Materials for Stretchable Electronics Compliant with Printed Circuit Board Fabrication

2012 ◽  
pp. 161-185
Author(s):  
Matthias Adler ◽  
Ruth Bieringer ◽  
Thomas Schauber ◽  
Jürgen Günther
2012 ◽  
pp. 207-233 ◽  
Author(s):  
Jan Vanfleteren ◽  
Frederick Bossuyt ◽  
Thomas Löher ◽  
Yung-Yu Hsu ◽  
Mario Gonzalez ◽  
...  

2021 ◽  
Author(s):  
Jiheong Kang ◽  
Wonbeom Lee ◽  
Hyunjun Kim ◽  
Inho Kang ◽  
Hongjun Park ◽  
...  

Abstract Stretchable electronics are considered next-generation electronic devices in a broad range of emerging fields, including soft robotics1,2, biomedical devices3,4, human-machine interfaces5,6, and virtual or augmented reality devices7,8. A stretchable printed circuit board (S-PCB) is a basic conductive framework for the facile assembly of system-level stretchable electronics with various electronic components. Since an S-PCB is responsible for electrical communications between numerous electronic components, the conductive lines in S-PCB should strictly satisfy the following features: (i) metallic conductivity, (ii) constant electrical resistance during dynamic stretching, and (iii) tough interface bonding with various components9. Despite recent significant advances in intrinsically stretchable conductors10,11,12, they cannot simultaneously satisfy the above stringent requirements. Here, we present a new concept of conductive liquid network-based elastic conductors. These conductors are based on unprecedented liquid metal particles assembled network (LMPNet) and an elastomer. The unique assembled network structure and reconfigurable nature of the LMPNet conductor enabled high conductivity, high stretchability, tough adhesion, and imperceptible resistance changes under large strains, which enabled the first elastic-PCB (E-PCB) technology. We synthesized LMPNet through an acoustic field-driven cavitation event in the solid state. When an acoustic field is applied, liquid metal nanoparticles (LMPnano) are remarkably generated from original LMPs and assemble into a highly conductive particle network (LMPNet). Finally, we demonstrated a multi-layered E-PCB, in which various electronic components were integrated with tough adhesion to form a highly stretchable health monitoring system. Since our synthesis of LMPNet is universal, we could synthesize LMPNet in various polymers, including hydrogel, self-healing elastomer and photoresist and add new functions to LMPNet.


Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 617
Author(s):  
Duho Cho ◽  
Junhyung Kim ◽  
Pyoenggeun Jeong ◽  
Wooyoung Shim ◽  
Su Yeon Lee ◽  
...  

A stretchable printed circuit board (PCB), which is an essential component of next-generation electronic devices, should be highly stretchable even at high levels of integration, as well as durable under repetitive stretching and patternable. Herein, an island-structured stretchable PCB composed of materials with controlled Young’s modulus and viscosity by adding a reinforcing agent or controlling the degree of crosslinking is reported. Each material was fabricated with the most effective structures through a 3D printer. The PCB was able to stretch 71.3% even when highly integrated and was patterned so that various components could be mounted. When fully integrated, the stress applied to the mounted components was reduced by 99.9% even when stretched by over 70%. Consequently, a 4 × 4 array of capacitance sensors in a stretchable keypad demonstration using our PCB was shown to work, even at 50% stretching of the PCB.


2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Yongkai Li ◽  
Weixuan Liu ◽  
Yang Deng ◽  
Wei Hong ◽  
Hongyu Yu

AbstractOrigami, an ancient form of papercraft, provides a way to develop functional structures for engineering applications. In this paper, we report an approach to design and manufacture a stretchable circuit board (SCB) with origami structures. The benefits of developable, flat-foldable, and rigid-foldable origami-based structures as SCBs are discussed, and a representative structure, Miura fold (or Miura-ori), is chosen to be investigated. Under the constraints induced by the mounted components’ dimensions, the Miura-ori structures for specific applications can be defined. We propose three methods for better fabrication, including direct folding, stiffness modification, and kirigami enhancement, to improve a planar sheet’s foldability. A wearable ECG (electrocardiogram) system based on MO-SCB (Miura-ori enabled SCB) technology is built, and the stretchable portion is made of commercial FPCBs (flexible printed circuit board), providing desired stretchability and reliability. The proposed technology routine is compatible with industrial production and may pave the application of stretchable electronics.


Author(s):  
Apoorv Sharma ◽  
Rahul Rai

In this paper, we outline a hybrid process to print stretchable electronic circuits on non-planar surfaces. Using this process, the stretchable structures, generated using traditional printed circuit board fabrication technology can be printed on conformal surfaces using transfer printing by PDMS membranes. Three different configurations of stretchable structures for use in the circuits are also compared for their robustness of shape representation and structural strength. The application of the proposed process is illustrated through application examples.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


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