scholarly journals Investigation on Die Crack in a Stacked Die Package Using Finite Element Analysis

2021 ◽  
pp. 83-91
Author(s):  
Jefferson Talledo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Coefficient Of Thermal Expansion ◽  
Crack Problem ◽  
Element Analysis ◽  
Robust Solution ◽  
Die Attach ◽  
Die Stress ◽  
Cte Mismatch ◽  
Semiconductor Packages

Die crack is one of the problems in stacked die semiconductor packages. As silicon dies become thinner in such packages due to miniaturization requirement, the tendency to have die crack increases. This study presents the investigation done on a die crack issue in a stacked die package using finite element analysis (FEA). The die stress induced during the package assembly processes from die attach to package strip reflow was analyzed and compared with the actual die crack failure in terms of the location of maximum die stress at unit level as well as strip level. Stresses in the die due to coefficient of thermal expansion (CTE) mismatch of the package component materials and mechanical bending of the package in strip format were taken into consideration. Comparison of the die stress with actual die crack pointed to strip bending as the cause of the problem and not CTE mismatch. It was found that the die crack was not due to the thermal processes involved during package assembly. This study showed that analyzing die stress using FEA could help identify the root cause of a die crack problem during the stacked die package assembly and manufacturing as crack occurs at locations of maximum stress. The die crack mechanism can also be understood through FEA simulation and such understanding is very important in coming up with robust solution.

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Theoretical Analysis and Engineering Improvement Test Verification of the Crack Problem in the Back Van of the Vehicle

2011 ◽  
Vol 121-126 ◽  
pp. 3431-3436
Author(s):  
Guo Quan Yang ◽  
You Qun Zhao ◽  
Jun Yan Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Theoretical Analysis ◽  
Crack Problem ◽  
Engineering Application ◽  
Reference Value ◽  
Element Analysis ◽  
Crack Problems ◽  
The Finite Element Analysis ◽  
Test Verification

This paper discussed the theoretical analysis and engineering improvement test verification of the crack problem in the back van of the vehicle. Causes that may result in the crack problem are firstly analyzed and then determined by the finite element analysis. Improvement are given and proved to be effective by the test verification of an improved vehicle. The method used in this paper will contribute to the analysis and solution of the crack problems in some parts of the vehicle and has reference value in engineering application.

The Implementation of Inter-Element Model for Crack Growth Simulation

2004 ◽  
Vol 261-263 ◽  
pp. 687-692 ◽  
Author(s):  
Ahmad Kamal Ariffin ◽  
Syifaul Huzni ◽  
Nik Abdullah Nik Mohamed ◽  
Mohd Jailani Mohd Nor
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Crack Propagation ◽  
Crack Growth ◽  
Crack Problem ◽  
Adaptive Mesh ◽  
Element Model ◽  
Error Norm ◽  
Element Analysis ◽  
Element Mesh

The implementation of inter-element model to simulate crack propagation by using finite element analysis with adaptive mesh is presented. An adaptive finite element mesh is applied to analyze two-dimension elastoplastic fracture during crack propagation. Displacement control approach and updated Lagrangean strategy are used to solve the non-linearity in geometry, material and boundary for plane stress crack problem. In the finite element analysis, remeshing process is based on stress error norm coupled with h-version mesh refinement to find an optimal mesh. The crack is modeled by splitting crack tip node and automatic remeshing calculated for each step of crack growth. Crack has been modeled to propagate through the inter-element in the mesh. The crack is free to propagates without predetermine path direction. Maximum principal normal stress criterion is used as the direction criteria. Several examples are presented to show the results of the implementation.

Finite Element Analysis of Thermal Stress for Femoral Prosthesis

2013 ◽  
Vol 750-752 ◽  
pp. 2212-2215
Author(s):  
Mo Nan Wang
Keyword(s):  
Finite Element Method ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Coefficient Of Thermal Expansion ◽  
Physical Property ◽  
Prosthetic Material ◽  
Femoral Prosthesis ◽  
Interface Failure ◽  
Element Analysis ◽  
Selection Of

Based on the thermo elasticity theory, the stress of femur prosthesis system was analyzed using finite element method. An evaluation for the selection of prosthetic material was presented after discussing the thermo physical property of material which had an effect on the stress of femur prosthesis system. The results indicate that the interface failure is the primary failure form of the femoral prosthesis system and the interface failure is accelerated for the reason of the thermal effect. So the prosthesis with low coefficient of thermal expansion should be selected which can moderate the interface failure in the certain degree.

scholarly journals Stress Modeling Study on Package Crack Due to Debris

2021 ◽  
pp. 118-124
Author(s):  
Jefferson Talledo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Crack Problem ◽  
Mold Material ◽  
Bending Stress ◽  
Element Analysis ◽  
Stress Modeling ◽  
Thin Semiconductor ◽  
Punching Process ◽  
Modeling Study

Very thin semiconductor package is very prone to package crack. This paper discusses the stress modeling study conducted to understand the package crack problem in a specific smart card package. Finite element analysis (FEA) was used to analyze the maximum package stress level and corresponding location to find out if the presence of debris during the package assembly punching process could cause such problem and how it would happen. Based on the stress results, it was confirmed that even with a 60μm-thick piece of debris under the package, crack at the top is possible due to package bending and mold stress exceeding the flexural strength of the package mold material. The stress increases as the debris location is moved closer to the area where force is applied during the punching process. The study shows that the presence of debris should not be taken for granted though how small the debris may seem because significantly high bending stress could still be induced especially for very thin packages. Eliminating any source of debris in the package assembly process.is very important to prevent package crack.

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