Directional thermal channeling: A phenomenon triggered by tight packing of heat sources

Understanding nanoscale thermal transport is critical for nano-engineered devices such as quantum sensors, thermoelectrics, and nanoelectronics. However, despite overwhelming experimental evidence for nondiffusive heat dissipation from nanoscale heat sources, the underlying mechanisms are still not understood. In this work, we show that for nanoscale heat source spacings that are below the mean free path of the dominant phonons in a substrate, close packing of the heat sources increases in-plane scattering and enhances cross-plane thermal conduction. This leads to directional channeling of thermal transport—a novel phenomenon. By using advanced atomic-level simulations to accurately access the lattice temperature and the phonon scattering and transport properties, we finally explain the counterintuitive experimental observations of enhanced cooling for close-packed heat sources. This represents a distinct fundamental behavior in materials science with far-reaching implications for electronics and future quantum devices.

Ultrafast nanometric imaging of energy flow within and between single carbon dots

Time- and space-resolved excited states at the individual nanoparticle level provide fundamental insights into heterogeneous energy, electron, and heat flow dynamics. Here, we optically excite carbon dots to image electron–phonon dynamics within single dots and nanoscale thermal transport between two dots. We use a scanning tunneling microscope tip as a detector of the optically excited state, via optical blocking of electron tunneling, to record movies of carrier dynamics in the 0.1–500-ps time range. The excited-state electron density migrates from the bulk to molecular-scale (∼1 nm2) surface defects, followed by heterogeneous relaxation of individual dots to either long-lived fluorescent states or back to the ground state. We also image the coupling of optical phonons in individual carbon dots with conduction electrons in gold as an ultrafast energy transfer mechanism between two nearby dots. Although individual dots are highly heterogeneous, their averaged dynamics is consistent with previous bulk optical spectroscopy and nanoscale heat transfer studies, revealing the different mechanisms that contribute to the bulk average.

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and 2-D materials and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including RF electronics and neuromorphic computing.