High-Temperature-Resistant Interconnection Using Nickel Nanoparticles

2014 ◽  
Vol 2014 (1) ◽  
pp. 000561-000565 ◽  
Author(s):  
Yasunori Tanaka ◽  
Suguru Hashimoto ◽  
Tomonori Iizuka ◽  
Kohei Tatsumi ◽  
Norie Matsubara ◽  
...  
Keyword(s):  
High Temperature ◽  
Nickel Nanoparticles ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Temperature ◽  
Normal Operation ◽  
Aluminum Electrode ◽  
Temperature Environment ◽  
Bonding Method ◽  
Relaxation Structure ◽  
Bonding Characteristics

The bonding characteristics of nickel nanoparticles as a new alternative bonding material for high-temperature soldering was considered and a high bonding strength was achieved at a bonding temperature of 300°C. It was also revealed in a bonding experiment using a silicon dummy chip with a deposited aluminum layer that direct bonding to an aluminum electrode was possible. On the other hand, a stress-relaxation structure using a metal film was presented as a new structure for resolving the problem of deteriorating bonding reliability due to thermal stress arising from differences in the coefficient of thermal expansion between the chip and the substrate. A silicon carbide device was assembled using the new bonding method and an operating test was performed to verify normal operation in a high-temperature environment of approximately 300°C.

Low temperature Si-Si, SiO2-SiO2 covalent bonding structures with thin siloxane layer

2013 ◽  
Vol 2013 (1) ◽  
pp. 000424-000428
Author(s):  
Jeongyub Lee ◽  
Kunmo Chu ◽  
Yongyoung Park ◽  
Wooyoung Yang ◽  
Wenxu Xianyu ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Layer Thickness ◽  
Bonding Strength ◽  
Oxygen Plasma ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Oxygen Plasma Treatment ◽  
Adhesion Properties

We present new Si to Si, SiO2 to SiO2 bonding technologies for low temperature applications (<200°C). Direct bonding process between Si (or SiO2) substrates makes high bonding strength without contamination problems. However, high temperature over 1000°C is needed for the reliable Si to Si and SiO2 to SiO2 direct bonding processes. To reduce the bonding temperature, thin siloxane layer and low-powered oxygen plasma treatment was used in this study. We used dimethyl siloxane layer having siloxane chains (-Si-O-)n and methyl ends. Siloxane layer is able to be bonded strongly with Si-based substrates at low temperature (<200°C) when oxygen plasma is treated on it. Polymerized siloxane layer such as PDMS has much higher coefficient of thermal expansion (CTE) of 300ppm/K than Si of 2.6ppm/K. When the bonded structure is cooled or heated, the interfaces is possibly distorted and cracked by the high residual stress between siloxane layer and Si substrate. To solve these problems, we developed new fabrications of reducing the siloxane layer thickness to 3∼4nm, that is the monomer layer levels. Extremely thin thickness of siloxane layer prevented the problems of the CTE differences. The Si to Si bonding structure with siloxane layer showed strong adhesion properties in this study. The bonded body kept reliable bonding force when it was heated to high temperature (∼900°C). The feasible wafer-level bonding process was demonstrated. We investigated the siloxane layer thickness by TEM images. The bonding strength was confirmed by dicing test by 1mm and measured over 20MPa. We also expended this new development to SiO2 to SiO2 bonding structures. Low temperature bonding between non-Si substrates such as GaN was possible with thin siloxane layer when amorphous Si thin film was deposited on these substrates.

scholarly journals A Study On The Metal Carbide Composite Diffusion Bonding For Mechanical Seal

2015 ◽  
Vol 60 (2) ◽  
pp. 1479-1483 ◽  
Author(s):  
D.-K. Kim ◽  
I.-J. Shon ◽  
J. Song ◽  
W.-J. Ryu ◽  
H.-Ch. Shin ◽  
...  
Keyword(s):  
High Temperature ◽  
Test Specimen ◽  
Sintering Temperature ◽  
Bonding Temperature ◽  
Bonding Layer ◽  
Mechanical Seal ◽  
Metal Carbide ◽  
Carbide Alloy ◽  
Structural Applications ◽  
Bonding Characteristics

Abstract Mechanical Seal use highly efficient alternative water having a great quantity of an aqueous solution and has an advantage no corrosion brine. Metal Carbide composites have been investigated as potential materials for high temperature structural applications and for application in the processing industry. The existing Mechanical seal material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding O-ring and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The bonding statuses of this test specimen were excellent. The hardness of specimen and bonding rate were measured using ultrasound equipment. In this work, Powder of WC (involved VC, Cr), Co and Mo2C mixed by attrition milling for 24hours. Nanostructured WC-27.6wt.%Ni-1.5wt.%Si-0.11wt.%VC-1.1wt.%B4C composite were fabricated at 1190°C by high temperature vacuum furnace. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. Its relative density was about 99.7%. The mechanical properties (hardness and fracture toughness) were 87.2 HRA and 4.2 M·Pam1/2, respectively. The bonding status of this test specimen was excellent and the thickness of bonding layer was 20 ~30§ at 1050 and 1060°C bonding temperature.

Numerical Simulation and Experiment of the Fire Protecting System of the Manipulator in High Temperature Environment

2019 ◽  
Author(s):  
Byeong Cheon Kim ◽  
Kyoungsik Chang
Keyword(s):  
Numerical Simulation ◽  
High Temperature ◽  
Fire Protection ◽  
Cooling System ◽  
Normal Operation ◽  
Hydraulic Pressure ◽  
Flexible Pipe ◽  
Ansys Fluent ◽  
Temperature Environment ◽  
High Temperature Environment

Abstract In the present work, the strategy for cooling the manipulator in high temperature environment is studied using both numerical and experimental methods. Since the manipulator is designed to operate in the environment with the maximum 250 °C temperature, fire protection system and the cooling system should be installed for normal operation of the manipulator. The para-aramid-filament with the thickness of 0.5 mm and Graphite felt with the thickness of 5.5mm is considered for fire protection suit and air blowing technique is applied for cooling the electronic circuit and hydraulic pressure cylinders. For numerical simulation, ANSYS Fluent V18.2 is adopted to simulate the convective heat transfer flows and the radiation with the model, S2S (Surface to surface). Two types of blowing techniques are considered, global blowing and local one. Even though the global blowing at the inlet is most effective for cooling system, so much amount of compressed air is required, which means that extra big compression system should be added in the system. The local blowing is applied to the component with small holes of the flexible pipe and the magnitude of the local blowing mass flow rate is 0.0166kg/s. The technique of local blowing is more effective than the global blowing for cooling the system. To validate numerical simulation, the model is tested within the hot temperature chamber whose mean temperature is approximately 250 °C.

NILO ALLOY 36

Alloy Digest ◽  
1987 ◽  
Vol 36 (8) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Constant Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Iron Nickel

Abstract NILO alloy 36 is a binary iron-nickel alloy having a very low and essentially constant coefficient of thermal expansion at atmospheric temperatures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-79. Producer or source: Inco Alloys International Inc..

UNISPAN LR35

Alloy Digest ◽  
1971 ◽  
Vol 20 (1) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Operational Level

Abstract UNISPAN LR35 offers the lowest coefficient of thermal expansion of any alloy now available. It is a low residual modification of UNISPAN 36 for fully achieving the demanding operational level of precision equipment. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and surface treatment. Filing Code: Fe-46. Producer or source: Cyclops Corporation.

RED X-20

Alloy Digest ◽  
1960 ◽  
Vol 9 (2) ◽  
Keyword(s):  
Wear Resistance ◽  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Aluminum Silicon Alloy ◽  
Temperature Performance

Abstract RED X-20 is a heat treatable hypereutectic aluminum-silicon alloy with excellent wear resistance and a very low coefficient of thermal expansion. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: Al-89. Producer or source: Apex Smelting Company.

AA 4032

Alloy Digest ◽  
1990 ◽  
Vol 39 (7) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance

Abstract AA 4032 has a comparatively low coefficient of thermal expansion and good forgeability. The alloy takes on an attractive dark gray appearance when anodized which may be desirable in architectural applications. This datasheet provides information on composition, physical properties, hardness, tensile properties, and shear strength as well as fatigue. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Al-305. Producer or source: Various aluminum companies.

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