A Dual-Band Conformal Antenna Based on Highly Conductive Graphene-Assembled Films for 5G WLAN Applications

Flexible electronic devices are widely used in the Internet of Things, smart home and wearable devices, especially in carriers with irregular curved surfaces. Light weight, flexible and corrosion-resistant carbon-based materials have been extensively investigated in RF electronics. However, the insufficient electrical conductivity limits their further application. In this work, a flexible and low-profile dual-band Vivaldi antenna based on highly conductive graphene-assembled films (GAF) is proposed for 5G Wi-Fi applications. The proposed GAF antenna with the profile of 0.548 mm comprises a split ring resonator and open circuit half wavelength resonator to implement the dual band-notched characteristic. The operating frequency of the flexible GAF antenna covers the Wi-Fi 6e band, 2.4–2.45 GHz and 5.15–7.1 GHz. Different conformal applications are simulated by attaching the antenna to the surface of cylinders with different radii. The measured results show that the working frequency bands and the radiation patterns of the GAF antenna are relatively stable, with a bending angle of 180°. For demonstration of practical application, the GAF antennas are conformed to a commercial router. The spectral power of the GAF antenna router is greater than the copper antenna router, which means a higher signal-to-noise ratio and a longer transmission range can be achieved. All results indicate that the proposed GAF antenna has broad application prospects in next generation Wi-Fi.

Dynamic phase control with printing and fluidic materials' interaction by inkjet printing an RF sensor directly on a stereolithographic 3D printed microfluidic structure

RF electronics is inkjet-printed directly onto a 3D printed microfluidic structure using surface modification for the high conductivity, high resolution, and enhanced the interaction between a RF part and a fluid material.

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and 2-D materials and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including RF electronics and neuromorphic computing.

Inkjet-Printed Electronics on Paper for RF Identification (RFID) and Sensing

The newly developed research area of inkjet-printed radio frequency (RF) electronics on cellulose-based and synthetic paper substrates is introduced in this paper. This review paper presents the electrical properties of the paper substrates, the printed silver nanoparticle-based thin films, the dielectric layers, and the catalyst-based metallization process. Numerous inkjet-printed microwave passive/ative systems on paper, such as a printed radio frequency identification (RFID) tag, an RFID-enabled sensor utilizing carbon nanotubes (CNTs), a substrate-integrated waveguide (SIW), fully printed vias, an autonomous solar-powered beacon oscillator (active antenna), and artificial magnetic conductors (AMC), are discussed. The reported technology could potentially act as the foundation for true “green” low-cost scalable wireless topologies for autonomous Internet-of-Things (IoT), bio-monitoring, and “smart skin” applications.