flexibility of the Zn-ion SCs without affecting the electrochemical performances has special meanings for expanding their applications in wearable integrated electronics. Ti3C2Tx cathode with outstanding conductivity, unique lamellar structure and good mechanical flexibility has been demonstrated tremendous potential in the design of Zn-ion SCs, but achieving long cycling stability and high rate stability is still big challenges. Here, we proposed a facile laser writing approach to fabricate patterned Ti3C2Tx-based Zn-ion micro-supercapacitors (MSCs), followed by the in-situ anneal treatment of the assembled MSCs to improve the long-term stability, which exhibits 80% of the capacitance retention even after 50,000 charge/discharge cycles and superior rate stability. The influence of the cathode thickness on the electrochemical performance of the MSCs is also studied. When the thickness reaches 0.851 µm the maximum areal capacitance of 72.02 mF cm−2 at scan rate of 10 mV s−1, which is 1.77 times higher than that with a thickness of 0.329 µm (35.6 mF cm−2). Moreover, the fabricated Ti3C2Tx based Zn-ion MSCs have excellent flexibility, a digital timer can be driven by the single device even under bending state, a flexible LED displayer of “TiC” logo also can be easily lighted by the MSC arrays under twisting, crimping, and winding conditions, demonstrating the scalable fabrication and application of the fabricated MSCs in portable electronics.

scholarly journals Impact of octreotide counterion nature on the long-term stability and release kinetics from an in situ forming depot technology

2021 ◽  
Vol 336 ◽  
pp. 457-468
Author(s):  
Charlotte Molinier ◽  
Marina Picot-Groz ◽  
Océane Malval ◽  
Sophie Le Lamer-Déchamps ◽  
Joël Richard ◽  
...  
Keyword(s):  
Release Kinetics ◽  
Term Stability ◽  
Long Term Stability ◽  
In Situ Forming ◽  
Counterion Nature

Innenrücktitelbild: In Situ Synthesis of Self-Assembled Gold Nanoparticles on Glass or Silicon Substrates through Reactive Inkjet Printing (Angew. Chem. 2/2014)

2013 ◽  
Vol 126 (2) ◽  
pp. 611-611
Author(s):  
Mutalifu Abulikemu ◽  
Eman Husni Da'as ◽  
Hanna Haverinen ◽  
Dongkyu Cha ◽  
Mohammad Azad Malik ◽  
...  
Keyword(s):  
Gold Nanoparticles ◽  
Inkjet Printing ◽  
In Situ Synthesis ◽  
Silicon Substrates ◽  
Self Assembled

scholarly journals Asymmetric Pd-NHC*-catalyzed coupling reactions

2012 ◽  
Vol 84 (8) ◽  
pp. 1741-1748 ◽  
Author(s):  
E. Peter Kündig ◽  
Yixia Jia ◽  
Dmitry Katayev ◽  
Masafumi Nakanishi
Keyword(s):  
High Temperature ◽  
Coupling Reactions ◽  
Structural Studies ◽  
Methylene Unit ◽  
Asymmetric Coupling ◽  
New Applications ◽  
Very High

Very high asymmetric inductions result in the Pd-catalyzed intramolecular arylation of amides to give 3,3-disubstituted oxindoles when new in situ-generated chiral N-heterocyclic carbene (NHC*) ligands are employed. Structural studies show that conformational locking to minimize allylic strain is the key to understanding the function of these ligands. New applications of these ligands in the frontier area of asymmetric coupling reactions involving C(sp3)–H bonds are detailed. Highly enantioenriched fused indolines are accessible using either preformed- or in situ-generated Pd-NHC* catalysts. Remarkably, this occurs at high temperature (140–160 °C) via excellent asymmetric recognition of an enantiotopic C–H bond in an unactivated methylene unit.

Sign in / Sign up

Export Citation Format

Share Document