Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

The aim of this research was to characterize soldering alloys of the type Sn–Sb–Ti and to study the ultrasonic soldering of SiC ceramics with a metal–ceramic composite of the type Cu–SiC. The Sn5Sb3Ti solder exerts a thermal transformation of a peritectic character with an approximate melting point of 234 °C and a narrow melting interval. The solder microstructure consists of a tin matrix, where the acicular constituents of the Ti6(Sb,Sn)5 phase and the sharp-edged constituents of the TiSbSn phase are precipitated. The tensile strength of the soldering alloy depends on the Ti content and reaches values from 34 to 51 MPa. The average strength of the solder increases with increasing Ti content. The bond with SiC ceramics is formed owing to the interaction of titanium, activated by ultrasound, with SiC ceramics, forming the (Ti,Si)6(Sb,Sn)5 reaction product. The bond with the metal–ceramic composite Cu–SiC is formed owing to the solubility of Cu in a tin solder forming two phases: the wettable η-Cu6Sn5 phase, formed in contact with the solder, and the non-wettable ε-Cu3Sn phase, formed in contact with the copper composite. The average shear strength of the combined joint of SiC/Cu–SiC fabricated using the Sn5Sb3Ti solder was 42.5 MPa. The Sn–Sb–Ti solder is a direct competitor of the S-Bond active solder. The production of solders is cheaper, and the presence of antimony increases their strength. In addition, the application temperature range is wider.

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Study of Zn6Al6Ag Alloy Application in Ultrasonic Soldering of Al2O3–(Al/Al2O3) Joints

Metals ◽

10.3390/met10030343 ◽

2020 ◽

Vol 10 (3) ◽

pp. 343 ◽

Cited By ~ 1

Author(s):

Roman Kolenak ◽

Igor Kostolny ◽

Jaromir Drapala ◽

Paulina Babincova ◽

Matej Pasak

Keyword(s):

Ceramic Composite ◽

Bond Formation ◽

Adhesive Bond ◽

Eutectic Structure ◽

Joint Shear Strength ◽

Al2o3 Ceramic ◽

Metal Ceramic ◽

Solder Microstructure ◽

Ultrasonic Soldering ◽

Al Matrix

The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal–ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C. The solder microstructure consists of a (Zn) + (Al) matrix, reinforced with a silver AgZn3 phase. A bond with the metal–ceramic composite was formed due to the dissolution of Al in the liquid Zn solder. The Al2O3 particles were put into motion, and a new composite was formed on the boundary. The Zn6Al6Ag solder also wetted the surface of the Al2O3 ceramic. A decisive effect on bond formation was caused by zinc and aluminum, whose oxides were combined with the oxides of ceramic material during in-air soldering. An adhesive bond was formed. The average joint shear strength of Al2O3/metal–ceramic composite (Al/Al2O3) was found to be 23 MPa.

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Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Metals ◽

10.3390/met11040624 ◽

2021 ◽

Vol 11 (4) ◽

pp. 624

Author(s):

Roman Kolenak ◽

Igor Kostolny ◽

Jaromir Drapala ◽

Paulina Babincova ◽

Peter Gogola

Keyword(s):

Eutectic Reaction ◽

Research Work ◽

Copper Substrate ◽

Liquid Bismuth ◽

Alloy Type ◽

Average Shear Strength ◽

Average Shear ◽

The Matrix ◽

Solder Microstructure ◽

Ultrasonic Soldering

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

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Corrosion resistant metal-ceramic composite coatings for tribological applications

Journal of Tribology ◽

10.1115/1.4052867 ◽

2021 ◽

pp. 1-34

Author(s):

Peter Renner ◽

Swarn Jha ◽

Yan Chen ◽

Tariq Chagouri ◽

Serge Kazadi ◽

...

Keyword(s):

Ceramic Composite ◽

Low Cost ◽

Composite Coatings ◽

Salt Spray ◽

Extreme Environments ◽

Safe Procedure ◽

Corrosion Resistant ◽

Wide Range ◽

Metal Ceramic ◽

Corrosion Resistant Coatings

Abstract Effective design of corrosion-resistant coatings is critical for the protection of metals and alloys. Many state-of-the-art corrosion-resistant coatings are unable to satisfy the challenges in extreme environments for tribological applications, such as elevated or cryogenic temperatures, high mechanical loads and impacts, severe wear, chemical attack, or a combination of these. The nature of challenging conditions demands that coatings have high corrosion and wear resistance, sustained friction control, and maintain surface integrity. In this research, multi-performance metal-ceramic composite coatings were developed for applications in harsh environments. These coatings were developed with an easy to fabricate, low-cost, and safe procedure. The coating consisted of boron nitride, graphite, silicon carbide, and transition metals such as chromium or nickel using epoxy as vehicle and bonding agent. Salt spray corrosion tests showed that 1010 carbon steel (1/4 hard temper) substrates lost 20-100× more mass than the coatings. The potentiodynamic polarization study showed better performance of the coatings by seven orders of magnitude in terms of corrosion relative to the substrate. Additionally, the corrosion rates of the coatings with Ni as an additive were five orders of magnitude lower than reported. The coefficient of friction of coatings was as low as 0.1, five to six times lower than that of epoxy and lower than a wide range of epoxy resin-based coatings found in literature. Coatings developed here exhibited potential in applications in challenging environments for tribological applications.

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Sub-100 μm SnAg Solder Bumping Technology and the Bump Reliability

Journal of Electronic Packaging ◽

10.1115/1.2957333 ◽

2009 ◽

Vol 131 (1) ◽

Cited By ~ 1

Author(s):

Xiaoqin Lin ◽

Le Luo

Keyword(s):

Cu6sn5 Phase ◽

X Ray ◽

Solder Bumps ◽

Average Shear Strength ◽

Average Shear ◽

Snag Solder ◽

Packaging Industry ◽

Negative Impacts ◽

Free Solder ◽

Electroplating Process

Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13×13 area-array Sn/3.0Ag solder bumps of 70 μm in height and 90 μm in diameter were fabricated with a smooth and shiny surface and with a uniform distribution of Ag. During multireflow, the scalloped Cu6Sn5 phase grows by a ripening process. Volume shrinkage was the main reason for the formation of microvoids during multireflow. The average shear strength of solder bumps on TiW/Cu under bump metallurgy (UBM) increased with reflow times. The electroplating process is suitable for mass production of well-controlled geometry and uniformity of SnAg solder bumps. Microvoids have trivial negative impacts on the solder bonds. The combination of TiW/Cu UBM and SnAg solder is reliable.

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