Development of High-Speed Copper Chemical Mechanical Polishing Slurry for Through Silicon Via Application Based on Friction Analysis Using Atomic Force Microscope

2011 ◽  
Vol 50 (5S1) ◽  
pp. 05ED04
Author(s):  
Jin Amanokura ◽  
Hiroshi Ono ◽  
Kyoko Hombo
Keyword(s):  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
High Speed ◽  
Mechanical Polishing ◽  
Through Silicon Via ◽  
Atomic Force ◽  
Friction Analysis

Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics

2008 ◽  
Vol 375-376 ◽  
pp. 278-282 ◽  
Author(s):  
Jun Li ◽  
Yong Zhu ◽  
Chuang Tian Chen
Keyword(s):  
Surface Roughness ◽  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
Brittle Materials ◽  
Mechanical Polishing ◽  
High Quality ◽  
Atomic Force ◽  
Hard And Brittle Materials ◽  
Quality Surface ◽  
High Quality Surface

Transparent Nd:YAG ceramics which are very hard and brittle materials, are very difficult to be polished. There are many micro scratches or damages on the surface after mechanical polishing with Al2O3. In order to remove micro scratches or damages, chemical mechanical polishing (CMP) was adopted to manufacture Nd:YAG ceramics. In the polishing experiment, Pellon and Chemcloth pads were utilized for chemical mechanical polishing of Nd:YAG ceramics. Colloidal SiO2 was selected as the polishing slurry in two different polishing environments, acidity and alkalinity. The surface roughness was determined by using atomic force microscope. In this study, four polishing experimental combinations that each combination contains one of the two pads and one of the two polishing environments were carried out in the optimum polishing condition. Then the high quality surface of transparent Nd:YAG ceramics with the best surface roughness of < 0.2 nm RMS and few micro scratches or damages is obtained by adopting CMP process with Chemcloth pad and colloidal SiO2 in acidic condition.

scholarly journals Simulation on Chemical Mechanical Polishing using Atomic Force Microscope

2005 ◽  
Vol 71 (701) ◽  
pp. 280-285 ◽  
Author(s):  
Atsushi MIYOSHI ◽  
Koei MATSUKAWA ◽  
Hiroshi MATSUO ◽  
Tadayuki SAKAI ◽  
Masaru NOZUE
Keyword(s):  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Atomic Force

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

2007 ◽  
Author(s):  
Joo Hoon Choi ◽  
Yangro Lee ◽  
Louis E. DeMarco ◽  
Richard T. Leveille ◽  
Joseph A. Levert ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
Surface Damage ◽  
Mechanical Polishing ◽  
Radius Of Curvature ◽  
Liquid Environment ◽  
Atomic Force ◽  
Friction Measurements ◽  
Circuit Components

The feature sizes on Integrated Circuits (ICs) continue to decrease to provide higher device densities and smaller chip designs. To accomplish this, current fabrication and processing technology must be advanced to achieve these goals. In particular, Chemical Mechanical Polishing (CMP), which is used for planarization of wafers and logic circuit components during IC fabrication, can cause severe surface damage to components in the form of delamination or distortion of surface features. CMP utilizes polishing particles suspended between a polymeric pad and the substrate to be polished. To control the process with higher precision the fundamentals of friction between CMP surfaces need to be analyzed. To investigate the friction contributions of the polishing particles in the CMP process, individual CMP abrasive particles are modeled by a silica atomic force microscope (AFM) probe with a radius of curvature on the order of 200 nm that is utilized in a scanning probe microscope (SPM). Lateral forces are measured that occur in simulated polishing of silica substrates and polyurethane pad material in a liquid environment. Results are obtained as a function of pH and environment and are compared with macroscopic friction results obtained using a high precision tribometer with a glass ball.

Simulation on chemical mechanical polishing using atomic force microscope

2005 ◽  
Vol 11 (8-10) ◽  
pp. 1102-1106 ◽  
Author(s):  
Atsushi Miyoshi ◽  
Hiroyuki Nakagawa ◽  
Koei Matsukawa
Keyword(s):  
Atomic Force Microscope ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Atomic Force

scholarly journals Redesigned Sensor Holder for an Atomic Force Microscope with an Adjustable Probe Direction

2021 ◽  
Author(s):  
Janik Schaude ◽  
Maxim Fimushkin ◽  
Tino Hausotte
Keyword(s):  
Atomic Force Microscope ◽  
Piezoelectric Actuator ◽  
High Speed ◽  
Closed Loop ◽  
Coefficient Of Thermal Expansion ◽  
Measuring System ◽  
Contact Mode ◽  
Loop Control ◽  
Atomic Force ◽  
Measuring Machine

AbstractThe article presents a redesigned sensor holder for an atomic force microscope (AFM) with an adjustable probe direction, which is integrated into a nano measuring machine (NMM-1). The AFM, consisting of a commercial piezoresistive cantilever operated in closed-loop intermitted contact-mode, is based on two rotational axes, which enable the adjustment of the probe direction to cover a complete hemisphere. The axes greatly enlarge the metrology frame of the measuring system by materials with a comparatively high coefficient of thermal expansion. The AFM is therefore operated within a thermostating housing with a long-term temperature stability of 17 mK. The sensor holder, connecting the rotational axes and the cantilever, inserted one adhesive bond, a soldered connection and a geometrically undefined clamping into the metrology circle, which might also be a source of measurement error. It has therefore been redesigned to a clamped senor holder, which is presented, evaluated and compared to the previous glued sensor holder within this paper. As will be shown, there are no significant differences between the two sensor holders. This leads to the conclusion, that the three aforementioned connections do not deteriorate the measurement precision, significantly. As only a minor portion of the positioning range of the piezoelectric actuator is needed to stimulate the cantilever near its resonance frequency, a high-speed closed-loop control that keeps the cantilever within its operating range using this piezoelectric actuator further on as actuator was implemented and is presented within this article.

scholarly journals Design and Fabrication of a High-Speed Atomic Force Microscope Scan-Head

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 362
Author(s):  
Luke Oduor Otieno ◽  
Bernard Ouma Alunda ◽  
Jaehyun Kim ◽  
Yong Joong Lee
Keyword(s):  
Atomic Force Microscope ◽  
Natural Frequency ◽  
High Speed ◽  
Contact Mode ◽  
Ongoing Process ◽  
Atomic Force ◽  
Constant Height ◽  
Mode Tracking

A high-speed atomic force microscope (HS-AFM) requires a specialized set of hardware and software and therefore improving video-rate HS-AFMs for general applications is an ongoing process. To improve the imaging rate of an AFM, all components have to be carefully redesigned since the slowest component determines the overall bandwidth of the instrument. In this work, we present a design of a compact HS-AFM scan-head featuring minimal loading on the Z-scanner. Using a custom-programmed controller and a high-speed lateral scanner, we demonstrate its working by obtaining topographic images of Blu-ray disk data tracks in contact- and tapping-modes. Images acquired using a contact-mode cantilever with a natural frequency of 60 kHz in constant deflection mode show good tracking of topography at 400 Hz. In constant height mode, tracking of topography is demonstrated at rates up to 1.9 kHz for the scan size of 1μm×1μm with 100×100 pixels.

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