scholarly journals A Study On The Metal Carbide Composite Diffusion Bonding For Mechanical Seal

2015 ◽  
Vol 60 (2) ◽  
pp. 1479-1483 ◽  
Author(s):  
D.-K. Kim ◽  
I.-J. Shon ◽  
J. Song ◽  
W.-J. Ryu ◽  
H.-Ch. Shin ◽  
...  
Keyword(s):  
High Temperature ◽  
Test Specimen ◽  
Sintering Temperature ◽  
Bonding Temperature ◽  
Bonding Layer ◽  
Mechanical Seal ◽  
Metal Carbide ◽  
Carbide Alloy ◽  
Structural Applications ◽  
Bonding Characteristics

Abstract Mechanical Seal use highly efficient alternative water having a great quantity of an aqueous solution and has an advantage no corrosion brine. Metal Carbide composites have been investigated as potential materials for high temperature structural applications and for application in the processing industry. The existing Mechanical seal material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding O-ring and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The bonding statuses of this test specimen were excellent. The hardness of specimen and bonding rate were measured using ultrasound equipment. In this work, Powder of WC (involved VC, Cr), Co and Mo2C mixed by attrition milling for 24hours. Nanostructured WC-27.6wt.%Ni-1.5wt.%Si-0.11wt.%VC-1.1wt.%B4C composite were fabricated at 1190°C by high temperature vacuum furnace. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. Its relative density was about 99.7%. The mechanical properties (hardness and fracture toughness) were 87.2 HRA and 4.2 M·Pam1/2, respectively. The bonding status of this test specimen was excellent and the thickness of bonding layer was 20 ~30§ at 1050 and 1060°C bonding temperature.

High-Temperature-Resistant Interconnection Using Nickel Nanoparticles

2014 ◽  
Vol 2014 (1) ◽  
pp. 000561-000565 ◽  
Author(s):  
Yasunori Tanaka ◽  
Suguru Hashimoto ◽  
Tomonori Iizuka ◽  
Kohei Tatsumi ◽  
Norie Matsubara ◽  
...  
Keyword(s):  
High Temperature ◽  
Nickel Nanoparticles ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Temperature ◽  
Normal Operation ◽  
Aluminum Electrode ◽  
Temperature Environment ◽  
Bonding Method ◽  
Relaxation Structure ◽  
Bonding Characteristics

The bonding characteristics of nickel nanoparticles as a new alternative bonding material for high-temperature soldering was considered and a high bonding strength was achieved at a bonding temperature of 300°C. It was also revealed in a bonding experiment using a silicon dummy chip with a deposited aluminum layer that direct bonding to an aluminum electrode was possible. On the other hand, a stress-relaxation structure using a metal film was presented as a new structure for resolving the problem of deteriorating bonding reliability due to thermal stress arising from differences in the coefficient of thermal expansion between the chip and the substrate. A silicon carbide device was assembled using the new bonding method and an operating test was performed to verify normal operation in a high-temperature environment of approximately 300°C.

Study on high temperature resistant die bonding formed by Al/Ni nano-particles composite paste

2018 ◽  
Vol 2018 (1) ◽  
pp. 000442-000446
Author(s):  
Yasunori Tanaka ◽  
Tatsumasa Wakata ◽  
Norihiro Murakawa ◽  
Tomonori Iizuka ◽  
Kohei Tatsumi
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Bonding Temperature ◽  
Nano Particles ◽  
Bonding Layer ◽  
Ni Nanoparticles ◽  
Bonding Material ◽  
Chip Size ◽  
Bonding Technology ◽  
High Temperature Operation

Abstract In power modules using SiC devices, high temperature operation is expected. Therefore, a bonding technology having high temperature resistance of 250°C or more is required. In recent years, research on low temperature sintering bonding by Ag nanoparticles, Cu nanoparticles and sub-micron particles has been conducted as a new bonding technology corresponding to SiC power devices. Nanoparticles are sintered at a temperature much lower than the sintering temperature in ordinary powder metallurgy. We focus on Ni having high melting point and excellent corrosion resistance as a new bonding material and are conducting research on high temperature resistant interconnection technology using Ni nanoparticles. We have found that bonding is possible at a bonding temperature of 400°C or less and enable to interconnect SiC devices for high temperature operation. However, there are still following problems to be improved, as follows, especially for a large chip size : Voids formed in the bonding layer and cracks generaled stress caused by a difference in thermal expansion coefficient(CTE). In this paper, we propose a bonding material of composite paste in which Ni nanoparticles and Al particles are mixed. From the results of the research, it was found that the occurrence of cracks and gas void was suppressed by mixing Al particles. Also the thermal stress analysis by FEM, the addition of Al particles shows to reduce the thermal stress during thermal cycle test (TCT).

Lattice Imaging of Grain Boundaries in Ceramics

1977 ◽  
Vol 35 ◽  
pp. 114-115
Author(s):  
D. R. Clarke ◽  
G. Thomas
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Silicon Nitride ◽  
Grain Boundaries ◽  
High Temperature Strength ◽  
Current Interest ◽  
Lattice Imaging ◽  
Special Significance ◽  
Structural Applications ◽  
Refractory Ceramics

Grain boundaries have long held a special significance to ceramicists. In part, this has been because it has been impossible until now to actually observe the boundaries themselves. Just as important, however, is the fact that the grain boundaries and their environs have a determing influence on both the mechanisms by which powder compaction occurs during fabrication, and on the overall mechanical properties of the material. One area where the grain boundary plays a particularly important role is in the high temperature strength of hot-pressed ceramics. This is a subject of current interest as extensive efforts are being made to develop ceramics, such as silicon nitride alloys, for high temperature structural applications. In this presentation we describe how the techniques of lattice fringe imaging have made it possible to study the grain boundaries in a number of refractory ceramics, and illustrate some of the findings.

Electron Microscopy of Silicon Nitride-Based Ceramics

1991 ◽  
Vol 49 ◽  
pp. 926-927
Author(s):  
Gareth Thomas
Keyword(s):  
Electron Microscopy ◽  
High Temperature ◽  
Silicon Nitride ◽  
World Wide ◽  
Sintering Temperature ◽  
Liquid Phase Sintering ◽  
High Temperature Strength ◽  
Sintering Additives ◽  
Glass Forming ◽  
Dense Product

Silicon nitride and silicon nitride based-ceramics are now well known for their potential as hightemperature structural materials, e.g. in engines. However, as is the case for many ceramics, in order to produce a dense product, sintering additives are utilized which allow liquid-phase sintering to occur; but upon cooling from the sintering temperature residual intergranular phases are formed which can be deleterious to high-temperature strength and oxidation resistance, especially if these phases are nonviscous glasses. Many oxide sintering additives have been utilized in processing attempts world-wide to produce dense creep resistant components using Si3N4 but the problem of controlling intergranular phases requires an understanding of the glass forming and subsequent glass-crystalline transformations that can occur at the grain boundaries.

Crystallization sequence of an A1N-Y2O3-SiO2 glass-ceramic

1986 ◽  
Vol 44 ◽  
pp. 446-447
Author(s):  
T.R. Dinger ◽  
G. Thomas
Keyword(s):  
High Temperature ◽  
Glass Ceramic ◽  
Crystallization Behavior ◽  
High Stress ◽  
Crystallization Sequence ◽  
Sio2 Glass ◽  
Structural Applications ◽  
Ceramic Precursors

The use of Si3N4, alloys for high temperature, high stress structural applications has prompted numerous studies of the oxynitride glasses which exist as intergranular phases in their microstructures. Oxynitride glasses have been investigated recently in their bulk form in order to understand their crystallization behavior for subsequent Si3N4 applications and to investigate their worth as glass-ceramic precursors. This research investigates the crystallization sequence of a glass having a normalized composition of Y26Si30Al11 ON11 and lying in the A1N-Y2O3-SiO2 section of the Y-Si-Al-O-N system. Such glasses exist as intergranular phases in the technologically important Y2O3/Al2O3-fluxed Si3N4 alloys.

Electron energy loss near edge structures of intermetallic alloys and grain boundaries in NiAl

1996 ◽  
Vol 54 ◽  
pp. 522-523
Author(s):  
G.A. Botton ◽  
C.J. Humphreys
Keyword(s):  
High Temperature ◽  
Transition Metal ◽  
Energy Loss ◽  
Grain Boundaries ◽  
Industrial Applications ◽  
Edge Structure ◽  
Structural Applications ◽  
Yield Behaviour ◽  
Late Transition ◽  
Metal Aluminides

Transition metal aluminides are of great potential interest for high temperature structural applications. Although these materials exhibit good mechanical properties at high temperature, their use in industrial applications is often limited by their intrinsic room temperature brittleness. Whilst this particular yield behaviour is directly related to the defect structure, the properties of the defects (in particular the mobility of dislocations and the slip system on which these dislocations move) are ultimately determined by the electronic structure and bonding in these materials. The lack of ductility has been attributed, at least in part, to the mixed bonding character (metallic and covalent) as inferred from ab-initio calculations. In this work, we analyse energy loss spectra and discuss the features of the near edge structure in terms of the relevant electronic states in order to compare the predictions on bonding directly with spectroscopic experiments. In this process, we compare spectra of late transition metal (TM) to early TM aluminides (FeAl and TiAl) to assess whether differences in bonding can also be detected. This information is then discussed in terms of bonding changes at grain boundaries in NiAl.

Phase transformation and layer evolution in molybdenum disilicide-silicon carbide nanolayered coatings

1994 ◽  
Vol 52 ◽  
pp. 538-539
Author(s):  
H. Kung ◽  
T. R. Jervis ◽  
J.-P. Hirvonen ◽  
M. Nastasi ◽  
T. E. Mitchell ◽  
...  
Keyword(s):  
Phase Transformation ◽  
High Temperature ◽  
Oxidation Resistance ◽  
Elevated Temperatures ◽  
Matrix Material ◽  
Molybdenum Disilicide ◽  
High Temperature Strength ◽  
Cross Sectional ◽  
Good Oxidation Resistance ◽  
Structural Applications

MoSi2 is a potential matrix material for high temperature structural composites due to its high melting temperature and good oxidation resistance at elevated temperatures. The two major drawbacksfor structural applications are inadequate high temperature strength and poor low temperature ductility. The search for appropriate composite additions has been the focus of extensive investigations in recent years. The addition of SiC in a nanolayered configuration was shown to exhibit superior oxidation resistance and significant hardness increase through annealing at 500°C. One potential application of MoSi2- SiC multilayers is for high temperature coatings, where structural stability ofthe layering is of major concern. In this study, we have systematically investigated both the evolution of phases and the stability of layers by varying the heat treating conditions.Alternating layers of MoSi2 and SiC were synthesized by DC-magnetron and rf-diode sputtering respectively. Cross-sectional transmission electron microscopy (XTEM) was used to examine three distinct reactions in the specimens when exposed to different annealing conditions: crystallization and phase transformation of MoSi2, crystallization of SiC, and spheroidization of the layer structures.

WC-3015 Alloy

Alloy Digest ◽  
1974 ◽  
Vol 23 (5) ◽  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Base Alloy ◽  
Heat Treating ◽  
Rolled Sheet ◽  
Good Oxidation Resistance ◽  
Structural Applications ◽  
Cold Rolled

Abstract WC-3015 is a columbium-base alloy developed for structural applications in high-temperature oxidizing environments. It is characterized by good oxidation resistance, good mechanical properties and compatibility with silicide coatings. Cold-rolled sheet can be joined and welded without cracking. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on forming, heat treating, machining, joining, and surface treatment. Filing Code: Cb-21. Producer or source: Wah Chang, a Teledyne Corporation.

scholarly journals Pressureless Sintering of YIG Ceramics from Coprecipitated Nanopowders

2021 ◽  
Vol 7 (5) ◽  
pp. 56
Author(s):  
Yimin Yang ◽  
Xiaoying Li ◽  
Ziyu Liu ◽  
Dianjun Hu ◽  
Xin Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Calcination Temperature ◽  
Sintering Temperature ◽  
Raw Materials ◽  
Secondary Phase ◽  
Coprecipitation Method ◽  
Pressureless Sintering ◽  
Densification Behavior ◽  
Sintering Process

Nanoparticles prepared by the coprecipitation method were used as raw materials to fabricate Y3Fe5O12 (YIG) ceramics by air pressureless sintering. The synthesized YIG precursor was calcinated at 900–1100 °C for 4 h in air. The influences of the calcination temperature on the phase and morphology of the nanopowders were investigated in detail. The powders calcined at 1000–1100 °C retained the pure YIG phase. YIG ceramics were fabricated by sintering at 1200–1400 °C for 10 h, and its densification behavior was studied. YIG ceramics prepared by air sintering at 1250 °C from powders calcinated at 1000 °C have the highest in-line transmittance in the range of 1000-3000 nm. When the sintering temperature exceeds 1300 °C, the secondary phase appears in the YIG ceramics, which may be due to the loss of oxygen during the high-temperature sintering process, resulting in the conversion of Fe3+ into Fe2+.

The Influence of Bi2O3 on SiO2-Al2O3-B2O3-RO Glass Propertiesarts

2014 ◽  
Vol 887-888 ◽  
pp. 86-89
Author(s):  
Ying Liang Tian ◽  
Jing Zhang ◽  
Shi Bing Sun ◽  
Ji Ye Fan
Keyword(s):  
Electrical Resistivity ◽  
High Temperature ◽  
Expansion Coefficient ◽  
Bismuth Oxide ◽  
Sintering Temperature ◽  
Oxide Content ◽  
Basic Composition ◽  
Wide Range ◽  
Melt Annealing ◽  
Annealing Method

In the paper, regarded SiO2-Al2O3-B2O3-RO system as basic composition, high-temperature glass glaze was prepared successfully by using Bi2O3 in place of Al2O3, and traditional melt annealing method was adopted .The influence of Bi2O3 on expansion coefficient, sintering temperature, electrical resistivity was investigated by DIL-2008, SJY sintering imager, Keythley2410. The results show that the sintering temperature of glass glaze has a wide range, which can reach 270°C, so it is easy to sinter; with the increasing of bismuth oxide content, expansion coefficient of glass glaze gradually increases, whereas sintering temperature and electrical resistivity continuously decreases.

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