Plasma Etching Pre-treatment for a TEM Lamella Preparation of 3D NAND with High Aspect Ratio

The 3D NAND sample with high aspect ratio (HAR) etched by plasma was investigated. By controlling the plasma etching parameters, a relatively high etch rate could be obtained. Moreover, with appropriately controlling the etch time, we could etch top region of HAR sample with expected number of layers, which could help us to completely analyze the high aspect ratio sample with TEM cross-section analysis, especially for the middle region of 3D NAND.

Yield and Failure Analysis of FinFET Source to Drain Leakage in 12nm Technology

Fault localization using both dynamic laser stimulation and emission microscopy was used to localize the failing transistors within the failing scan chain latch on multiple samples. Nanoprobing was then performed and the source to drain leakage in N-type FinFETs was identified. After extensive detailed characterization, it was concluded that the N-type dopant signal was likely due to projections from the source/drain regions included in the TEM lamella. Datamining identified the scan chain fail to be occurring uniquely for a specific family of tools used during source/drain implant diffusion activation. This paper discusses the processes involved in yield delta datamining of FinFET and its advantages over failure characterization, fault localization, nanoprobing, and physical failure analysis.

A Solution for Obtaining an Advanced Lamella Geometry on the Grid with a Single Manipulation Step

A protocol for obtaining an advanced TEM lamella geometry using FIB-SEM is presented. Lamella lift-out procedure might require multiple manipulation steps or even breaking the vacuum in order to reach inverted or plan-view lamella geometries. We have developed a setup which enables lamella transfer from a bulk sample onto a TEM grid within a single, very simple manipulation step, with no need to break the vacuum or unload the sample. Most importantly, this approach does not require any additional devices to be installed.

Study of Micro Structural Material Changes after WEDM Based on TEM Lamella Analysis

Wire electrical discharge machining is an unconventional machining technology that is crucial in many industries. The surface quality of the machined parts is carefully monitored, but the condition of the subsurface layer also plays a crucial role, especially in case of defects occurrence such as cracks or burnt cavities. The subsurface layer of individual materials is affected differently due to wire electrical discharge machining. For this reason, this study was carried out focusing on a detailed analysis of transmission electron microscope (TEM) lamella made of Ti-6Al-4V titanium alloy, AlZn6Mg2Cu aluminum alloy, pure molybdenum, Creusabro 4800 steel, and Hardox 400 steel. The attention was first of all paid to the concentration and distribution of individual elements in the recast layer and also in the base material, which was often affected by wire electrical discharge machining. Further, a diffraction analysis was performed for each TEM lamella in the adhesive area and in the base material area. In order to assess the macro-effects on the machined material, the topography analysis of the machined surfaces and the morphology analysis were performed using electron microscopy.

Applying a Significant Protection Layer on Double Ex Situ Lift-out TEM Specimens to Protect Against Ion Beam Impact

Protection layers on double ex situ lift-out TEM specimens were investigate in this paper and two protection layer approaches for double INLO or double EXLO were introduced. The improved protection methods greatly decreased the damage layer on the top surface from 90 nm to 5 nm (or lower) during FIB milling. According to the property of different sample and its preliminary treatment in the FIB, we have the satisfactory approaches to be applied. Using this improved protection method, we demonstrate the structures within the TEM lamella can be observed without ion beam damage/implantation during FIB