ChemInform Abstract: Growth, Morphology and Structural Perfection of Dislocation-Free Si Tetracrystals.

ChemInform ◽  
2010 ◽  
Vol 28 (3) ◽  
pp. no-no
Author(s):  
N. I. PUZANOV ◽  
A. M. EIDENZON
Author(s):  
K.M. Jones ◽  
M.M. Al-Jassim ◽  
J.M. Olson ◽  
A. Kibbler

Thin layers of III-V semiconductors, such as quantum well structures and strained layer superlattices (SLS's), are currently of great interest. However, there have been widely scattered reports suggesting that thin layers and SLS's with arbitrarily large strain and thicknesses are difficult if not impossible to grow. In this work we studied the nucleation, morphology and structural perfection of a wide variety of thin layers in the GaAs/GalnAsP system. These epitaxial layers were grown by atmospheric pressure MOCVD. The GaAs/GalnAs system is mismatched through the entire compositional range, the extreme mismatch being 7% for GaAs/lnAs. The nucleation and growth morphology of GalnAs layers on GaAs were observed to be very strongly dependent on the mismatch (i.e. the In concentration x) This is clearly depicted in Fig. 1 which shows secondary electron micrographs of the surface of three GalnAs layers grown for 30 sec. using the same growth rate of 600 Å min-1.


Author(s):  
Lucas Copeland ◽  
Mukul Saran

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.


Coatings ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 911
Author(s):  
Wei Dai ◽  
Yunzhan Shi

TaNx coatings were deposited by RF magnetron sputtering with different bias voltages. The growth morphology, crystalline structure, chemical bond structure, hardness and elastic modulus, adhesion strength and tribological performance of the coatings were studied as a function of the bias voltage. The results showed that an increasing bias voltage refines the coating grains and facilitates structure densification. Simultaneously, the structure of the TaNx coatings transfers from a composite structure consisting of TaN and Ta2N crystals, through a single composite mainly composed of the Ta2N crystal, to an amorphous structure as the bias voltage increases from low to high, indicating that the phase composition of the TaNx coatings can be varied by the bias voltage. The coating composed of Ta2N crystal showed a good overall performance including enhanced hardness, enhanced adhesive strength, and good tribological performance with enhanced wear resistance and a low friction coefficient of 0.18.


2021 ◽  
Vol 555 ◽  
pp. 153110
Author(s):  
Kui Liu ◽  
Tan tan ◽  
Xuanpu Zhou ◽  
Nantao Zheng ◽  
Yue Ma ◽  
...  

2009 ◽  
Vol 11 (3) ◽  
pp. 550-553 ◽  
Author(s):  
Said A. Farha Al-Said ◽  
Reda Hassanien ◽  
Jennifer Hannant ◽  
Miguel A. Galindo ◽  
Stela Pruneanu ◽  
...  

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