Couplinator: A simple computational tool for synthesis of multi-section coupled-line filter based on MPCM-TLM technique

A new simple computational tool is proposed for the synthesis of multi-section coupled-line filters based on combined modified planar circuit method (MPCM) and transmission line method (TLM) analysis, referred to as MPCM-TLM. Due to its fundamentally simple architecture, the presented tool offers significantly faster optimization of coupled-line filters – for exactly the same initial simulation set-up – than other costly commercially-available tools, giving equally reliable results. Validity and accuracy of the proposed tool have been verified through the design of 3rd, 5th, and 7th order coupled-line filters and comparative analysis between results obtained from the proposed approach and the high-frequency structure simulator. A remarkable 99% time reduction in the analysis is recorded in the case of 7th order filter using the proposed tool, for almost identical results to HFSS. Therefore, it can be confidently claimed that the proposed technique can be used as a reliable alternative to existing complex, costly, processor-intensive CAD tools.

Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings for the most resilient interconnection. The method of test is wire bond pull testing that would represent a continuous strain on a connection and high acceleration testing of up to 50,000 g that would represent a sudden shock that electronics may experience in a drop or crash. Although these two environments may be similar to an overall energy exerted on the connection, the rate of force exerted may lead to different solutions. The results of this research provide insight into material selection for printed electronic interconnections and a framework for interconnection resiliency assessment, which is a critical aspect in realizing the production of next generation electronics technologies for the most demanding environments.

A Simple High-Resolution Near-Field Probe for Microwave Non-Destructive Test and Imaging

Non-destructive tests working at lower microwave frequencies have large advantages of dielectric material penetrability, lower equipment cost, and lower implementation complexity. However, the resolution will become worse as the work frequencies become lower. Relying on designing the structure of high field confinement, this study realizes a simple complementary spiral resonators (CSRs)-based near-field probe for microwave non-destructive testing (NDT) and imaging around 390 MHz (λ = 769 mm) whereby very high resolution (λ/308, 2.5 mm) is achieved. By applying an ingenious structure where a short microstrip is connected to a microstrip ring to feed the CSR, the probe, that is a single-port microwave planar circuit, does not need any extra matching circuits, which has more application potential in sensor arraying compared with other microwave probes. The variation of the electric field distribution with the standoff distance (SOD) between the material under test and the probe are analyzed to reveal the operation mechanisms behind the improved sensitivity and resolution of the proposed probe. Besides, the detection abilities of the tiny defects in metal and non-metal materials are demonstrated by the related experiments. The smallest detectable crack and via in the non-metal materials and the metal materials are of a λ/1538 (0.5 mm) width, a λ/513 (1.5 mm) diameter, a λ/3846 (0.2 mm) width and a λ/513 (1.5 mm) diameter, respectively. Moreover, to further evaluate the performance of the proposed probe, the defects under skin layer in the multilayer composite materials and the defects under corrosion in the carbon steel are inspected and imaged. Due to lower work frequency, high resolution, outstanding detection abilities of tiny defects, and large potentials in sensor arraying, the proposed probe would be a good candidate for microwave NDT and imaging.