A Systematic Study and Characterization of Advanced Corrosion Resistance Materials and Their Applications for Plasma Etching Processes in Semiconductor Silicon Wafer Fabrication

The Zr -doped TiN coating, a nanometer (Ti, Zr)N thin film, has been deposited by reactive magnetron sputtering on slides and Al substrates. The crystalline phase and energy band structure have been analyzed by XRD and STS. The results of XRD show that the (Ti, Zr)N film is poly crystalline and consisted of mixed crystal of TiN and ZrN phase. The STS spectra show that Zr -doping didn't change the position and band-gap of energy level, only two new energy levels appeared, Eg = 0.33eV and Eg = 0.42eV. According to the results of measurement, (Ti, Zr)N has higher hardness and better corrosion resistance than TiN by Zr -doping.

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Retraction: “Depth Profile Characterization of Spin-Coated Poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonic acid) Films for Thin-Film Solar Cells during Argon Plasma Etching by Spectroscopic Ellipsometry”

Japanese Journal of Applied Physics ◽

10.7567/jjap.55.089201 ◽

2016 ◽

Vol 55 (8) ◽

pp. 089201

Author(s):

Tomohisa Ino ◽

Tatsuya Hayashi ◽

Keiji Ueno ◽

Hajime Shirai

Keyword(s):

Thin Film ◽

Solar Cells ◽

Depth Profile ◽

Plasma Etching ◽

Spectroscopic Ellipsometry ◽

Sulfonic Acid ◽

Argon Plasma ◽

Thin Film Solar Cells ◽

Styrene Sulfonic Acid

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Characterization of hybrid sol–gel coatings doped with hydrotalcite-like compounds to improve corrosion resistance of AA2024-T3 alloys

Progress in Organic Coatings ◽

10.1016/j.porgcoat.2009.09.023 ◽

2010 ◽

Vol 68 (1-2) ◽

pp. 91-99 ◽

Cited By ~ 14

Author(s):

D. Álvarez ◽

A. Collazo ◽

M. Hernández ◽

X.R. Nóvoa ◽

C. Pérez

Keyword(s):

Corrosion Resistance ◽

Sol Gel ◽

Improve Corrosion Resistance

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Characterization of the corrosion resistance of duplex stainless steels using local current density mapping techniques

10.2172/10132135 ◽

1994 ◽

Author(s):

A. Aldykiewicz ◽

H.S. Isaacs

Keyword(s):

Corrosion Resistance ◽

Current Density ◽

Stainless Steels ◽

Duplex Stainless Steels ◽

Local Current Density ◽

Density Mapping ◽

Local Current ◽

Mapping Techniques

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Fabrication of Ultra Thick Ferromagnetic Structures in Silicon

Microelectromechanical Systems ◽

10.1115/imece2004-61909 ◽

2004 ◽

Cited By ~ 1

Author(s):

Debbie G. Jones ◽

Albert P. Pisano

Keyword(s):

Electron Microscopy ◽

Thin Films ◽

Scanning Electron Microscopy ◽

Saturation Magnetization ◽

Silicon Wafer ◽

Fabrication Process ◽

Sem Images ◽

Deep Reactive Ion Etching ◽

Scanning Electron

A novel fabrication process is presented to create ultra thick ferromagnetic structures in silicon. The structures are fabricated by electroforming NiFe into silicon templates patterned with deep reactive ion etching (DRIE). Thin films are deposited into photoresist molds for characterization of an electroplating cell. Results show that electroplated films with a saturation magnetization above 1.6 tesla and compositions of approximately 50/50 NiFe can be obtained through agitation of the electrolyte. Scanning electron microscopy (SEM) images show that NiFe structures embedded in a 500 μm thick silicon wafer are realized and the roughening of the mold sidewalls during the DRIE aids in adhesion of the NiFe to the silicon.

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