Upgrading Die Attach Epoxy Dispensing Mechanism

This research paper addressed how to improve the Die Attach Pneumatic Time-Pressure Dispensing Valve. Different assessment and statistical validation comparing the efficiency of the Pneumatic Time-Pressure Dispensing Valve and Dispensing Volume Reduction. The Musashi Super Ʃ CMIII Dispenser with Sigma function controller provides more choices for regulating the volume of dispensing, since the residual material in the syringe decreases, and can be a more suitable method for dispensing glue. The consistency of the glue volume will be more consistent after the implementation of this update. This controller has the option to compensate for pressure and vacuum as the remaining fluid in the syringe decreases. The Musashi dispenser controller is equipped with an empty syringe detection system. As the remaining adhesive, this will avoid variations in dispensed volume.

Optimization of Dispensing Parameter to Eliminate the Excessive Epoxy Dispense in Die Attach

Excessive epoxy flow on the dispensing nozzle may result in epoxy tailings due to unoptimized dispensing parameters. This may cause various problems related to epoxy dispensing, such as epoxy splatter, epoxy on lead, and epoxy bridging. This research study is conducted to eliminate the cause of epoxy related defects. Optimization of dispensing parameter using Design of Experiment as a methodology to reduce the excessive epoxy PPM rate. And base on the DOE main effect plot, excessive epoxy dispense PPM reduces as Snuffback time increases or faster.

Optimization of Dispensing Parameter to Speed up the Die Attach Throughput

Driven by the company vision to become a high-volume manufacturing (HVM), increasing throughput in the manufacturing line is critical to meeting market demands. The ever-growing demand for integrated circuits in part requires additional capital investment to purchase new equipment such as die bonders to support the new requirement. Making the best of existing resources is often the most common approach to deal with this challenge. Defining the correct method and making the most of the secondary parameters necessary to increase the bonding speed by means of a creative analysis that made this article interesting. The objective of this project is to boost productivity by maximizing UPH to improve the epoxy writing process at Attach, which is a bottleneck area. Optimization of the dispensing sequence and the dispensing direction to improve and speed up the epoxy dispensing process unit per hour.

Managing Epoxy Tailing in Die Attach thru Design of Experiment

Die attach epoxy dispensing is an automated factory environment that creates some special challenges. A robust production process begins with an understanding of the adhesives in their fluid state and which important parameters must be controlled. One of the most common problems encountered with adhesives in Die attach process is epoxy tailing. Tailing in this sense means the peak of the dispensed material falls away from the center of the dot when the nozzle finishes dispensing. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality is given. In this research, epoxy-associated defects are eliminated by optimizing the Break tail parameter using the Design of Experiment (DOE) methodology. The DOE prediction profile result shows that the tailing parameters recommended is Broken tail delay: 200 ms and Break tail offset is 350 counts. This study is applicable for silver filled conductive adhesive epoxy with greater than 9K Viscosity and greater than 4 Thixotropic Index.