scholarly journals The Comparison of Water Cooling Media Against Radiator Heat Dissipation Rate in Diesel Engines

Author(s):  
Muhammad Sawaludin ◽  
Hasan Maksum ◽  
Wagino Wagino

This research was motivated by the large number of consumer requests for mechanics in workshops to replace the radiator coolant in diesel engines with reguler water. This research used an experimental research approach. The experimental research was often used to find the effect of existing variable and to test the hypotheses. Based on the results of testing and data analysis that have been carried out can be seen: there was an average decrease in the temperature of the cooling media from the engine due to using the cooling media from the manufacturer, a decrease in the rate of heat dissipation between reguler water and Prestone on each rotation with an average of 4.97%, the water with TOP 1 Coolant 5.11% and the water with Toyota SLCC at 6.64%. Based on the analysis of research data and statistical tests, it was concluded that the use of cooling media from the manufacturer can increase the heat transfer coefficient of the working fluid of the radiator, so that it can reduce the engine heat level and increase the rate of coolant heat dissipation. Penelitian ini dilatarbelakangi oleh banyaknya permintaan konsumen kepada mekanik di bengkel untuk mengganti air radiator pada mesin diesel dengan air biasa Penelitian ini digolongkan pada penelitian pendekatan eksperimen. Penelitian eksperimen sering digunakan untuk mencari pengaruh di antara variabel-variabel yang ada serta untuk pengujian hipotesis. Hasil pengujian dan analisis data yang telah dilakukan dapat diketahui: Terdapat rata-rata penurunan suhu media pendingin dari mesin akibat menggunakan media pendingin asal pabrikan, penurunan laju pembuangan panas antara air biasa dengan Prestone pada masing-masing putaran dengan rata-rata 4,97%, air dengan TOP 1 Coolant 5,11% dan air dengan Toyota SLCC sebesar 6,64%. Berdasarkan analisis data penelitian dan uji statistik yang dilakukan disimpulkan bahwa penggunaan media pendingin asal pabrikan dapat memperbesar koefisien perpindahan panas fluida kerja radiator sehingga dapat menurunkan tingkat panas mesin dan meningkatkan laju pembuangan panas cairan pendingin

The heat generated by a Slab Lasers can exceed 1,000 watts but the area available for cooling is too small. This results in localization of heat flux which makes heat dissipation a challenge in slab lasers. The Heat transfer coefficient can increase up to a very high range, which can’t be efficiently achieved by the conventional water cooling. Micro-channel coolers address this problem competently. These channels contain liquid, which transfers heat to the sink with high efficiency.The objective of this paper is to design the microchannel coolers that will be efficiently capable of removing the heat from the slab laser without causing any thermal distortion in the laser. The dimension of the slab is given as follows:-Length(l) =50mm, Width(w) =8mm and thickness(t)=2mm.


2003 ◽  
Vol 125 (1) ◽  
pp. 103-109 ◽  
Author(s):  
C. Ramaswamy ◽  
Y. Joshi ◽  
W. Nakayama ◽  
W. B. Johnson

The current study involves two-phase cooling from enhanced structures whose dimensions have been changed systematically using microfabrication techniques. The aim is to optimize the dimensions to maximize the heat transfer. The enhanced structure used in this study consists of a stacked network of interconnecting channels making it highly porous. The effect of varying the pore size, pitch and height on the boiling performance was studied, with fluorocarbon FC-72 as the working fluid. While most of the previous studies on the mechanism of enhanced nucleate boiling have focused on a small range of wall superheats (0–4 K), the present study covers a wider range (as high as 30 K). A larger pore and smaller pitch resulted in higher heat dissipation at all heat fluxes. The effect of stacking multiple layers showed a proportional increase in heat dissipation (with additional layers) in a certain range of wall superheat values only. In the wall superheat range 8–13 K, no appreciable difference was observed between a single layer structure and a three layer structure. A fin effect combined with change in the boiling phenomenon within the sub-surface layers is proposed to explain this effect.


2004 ◽  
Vol 126 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Rizos N. Krikkis ◽  
Stratis V. Sotirchos ◽  
Panagiotis Razelos

A numerical bifurcation analysis is carried out in order to determine the solution structure of longitudinal fins subject to multi-boiling heat transfer mode. The thermal analysis can no longer be performed independently of the working fluid since the heat transfer coefficient is temperature dependent and includes the nucleate, the transition and the film boiling regimes where the boiling curve is obtained experimentally for a specific fluid. The heat transfer process is modeled using one-dimensional heat conduction with or without heat transfer from the fin tip. Furthermore, five fin profiles are considered: the constant thickness, the trapezoidal, the triangular, the convex parabolic and the parabolic. The multiplicity structure is obtained in order to determine the different types of bifurcation diagrams, which describe the dependence of a state variable of the system (for instance the fin temperature or the heat dissipation) on a design (Conduction-Convection Parameter) or operation parameter (base Temperature Difference). Specifically the effects of the base Temperature Difference, of the Conduction-Convection Parameter and of the Biot number are analyzed and presented in several diagrams since it is important to know the behavioral features of the heat rejection mechanism such as the number of the possible steady states and the influence of a change in one or more operating variables to these states.


Author(s):  
Birce Dikici ◽  
Matthew J. Lehman

Surface tension and solution evaporation of aqueous solutions of sodium lauryl sulfate (SLS), ECOSURF™ EH-14, and ECOSURF™ SA-9 under natural convection is examined through experimental methods. SLS is an anionic surfactant while EH-14 and SA-9 are environmentally-friendly nonionic surfactants. Surfactants are known to affect evaporation performance of solutions and are studied in relation to water loss prevention and heat dissipation. Surfactants could be useful under drought conditions which present challenges to water management on a yearly basis in arid areas of the world. Recent water scarcity in the greater Los Angeles area, south eastern Africa nations, eastern Australia and eastern Mediterranean countries has high cost of water loss by evaporation. Surfactants are studied as a potential method of suppressing evaporation in water reservoirs. Surfactants are also studied as performance enhancers for the working fluid of heat dissipation devices, such as pulsating heat pipes used for electronics cooling. Some surfactants have been shown to lower thermal resistances and friction pressure in such devices and thereby increase their efficiency. The static surface tensions of the aqueous-surfactant solutions are measured with surface tensiometer using Wilhelmy plate method. The surfactants are shown to lower surface tension significantly from pure water. The surface tension values found at the Critical Micelle Concentration are 33.8 mN/m for SLS, 30.3 mN/m for EH-14, and 30.0 mN/m for SA-9. All three surfactants reduced natural convection water loss over 5 days with SLS showing the greatest effect on evaporation rates. The maximum evaporation reduction by each surfactant from distilled water with no surfactants after 5 days is 26.1% for SLS, 20.8% for EH-14, and 18.4% for SA-9.


2011 ◽  
Vol 314-316 ◽  
pp. 1846-1850 ◽  
Author(s):  
Shuai Guo ◽  
Z.N Guo ◽  
Hong Ping Luo ◽  
Wen Cai Gu

The mechanism of the elctrochemical mechanical polishing (ECMP) technology for micro tool electrode was investigated. In this paper, suitable major process parameters on the surface quality were evaluated, the major parameters contains electrical parameters, machining gap, the working fluid and other factors. In quantitative analyses, the process of the ECMP technology were conducted. The roughness of the workpiece was reduced from a relatively high value to a mirror effect.


Author(s):  
Gyoung-Man Kim ◽  
Byung-Guk Woo ◽  
Yong-Hwa Lee ◽  
Chan-Ho Kang ◽  
Tae-Won Chun ◽  
...  

2021 ◽  
Vol 2021 ◽  
pp. 1-13
Author(s):  
Yushan Lin ◽  
Zubair Ahmad ◽  
Wasswa Shafik ◽  
Saima K. Khosa ◽  
Zahra Almaspoor ◽  
...  

Marketing means the strategies and tactics an organization undertakes for attracting consumers to promote the buying or selling of a product or service. Active marketing is about receiving messages from potential buyers to create ways to influence their purchasing decisions. Advertising is one of the most prominent marketing strategies to promote products to consumers. It is well known that advertisement has a significant impact on the sale of certain goods or services. In this paper, we consider two mediums of advertisement, such as Facebook (which is an online medium) and Newspaper (which is a printed medium). We consider a dataset representing the advertising budget (in hundreds of US dollars) of an electronic company and the sales of that company. We apply the quantitative research approach, and the data which are used in this research are secondary data. For analysis purposes, we consider a statistical tool called simple linear regression modeling. To check the significance of the advertising on sale, definite statistical tests are applied. Based on the findings of this research, it is observed that advertising has a significant impact on sales. It is also showed that spending money on advertising through Facebook has better sales than newspapers. The finding of this research shows that the use of computer-based technologies and online mediums has a brighter future for advertising. Furthermore, a new statistical model is introduced using the Z family approach. The proposed model is very interesting and possesses heavy-tailed properties. Finally, the applicability of the proposed model is illustrated by considering the financial dataset.


Author(s):  
Fangyu Cao ◽  
Sean Hoenig ◽  
Chien-hua Chen

The increasing demand of heat dissipation in power plants has pushed the limits of current two-phase thermal technologies such as heat pipes and vapor chambers. One of the most obvious areas for thermal improvement is centered on the high heat flux condensers including improved evaporators, thermal interfaces, etc, with low cost materials and surface treatment. Dropwise condensation has shown the ability to increase condensation heat transfer coefficient by an order of magnitude over conventional filmwise condensation. Current dropwise condensation research is focused on Cu and other special metals, the cost of which limits its application in the scale of commercial power plants. Presented here is a general use of self-assembled monolayer coatings to promote dropwise condensation on low-cost steel-based surfaces. Together with inhibitors in the working fluid, the surface of condenser is protected by hydrophobic coating, and the condensation heat transfer is promoted on carbon steel surfaces.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000552-000557 ◽  
Author(s):  
Jun Taniguchi ◽  
Takeshi Shioga ◽  
Yoshihiro Mizuno

We demonstrate an etched silicon vapor chamber integrated with a through-silicon via (TSV) for 3D packaging. The Si vapor chamber chip enables low mismatch in the thermal expansion coefficient of a Si-LSI chip and provides a new heat dissipation path for 3D-LSI inter layer cooling. For the first prototype of the vapor chamber, an outside 33-mm × 33-mm chip consisting of a 25-mm × 25-mm area for the vapor chamber, a wick structure 30-μm high, and a vapor passage 100-μm high is developed. In-situ observation of the behavior of the working fluid through the cover glass and heat transfer enhancement is successfully demonstrated. The improvement rate of thermal resistance is 7.1% compared to a test chip without working fluid. Next, the fluid flow of a second vapor chamber prototype consisting of the first prototype integrated with a TSV structure using a Si pillar of 150-μm diameter is investigated. Thermal resistance and droplet observation conducted to evaluate the influence of the TSV. The operation of the vapor chamber is confirmed when a Si pillar is arranged to a coarse pitch of more than 500 μm. A droplet is generated and the vapor passage is partially obstructed. However, the droplet eventually degenerated and the performance of the vapor chamber is maintained. When the Si pillar is arranged to a fine pitch of 200 μm, the entire vapor passage is blocked during the liquid charging process, and no improvement is observed in the thermal resistance of the chip.


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