scholarly journals Predicting Silicon Die Breaking Force in Semiconductor Package Assembly through Mechanical Simulation

2021 ◽  
pp. 17-25
Author(s):  
Jefferson Talledo
Keyword(s):  
Loading Condition ◽  
Semiconductor Industry ◽  
Crack Problem ◽  
Cost Effective ◽  
Maximum Principal Stress ◽  
Assembly Process ◽  
Breaking Force ◽  
Element Analysis ◽  
Mechanical Simulation ◽  
Good Agreement

Die crack is a common problem in the semiconductor industry and being able to predict the breaking force at a given loading condition could help prevent such crack problem. This paper presents the use of mechanical simulation in predicting the force at which the silicon die breaks in semiconductor package assembly process. A computer simulation with finite element analysis (FEA) technique was used. The applied force or displacement in a die bending simulation with 3 mm, 4 mm and 15 mm support span was varied until the resulting maximum principal stress of the die becomes equal to its fracture strength. Results revealed that the breaking force for the 70 µm die with 6 mm width is around 5 N for the 3 mm support span and only around 1 N for the 15 mm support span. With the good agreement between modeling and actual results, the study showed that mechanical simulation is an effective approach in predicting die breaking force and can be used to simulate different mechanical loads in the package assembly where possible die crack could happen and be avoided. This is a fast and cost-effective way of assessing risk of die crack and obtaining package assembly process parameters and specifications that are safe to the silicon die.

Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology

2010 ◽  
Vol 2010 (1) ◽  
pp. 000170-000175
Author(s):  
Zhongping Bao ◽  
James Burrell
Keyword(s):  
Product Development ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Reliability Assessment ◽  
Assembly Process ◽  
Development Cost ◽  
Mechanical Reliability ◽  
Simulation Methodology ◽  
Mechanical Simulation ◽  
Package Reliability

Mechanical reliability issues in electronic packages have drawn significant attention in semiconductor industry for decades and have increased product development cost significantly. Recent rapid growth of various portable electronic devices like smartphone and smartbook with increasing demand for more functionality in tighter space further challenges the limit of mechanical reliability. To reduce the product development cost and time-to-market, mechanical simulation has been extensively employed in semiconductor industry for the purpose of design optimization and reliability assessment. The importance of having the correct simulation methodology can't be overemphasized considering the extent of its utilization throughout the product development cycle. In this paper, we will discuss three fundamental mechanical modeling methodologies that are widely used for simulating flip-chip overmolded packages. These approaches are generally used to simulate package warpage at End-of-Line (EOL) as well as to assess package reliability from a stress point of view. The first approach we studied in this paper is to assume that the package is initially stress-free at a given uniform temperature, which is usually taken to be the peak temperature of the mold cure profile. However, this differs from the actual assembly process where package composition and cure profiles are different at each assembly processing step. The second approach simply accounts for that fact and assigns different stress-free temperature to each individual package component. For example, the die is assumed to be stress-free at the chip attach temperature and substrate is assumed to be stress-free instead at the substrate baking temperature. This approach captures more physics compared to the first approach. The last approach explores that idea further by simulating the actual assembly process, step by step, through element removal and addition techniques available in the software. Such study is also carried out for a flip-chip overmolded package with Through-Silicon-Stacking (TSS) technology. Both Die-to-Die-first (D2D) and Die-to-Substrate-first (D2S) processes are examined. Simulated warpage, as well as reliability assessment regarding different failure mechanisms using these three modeling methodologies are discussed in detail. The paper is prepared to the best knowledge of authors and those statements do not necessarily reflect opinions of Qualcomm Inc. Some data shared in this paper is normalized such that no commercial confidential information is published.

scholarly journals ANALYSIS AND OPTIMAL DESIGN THE EFFECT OF DESIGN VARIABLES ON MAGANIFICATION RATIO OF A MAGANIFICATION MACHANISM EMPLOYING FLEXIBLE HINGE

2021 ◽  
Vol 45 (03) ◽  
Author(s):  
VAN- NANG DO
Keyword(s):  
Principal Stress ◽  
Compliant Mechanism ◽  
Maximum Principal Stress ◽  
Modal Shape ◽  
Element Analysis ◽  
Design Variables ◽  
Magnification Ratio ◽  
High Work ◽  
Good Agreement

In order to high work performant for compliant mechanism about motion scope, work long term and high frequency. Therefore, in this investigation displacement, maximum principal stress and the first modal shape frequency were analyzed by Finite element analysis (FEA) for a magnification mechanism to find out effects of design variables on magnification ratio of this mechanism. The FEA outcomes indicated that design variables have significantly affected on magnification ratio, maximum principal stress and the first modal shape frequency of a magnification mechanism. The magnification ratio obtained 42.83 times thereby maximum principal stress is equal to 132.79 MPa and the first modal shape frequency is equal to 377.44 Hz, respectively. The forecast results by the Taguchi method achieve a displacement of 0.4392 mm, and according to this method the optimal structure has a displacement of 0.4451 mm with the dimensions of the following variables: variable A is 0 mm, variable B is 23 mm and C is 60 mm, the parameters combine at the levels A1B2C1. This structure amplified 44.51 times, this result is a good agreement compared with the forecast results, the error compared to the forecast is 1.33%.the forecast results, the error compared to the forecast is 1.33%.

Boundary Element Analysis for Piezoelectric Cracks by an Interaction Integral

2015 ◽  
Vol 1120-1121 ◽  
pp. 1390-1394
Author(s):  
He Guo Liu ◽  
Jun Lei ◽  
Peng Bo Sun ◽  
Qing Sheng Yang
Keyword(s):  
Crack Problem ◽  
Crack Tip Field ◽  
Element Analysis ◽  
Interaction Integral ◽  
Center Crack ◽  
Field Intensity Factors ◽  
Boundary Element Analysis ◽  
Independent Behavior ◽  
Edge Crack Problem ◽  
Good Agreement

In this paper, an interaction integral is applied to evaluate the crack-tip field intensity factors for piezoelectric cracks by using BEM. Based on this, the fracture parameters for different crack configurations and loading conditions are analyzed in details for both the center crack and edge crack problem. According to the present results, the path-independent behavior of the interaction integral is verified. The comparison of the I-integral results with those by the J-integral and the displacement interpolating methods shows a good agreement.

Finite Element Analysis of Energy Saving Jointing Method Base on Energy Materials: Clinching

2012 ◽  
Vol 577 ◽  
pp. 9-12 ◽  
Author(s):  
Jun Chao Zheng ◽  
Xiao Cong He ◽  
Jing Nan Xu ◽  
Kai Zeng ◽  
Yan Fang Ding ◽  
...  
Keyword(s):  
Finite Element ◽  
Energy Saving ◽  
Cost Effective ◽  
Quality Parameter ◽  
Energy Materials ◽  
Forming Process ◽  
Element Analysis ◽  
Neck Thickness ◽  
Environmentally Friendly Process ◽  
Good Agreement

The clinch joining technique can be used to join energy saving materials based on a cost effective, environmentally friendly process. In this paper, the mechanical joining method by clinching with segmented die is analyzed utilizing a finite element method. A comparison is conducted about the principle of forming process and the metal flowing direction for two different types of die, drawing conclusions that a better interlocking length can be obtained using segmented die. Analyzing the quality parameter of the clinching results, finds the reason why the segmented die can get a better neck thickness and undercut. Meanwhile, the results of clinching with segmented die also show a good agreement with experimental results.

Computer Modeling of a Tire under Cornering Loads

1989 ◽  
Vol 17 (2) ◽  
pp. 86-99 ◽  
Author(s):  
I. Gardner ◽  
M. Theves
Keyword(s):  
Finite Element Analysis ◽  
Geometric Approach ◽  
Lateral Force ◽  
Slip Angle ◽  
Element Analysis ◽  
Pressure Distributions ◽  
Slip Effects ◽  
Improved Accuracy ◽  
Nonlinear Geometric ◽  
Good Agreement

Abstract During a cornering maneuver by a vehicle, high forces are exerted on the tire's footprint and in the contact zone between the tire and the rim. To optimize the design of these components, a method is presented whereby the forces at the tire-rim interface and between the tire and roadway may be predicted using finite element analysis. The cornering tire is modeled quasi-statically using a nonlinear geometric approach, with a lateral force and a slip angle applied to the spindle of the wheel to simulate the cornering loads. These values were obtained experimentally from a force and moment machine. This procedure avoids the need for a costly dynamic analysis. Good agreement was obtained with experimental results for self-aligning torque, giving confidence in the results obtained in the tire footprint and at the rim. The model allows prediction of the geometry and of the pressure distributions in the footprint, since friction and slip effects in this area were considered. The model lends itself to further refinement for improved accuracy and additional applications.

Parallel Computing for Tire Simulations

2011 ◽  
Vol 39 (3) ◽  
pp. 193-209 ◽  
Author(s):  
H. Surendranath ◽  
M. Dunbar
Keyword(s):  
High Performance ◽  
Effective Means ◽  
Cost Effective ◽  
Turnaround Time ◽  
Careful Consideration ◽  
Rolling Contact ◽  
Element Analysis ◽  
Parallel Solvers ◽  
Design Changes ◽  
Highly Nonlinear

Abstract Over the last few decades, finite element analysis has become an integral part of the overall tire design process. Engineers need to perform a number of different simulations to evaluate new designs and study the effect of proposed design changes. However, tires pose formidable simulation challenges due to the presence of highly nonlinear rubber compounds, embedded reinforcements, complex tread geometries, rolling contact, and large deformations. Accurate simulation requires careful consideration of these factors, resulting in the extensive turnaround time, often times prolonging the design cycle. Therefore, it is extremely critical to explore means to reduce the turnaround time while producing reliable results. Compute clusters have recently become a cost effective means to perform high performance computing (HPC). Distributed memory parallel solvers designed to take advantage of compute clusters have become increasingly popular. In this paper, we examine the use of HPC for various tire simulations and demonstrate how it can significantly reduce simulation turnaround time. Abaqus/Standard is used for routine tire simulations like footprint and steady state rolling. Abaqus/Explicit is used for transient rolling and hydroplaning simulations. The run times and scaling data corresponding to models of various sizes and complexity are presented.

scholarly journals Folding photopolymerized origami sheets by post-curing

2021 ◽  
Vol 3 (1) ◽  
Author(s):  
Xiaodong He ◽  
Christopher-Denny Matte ◽  
Tsz-Ho Kwok
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Maximum Principal Stress ◽  
Second Step ◽  
Post Processing ◽  
Element Analysis ◽  
Digital Light Processing ◽  
Processing Step ◽  
Lower Maximum

AbstractThe paper presents a novel manufacturing approach to fabricate origami based on 3D printing utilizing digital light processing. Specifically, we propose to leave part of the model uncured during the printing step, and then cure it in the post-processing step to set the shape in a folded configuration. While the cured regions in the first step try to regain their unfolded shape, the regions cured in the second step attempt to keep their folded shape. As a result, the final shape is obtained when both regions’ stresses reach equilibrium. Finite element analysis is performed in ANSYS to obtain the stress distribution on common hinge designs, demonstrating that the square-hinge has a lower maximum principal stress than elliptical and triangle hinges. Based on the square-hinge and rectangular cavity, two variables—the hinge width and the cavity height—are selected as principal variables to construct an empirical model with the final folding angle. In the end, experimental verification shows that the developed method is valid and reliable to realize the proposed deformation and 3D development of 2D hinges.

Probabilistic finite element analysis in heat transfer to a nuclear fuel rod bumper support

2004 ◽  
Vol 218 (12) ◽  
pp. 1499-1505
Author(s):  
Rama Subba Reddy Gorla
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Nuclear Fuel ◽  
Cost Effective ◽  
Distribution Functions ◽  
Cumulative Distribution ◽  
Element Analysis ◽  
Transfer Rates ◽  
Fuel Rod ◽  
Design Variables

Heat transfer from a nuclear fuel rod bumper support was computationally simulated by a finite element method and probabilistically evaluated in view of the several uncertainties in the performance parameters. Cumulative distribution functions and sensitivity factors were computed for overall heat transfer rates due to the thermodynamic random variables. These results can be used to identify quickly the most critical design variables in order to optimize the design and to make it cost effective. The analysis leads to the selection of the appropriate measurements to be used in heat transfer and to the identification of both the most critical measurements and the parameters.

Thermo-Mechanical Modeling and Analysis of Equal Channel Angular Pressing

2005 ◽  
Vol 23 ◽  
pp. 263-266 ◽  
Author(s):  
Qing Xiang Pei ◽  
B.H. Hu ◽  
C. Lu
Keyword(s):  
Equal Channel Angular Pressing ◽  
Temperature Rise ◽  
Flow Behavior ◽  
Material Model ◽  
Workpiece Material ◽  
Element Analysis ◽  
Modeling And Analysis ◽  
Die Geometry ◽  
Angular Pressing ◽  
Good Agreement

Thermo-mechanical finite element analysis was carried out to study the deformation behavior and temperature distribution during equal channel angular pressing (ECAP). The material model used is the Johnson-Cook constitution model that can consider the multiplication effect of strain, strain rate, and temperature on the flow stress. The effects of pressing speed, pressing temperature, workpiece material and die geometry on the temperature rise and flow behavior during ECAP process were investigated. The simulated temperature rise due to deformation heating was compared with published experimental results and a good agreement was obtained. Among the various die geometries studied, the two-turn die with 0° round corner generates the highest and most uniform plastic strain in the workpiece.

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