Managing Epoxy Tailing in Die Attach thru Design of Experiment

2020 ◽  
pp. 44-50
Author(s):  
Michael D. Capili
Keyword(s):  
Production Process ◽  
Design Of Experiment ◽  
Conductive Adhesive ◽  
Fluid State ◽  
Die Attach ◽  
Epoxy Dispensing ◽  
Common Problems ◽  
Adhesive Epoxy

Die attach epoxy dispensing is an automated factory environment that creates some special challenges. A robust production process begins with an understanding of the adhesives in their fluid state and which important parameters must be controlled. One of the most common problems encountered with adhesives in Die attach process is epoxy tailing. Tailing in this sense means the peak of the dispensed material falls away from the center of the dot when the nozzle finishes dispensing. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality is given. In this research, epoxy-associated defects are eliminated by optimizing the Break tail parameter using the Design of Experiment (DOE) methodology. The DOE prediction profile result shows that the tailing parameters recommended is Broken tail delay: 200 ms and Break tail offset is 350 counts. This study is applicable for silver filled conductive adhesive epoxy with greater than 9K Viscosity and greater than 4 Thixotropic Index.

scholarly journals Optimization of Dispensing Parameter to Eliminate the Excessive Epoxy Dispense in Die Attach

2021 ◽  
pp. 1-5
Author(s):  
Michael D. Capili
Keyword(s):  
Design Of Experiment ◽  
Research Study ◽  
Die Attach ◽  
Main Effect ◽  
Epoxy Dispensing

Excessive epoxy flow on the dispensing nozzle may result in epoxy tailings due to unoptimized dispensing parameters.  This may cause various problems related to epoxy dispensing, such as epoxy splatter, epoxy on lead, and epoxy bridging. This research study is conducted to eliminate the cause of epoxy related defects. Optimization of dispensing parameter using Design of Experiment as a methodology to reduce the excessive epoxy PPM rate. And base on the DOE main effect plot, excessive epoxy dispense PPM reduces as Snuffback time increases or faster.

scholarly journals Optimalisasi Variabel Pick and Place untuk Meningkatkan Output Proses Die Attach pada Fabrikasi Chip RFID

2021 ◽  
Vol 5 (1) ◽  
pp. 9-12
Author(s):  
Daniel Aturman Sinaga ◽  
Aditya Gautama Darmoyono ◽  
Dwi Imam Mulyono
Keyword(s):  
Design Of Experiment ◽  
Cycle Time ◽  
Die Attach ◽  
Pick And Place ◽  
Set Up

Pengaplikasian teknologi dapat mempermudah manusia dalam kehidupan sehari-hari. Salah satu tekonologi ini adalah RFID. Pada pembuatan chip RFID, timbul masalah pada proses pick and place yaitu terdapat beberapa variabel  set up mesin yang kurang optimal,  kendala tersebut membuat mesin kurang  efisien dalam waktu dan kualitas, sehingga dilakukan optimalisasi variabel-variabel tersebut. Proses optimalisasi pada penelitian ini tidak hanya mempertimbangkan cycle time yang minimum tetapi juga kualitas produk yang dihasilkan. Oleh karena itu pada tahap awal percobaan dicari selang nilai dari variabel-variabel yang akan dioptimalisasi. Pada selang ini produk yang dihasilkan masih masuk ke dalam spesifikasi kualitas yang telah ditentukan. Langkah selanjutnya adalah proses optimalisasi cycle time menggunakan Design of Experiment dengan metode RSM. Tujuannya meminimalisasikan cycle time sehingga produk dapat lebih banyak diproduksi tanpa mengorbankan kualitas. Hasil dari metoda ini adalah cycle time selama 3.188 detik dari yang sebelumnya 4.9 detik. Diketahui  pada satu leadframe terdapat 36 chip. Sehingga total waktu pick and place menurun menjadi 1.91 menit per leadframe (3.188x 36). Untuk perhitungan waktu die attach ditambah pick and place per leadframe adalah = 1.91 menit + 1.30 menit (epoxy application) + 1 menit (handling) + 0.35 menit (inspection) = 4.56 menit. Dari hasil perhitungan ini akan diperoleh UPH 13 leadframe, meningkat sebanyak 2 leadframe dari sebelumnya.

scholarly journals Upgrading Die Attach Epoxy Dispensing Mechanism

2021 ◽  
pp. 141-148
Author(s):  
Michael D. Capili
Keyword(s):  
Time Pressure ◽  
Detection System ◽  
Research Paper ◽  
Volume Reduction ◽  
Suitable Method ◽  
Statistical Validation ◽  
Die Attach ◽  
Sigma Function ◽  
Residual Material ◽  
Epoxy Dispensing

This research paper addressed how to improve the Die Attach Pneumatic Time-Pressure Dispensing Valve. Different assessment and statistical validation comparing the efficiency of the Pneumatic Time-Pressure Dispensing Valve and Dispensing Volume Reduction. The Musashi Super Ʃ CMIII Dispenser with Sigma function controller provides more choices for regulating the volume of dispensing, since the residual material in the syringe decreases, and can be a more suitable method for dispensing glue. The consistency of the glue volume will be more consistent after the implementation of this update. This controller has the option to compensate for pressure and vacuum as the remaining fluid in the syringe decreases. The Musashi dispenser controller is equipped with an empty syringe detection system. As the remaining adhesive, this will avoid variations in dispensed volume.

Garment Production Process Optimization Based on the Splicing of Knitting and Tatting Fabrics

2013 ◽  
Vol 680 ◽  
pp. 577-581
Author(s):  
Wei Zhen Wang ◽  
Xiao Nong Qian ◽  
Ya Zhen Wang ◽  
Dan Li
Keyword(s):  
Production Process ◽  
Process Optimization ◽  
Structural Characteristics ◽  
Process Reengineering ◽  
Process Technology ◽  
Specific Process ◽  
The Common ◽  
Common Problems ◽  
Post Production

Based on the splicing of knitting and tatting fabrics and the optimization of process realization route, the author tries to improve the drawbacks in traditional splicing of knitting and tatting fabrics in terms of process technology and thus extend their respective advantageous properties. Through the analysis of fabric properties difference, integration of structural characteristics of parts, optimization of sewing process and post-production process reengineering, the author proposes the prerequisites and principles related to the splicing of two fabrics, and discusses the common problems in the splicing of knitting and tatting fabrics and specific process optimization route.

scholarly journals Peningkatan Kualitas Produk dan Minimasi Pemborosan Dengan Mengunakan Pendekatan Six Sigma Pada Perusahaan Pakan Ternak

2020 ◽  
Vol 17 (2) ◽  
pp. 73
Author(s):  
Katon Muhammad ◽  
Kukuh Winarso ◽  
Ida Lumintu
Keyword(s):  
Production Process ◽  
Air Temperature ◽  
Design Of Experiment ◽  
Six Sigma ◽  
Production Line ◽  
Animal Feed ◽  
Raw Materials ◽  
Existing Problems ◽  
And Control

PT. XYZ is one of the animal feed companies which has some of the largest production units in Indonesia. This Feed Company has several brands of products on the market. The company's production line is indicated to have a problem, namely product defects. Defective products caused by the production process and also the process of storing raw materials and finished materials in the company. Related to the six sigma in it has a phase of define, measure, analyze, improve and control phases, is chosen to overcome the existing problems. From the define, measure and analyze phase, it is known that there are significant defects, namely defects with flea attributes in the production process, textures, lumps, and ticks in the inventory. From the results of the RPN assessment, it is known that tick defects on the production line are valued at 168, text 105 and ticks in the production process 90 so that from the results of the assessment the RPN is given recommendations for improvement with consideration of the highest RPN value. The recommended improvement recommendations are the installation of blowers and air temperature regulators in the company's storage section, conduct a design of experiment in stages to select the best raw materials by considering the quality problems of the products produced and thirdly, the improvement of the cleaning schedule in the cooler, spoting and also rotex on production machines to minimize the cause of defects.

Rheological characterization of a novel isotropic conductive adhesive – Epoxy filled with metal-coated polymer spheres

2013 ◽  
Vol 46 ◽  
pp. 784-793 ◽  
Author(s):  
Hoang-Vu Nguyen ◽  
Erik Andreassen ◽  
Helge Kristiansen ◽  
Rolf Johannessen ◽  
Nils Hoivik ◽  
...  
Keyword(s):  
Conductive Adhesive ◽  
Rheological Characterization ◽  
Isotropic Conductive Adhesive ◽  
Polymer Spheres ◽  
Adhesive Epoxy

scholarly journals Optimization of Dispensing Parameter to Speed up the Die Attach Throughput

2020 ◽  
pp. 39-44
Author(s):  
Michael D. Capili
Keyword(s):  
Integrated Circuits ◽  
Capital Investment ◽  
Writing Process ◽  
High Volume ◽  
Process Unit ◽  
Manufacturing Line ◽  
Die Attach ◽  
Epoxy Dispensing ◽  
Speed Up ◽  
Area Optimization

Driven by the company vision to become a high-volume manufacturing (HVM), increasing throughput in the manufacturing line is critical to meeting market demands. The ever-growing demand for integrated circuits in part requires additional capital investment to purchase new equipment such as die bonders to support the new requirement. Making the best of existing resources is often the most common approach to deal with this challenge. Defining the correct method and making the most of the secondary parameters necessary to increase the bonding speed by means of a creative analysis that made this article interesting. The objective of this project is to boost productivity by maximizing UPH to improve the epoxy writing process at Attach, which is a bottleneck area. Optimization of the dispensing sequence and the dispensing direction to improve and speed up the epoxy dispensing process unit per hour.

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