scholarly journals Acoustic Microscopy Imaging and Evaluation of Multi-Chip Modules.

HYBRIDS ◽  
1992 ◽  
Vol 8 (3) ◽  
pp. 31-33
Author(s):  
Steven R. Martell ◽  
Thomas E. Adams
2020 ◽  
Vol 11 ◽  
pp. 703-716
Author(s):  
Edgar Cruz Valeriano ◽  
José Juan Gervacio Arciniega ◽  
Christian Iván Enriquez Flores ◽  
Susana Meraz Dávila ◽  
Joel Moreno Palmerin ◽  
...  

In this work, a high-resolution atomic force acoustic microscopy imaging technique is developed in order to obtain the local indentation modulus at the nanoscale level. The technique uses a model that gives a qualitative relationship between a set of contact resonance frequencies and the indentation modulus. It is based on white-noise excitation of the tip–sample interaction and uses system theory for the extraction of the resonance modes. During conventional scanning, for each pixel, the tip–sample interaction is excited with a white-noise signal. Then, a fast Fourier transform is applied to the deflection signal that comes from the photodiodes of the atomic force microscopy (AFM) equipment. This approach allows for the measurement of several vibrational modes in a single step with high frequency resolution, with less computational cost and at a faster speed than other similar techniques. This technique is referred to as stochastic atomic force acoustic microscopy (S-AFAM), and the frequency shifts of the free resonance frequencies of an AFM cantilever are used to determine the mechanical properties of a material. S-AFAM is implemented and compared with a conventional technique (resonance tracking-atomic force acoustic microscopy, RT-AFAM). A sample of a graphite film on a glass substrate is analyzed. S-AFAM can be implemented in any AFM system due to its reduced instrumentation requirements compared to conventional techniques.


Author(s):  
Pierre-Antoine Meignen ◽  
Emmanuel Le Clezio ◽  
Thomas Delaunay ◽  
Gilles Despaux

2020 ◽  
Vol 10 (4) ◽  
pp. 1292
Author(s):  
Xiaonan Yu ◽  
Hairun Huang ◽  
Wanlong Xie ◽  
Jiefei Gu ◽  
Ke Li ◽  
...  

Flip chip technology has been widely used in various fields. As the density of the solder balls in flip chip technology is increasing, the pitch among solder balls is narrowing, and the size effect is more significant. Therefore, the micro defects of the solder balls are more difficult to detect. In order to ensure the reliability of the flip chip, it is very important to detect and evaluate the micro defects of solder balls. High-frequency ultrasonic testing technology is an effective micro-defect detection method. In this paper, the interaction mechanism between high-frequency ultrasonic pulse and micro defects is analyzed by finite element simulation. A transient simulation model for the whole process of ultrasonic scanning of micro defects is established to simulate scanning in acoustic microscopy imaging. The acoustic propagation path map is obtained for analyzing acoustic energy transmission during detection, and the edge blurring effect in micro-defect imaging detection is clarified. The processing method of the time-domain signal and cross-section image signal of micro defects based on sparse reconstruction is studied, which can effectively improve the accuracy of detection and the signal-to-noise ratio.


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