Characterization of TiN films sputter-deposited at low temperatures for Cu-through-silicon via
2019 ◽
Vol 58
(SB)
◽
pp. SBBC03
◽
2001 ◽
Vol 81
(2)
◽
pp. 261-273
◽
Keyword(s):
2012 ◽
Vol 62
◽
pp. 47-50
◽
2007 ◽
Vol 46
(4A)
◽
pp. 1415-1426
◽
Keyword(s):