Effect of microencapsulated curing agents on the curing behavior for diglycidyl ether of bisphenol A epoxy resin systems
2007 ◽
Vol 107
(3)
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pp. 1661-1669
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2007 ◽
Vol 45
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pp. 2481-2496
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2008 ◽
Vol 46
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pp. 2155-2165
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2006 ◽
Vol 291
(2)
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pp. 181-193
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2013 ◽
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pp. 81-88
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2012 ◽
Vol 476-478
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pp. 665-669
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