Laser Micromilling Technology as a Key for Rapid Ceramic MEMS Devices

2019 ◽  
Vol 82 (11) ◽  
pp. 1508-1512 ◽  
Author(s):  
K. Yu. Oblov ◽  
N. N. Samotaev ◽  
M. O. Etrekova ◽  
A. V. Gorshkova
2018 ◽  
Vol 207 ◽  
pp. 04003 ◽  
Author(s):  
Nikolay Samotaev ◽  
Konstantin Oblov ◽  
Anastasia Ivanova

The flexible laser micromilling technology for ceramic MEMS producing of microhotplate in the surface mounted device (SMD) package for the metal oxide (MOX) gas sensors is describing. There are discusses technological and economic aspects of small-scale production of gas MOX sensors in comparison with classical clean room technologies using for mass production MEMS devices. The main technical factors affecting on using MOX sensors in various applications are presented. Current results demonstrate that using described technology possible to manufacturing all parts of MOX gas sensor in the SMD form-factor SOT-23 package type.


2017 ◽  
Vol 137 (1) ◽  
pp. 46-47
Author(s):  
Takeshi Kohno ◽  
Masato Mihara ◽  
Ataru Tanabe ◽  
Takashi Abe ◽  
Masanori Okuyama ◽  
...  

2000 ◽  
Author(s):  
D. J. Chang ◽  
S. T. Amimoto ◽  
A. D. Birkitt
Keyword(s):  

2001 ◽  
Author(s):  
A. D. Johnson ◽  
Vikas Gupta
Keyword(s):  

2020 ◽  
Vol 12 ◽  
Author(s):  
Fang Wang ◽  
Jingkai Wei ◽  
Caixia Guo ◽  
Tao Ma ◽  
Linqing Zhang ◽  
...  

Background: At present, the main problems of Micro-Electro-Mechanical Systems (MEMS) temperature detector focus on the narrow range of temperature detection, difficulty of the high temperature measurement. Besides, MEMS devices have different response characteristics for various surrounding temperature in the petrochemical and metallurgy application fields with high-temperature and harsh conditions. To evaluate the performance stability of the hightemperature MEMS devices, the real-time temperature measurement is necessary. Objective: A schottky temperature detector based on the metal/n-ZnO/n-Si structures is designed to measure high temperature (523~873K) for the high-temperature MEMS devices with large temperature range. Method: By using the finite element method (FEM), three different work function metals (Cu, Ni and Pt) contact with the n-ZnO are investigated to realize Schottky. At room temperature (298K) and high temperature (523~873K), the current densities with various bias voltages (J-V) are studied. Results: The simulation results show that the high temperature response power consumption of three schottky detectors of Cu, Ni and Pt decreases successively, which are 1.16 mW, 63.63 μW and 0.14 μW. The response temperature sensitivities of 6.35 μA/K, 0.78 μA/K, and 2.29 nA/K are achieved. Conclusion: The Cu/n-ZnO/n-Si schottky structure could be used as a high temperature detector (523~873K) for the hightemperature MEMS devices. It has a large temperature range (350K) and a high response sensitivity is 6.35 μA/K. Compared with traditional devices, the Cu/n-ZnO/n-Si Schottky structure based temperature detector has a low energy consumption of 1.16 mW, which has potential applications in the high-temperature measurement of the MEMS devices.


2021 ◽  
pp. 1-1
Author(s):  
Mustafa Mert Torunbalci ◽  
Hasan Dogan Gavcar ◽  
Ferhat Yesil ◽  
Said Emre Alper ◽  
Tayfun Akin
Keyword(s):  

Micromachines ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 82
Author(s):  
Rafel Perelló-Roig ◽  
Jaume Verd ◽  
Sebastià Bota ◽  
Jaume Segura

CMOS-MEMS resonators have become a promising solution thanks to their miniaturization and on-chip integration capabilities. However, using a CMOS technology to fabricate microelectromechanical system (MEMS) devices limits the electromechanical performance otherwise achieved by specific technologies, requiring a challenging readout circuitry. This paper presents a transimpedance amplifier (TIA) fabricated using a commercial 0.35-µm CMOS technology specifically oriented to drive and sense monolithically integrated CMOS-MEMS resonators up to 50 MHz with a tunable transimpedance gain ranging from 112 dB to 121 dB. The output voltage noise is as low as 225 nV/Hz1/2—input-referred current noise of 192 fA/Hz1/2—at 10 MHz, and the power consumption is kept below 1-mW. In addition, the TIA amplifier exhibits an open-loop gain independent of the parasitic input capacitance—mostly associated with the MEMS layout—representing an advantage in MEMS testing compared to other alternatives such as Pierce oscillator schemes. The work presented includes the characterization of three types of MEMS resonators that have been fabricated and experimentally characterized both in open-loop and self-sustained configurations using the integrated TIA amplifier. The experimental characterization includes an accurate extraction of the electromechanical parameters for the three fabricated structures that enables an accurate MEMS-CMOS circuitry co-design.


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