Combination of Ceramic Laser Micromachining and Printed Technology as a Way for Rapid Prototyping Semiconductor Gas Sensors

The work describes a fast and flexible micro/nano fabrication and manufacturing method for ceramic Micro-electromechanical systems (MEMS)sensors. Rapid prototyping techniques are demonstrated for metal oxide sensor fabrication in the form of a complete MEMS device, which could be used as a compact miniaturized surface mount devices package. Ceramic MEMS were fabricated by the laser micromilling of already pre-sintered monolithic materials. It has been demonstrated that it is possible to deposit metallization and sensor films by thick-film and thin-film methods on the manufactured ceramic product. The results of functional tests of such manufactured sensors are presented, demonstrating their full suitability for gas sensing application and indicating that the obtained parameters are at a level comparable to those of industrial produced sensors. Results of design and optimization principles of applied methods for micro- and nanosystems are discussed with regard to future, wider application in semiconductor gas sensors prototyping.

Improvement of Field Effect Capacity Type Gas Sensor Thermo Inertial Parameters by Using Laser Micromilling Technique

This paper presents a verification of technology aspects for improvement of field effect capacity type gas sensor parameters by using laser micromilling technique for fabrication ceramic surface mounting device (SMD) package and microheater for sustentation working temperature of metal-insulator-semiconductor structure (MIS structure). Innovative claims include: demonstration of flexible opportunities for new digital fabrication process flows based on laser micromilling tech: fast design of SMD sensor 3-D model, flexible changing topology of microheater, thick and thin film technology combination for reducing of power consumption. The results show possibility to fast fabrication functional sensor in customer ceramic SMD package with base 9x9 mm with twice reduced power consumption and improving mechanical properties compare with classical metal-glass microelectronic packages using before for such type sensors.

Technology of SMD MOX Gas Sensors Rapid Prototyping

This work discusses the design of flexible laser micromilling technology for fast prototyping of metal oxide based (MOX) gas sensors in SMD packages as an alternative to traditional silicon clean room technologies. By laser micromilling technology it is possible to fabricate custom Micro Electro Mechanical System (MEMS) microhotplate platform and also packages for MOX sensor, that gives complete solution for its integration in devices using IoT conception. The tests described in the work show the attainability of the stated results for the fabrication of microhotplates.

Parameter Studies of Ceramic MEMS Microhotplates Fabricated by Laser Micromilling Technology

This paper presents a modeling of technology aspects for fabrication ceramic microelectromechanical systems (MEMS) microhotplate and surface mounting device (SMD) packaging for (MOX) gas sensors applications. Innovative claims include: demonstration of flexible opportunities for new fabrication process flows based on laser micromilling tech; modeling of power consumption MEMS microhotplate depending on the thickness and topology; demonstration of necessity changing thick film technology of metallization to vacuum sputtering by reducing of power consumption. The results show possibility to fast fabrication of different topologies for ceramic MEMS microhotplate in form-factor of SOT-23 type SMD package.

Rapid Prototyping of MOX Gas Sensors in Form-Factor of SMD Packages

By laser micromilling technology it is possible to fabricate custom MEMS microhotplate platform and also SMD package for MOX sensor, that gives complete solution for integration in mobile devices-smart phones, tablets and etc. The 3D design and fabrication of MEMS microhotplates and packages products occurs simultaneously that give opportunity for ultra-fast time making unique solutions for MOX sensors (number of microhotplates, hot spot size on microhotplates, diameter holes in package cap and etc.) without looking at standard solutions (primarily the package type).