Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods

2010 ◽  
Author(s):  
Lucas Copeland ◽  
Mukul Saran
Keyword(s):  
Intermetallic Compound ◽  
Imaging Study ◽  
Thermal Ageing ◽  
Initial Model ◽  
Growth Morphology ◽  
Intermetallic Formation ◽  
Imaging Parameters ◽  
Bonded Interface ◽  
Bond Interface ◽  
Sem Imaging

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

Investigation of the Intermetallic Formation on Wet Underwater Welding of AISI 4012 Steel

2020 ◽  
Vol 991 ◽  
pp. 10-16
Author(s):  
Agus Dwi Anggono ◽  
Suwantri ◽  
Waluyo Adi Siswanto ◽  
Joko Sedyono
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Intermetallic Compound ◽  
Tensile Test ◽  
Electric Current ◽  
Intermetallic Layer ◽  
Plain Water ◽  
Water Pool ◽  
Underwater Welding ◽  
Intermetallic Formation

The objectives of the study is to investigate the formation of intermetallic compound and the mechanical properties of the underwater welding. AISI 4012 steel was selected as the material and two types of electrode E6013 and E7018. The variations of electric current used in this study were 80,100, and 120 amperes. The underwater welding was conducted in plain water pool and 3 meters depth by using SMAW. Tensile test and SEM-EDS were carried out to investigate the tensile strength and appearence the intermetallic layer.The results of this study indicated that the highest value of tensile stresswas found on the use E7018 electrodes and 80 amperes electric current. While the lowest value was found in the use E6013 electrodes with 120 amperes. Intermetallic layer was detected base on the SEM-EDS investigation.

Going submicron in the precise analysis of soil structure: A FIB-SEM imaging study at nanoscale

Geoderma ◽  
2021 ◽  
Vol 383 ◽  
pp. 114739
Author(s):  
Kirill M. Gerke ◽  
Evgeniy V. Korostilev ◽  
Konstantin A. Romanenko ◽  
Marina V. Karsanina
Keyword(s):  
Soil Structure ◽  
Imaging Study ◽  
Precise Analysis ◽  
Sem Imaging

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

2013 ◽  
Vol 421 ◽  
pp. 260-266 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
Stuart McDonald ◽  
Kazuhiro Nogita
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Composite Solder ◽  
Short Review ◽  
Lead Free ◽  
Nanoparticle Size ◽  
Intermetallic Formation ◽  
Reinforcing Effects ◽  
Lead Free Solders

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.

scholarly journals Mapping the Distribution of Particles in Hydrogel in Use for Nanoplasmonic Biosensors: A Comparison of Preparation Methods

2018 ◽  
Author(s):  
Harald Ian Muri ◽  
Linh Hoang ◽  
Dag Roar Hjelme
Keyword(s):  
Electron Microscope ◽  
Polymer Network ◽  
Drying Methods ◽  
Preparation Methods ◽  
Particle Distributions ◽  
Imaging Parameters ◽  
Volume Imaging ◽  
Critical Point Drying ◽  
Sem Imaging ◽  
Scanning Electron

The distribution of noble metal nanoparticles in hydrogels are influencing their nanoplasmonic response and signal used for biosensor purposes. By controlling the particle distribution, it is possible to obtain new nanoplasmonic features with new sensing modalities. Particle distributions can be characterized by using volume-imaging methods such as the focused ion beam-scanning electron microscope (FIB-SEM) and the serial block-face scanning electron microscopy (SBFSEM) techniques . Since the pore structure of hydrogels is contained by the water absorbed in the polymer network it may pose challenges for volume-imaging based on electron microscope techniques since the sample must be in a vacuum chamber. The structure of hydrogels can be conserved by choosing appropriate preparation methods, which also depends on the composition of the hydrogel used. In this paper, we have prepared low-weight percentage hydrogels, with and without gold nanorods (GNR) for conventional SEM imaging by using two different drying techniques; (1) the critical point drying (CPD) technique and (2) hexamethyldisilazane (HMDS) drying of hydrogels. A qualitative characterization of the GNR-hydrogels was carried out to study the GNRs positioned in the polymer network. The effect of the two different drying methods on the hydrogel morphology were also compared. The use of HMDS as an alternative to the CPD has several advantages involving less parametrical variables for drying, involving less effort, being cost-effective, and requires no equipment use. In addition, choosing an optimized sample preparation method for SEM with optimized imaging parameters is highly important for obtaining accurate information about materials that is not correlated to artifacts. Hence, the results obtained from the preparation methods and SEM imaging parameters in this paper are useful for developing methods for mapping the metal particle distributions in micro-hydrogels by using FIB-SEM and SBFSEM techniques.

Growth of Intermetallics at Coated Silver Wire Bond Interfaces

2018 ◽  
Vol 2018 (1) ◽  
pp. 000578-000582 ◽  
Author(s):  
Sarangapani Murali ◽  
Wong Chin Yeung Jason
Keyword(s):  
Solid Solution ◽  
Thin Layer ◽  
Precise Measurement ◽  
Ion Beam ◽  
Thermal Ageing ◽  
X Ray ◽  
Transmission Electron ◽  
Free Air ◽  
Bond Interface ◽  
Focus Ion Beam

Abstract The newly developed gold (Au) coated silver (Ag) wire exhibits axi-symmetrical free air ball (FAB) formation under atmosphere similar to Au wire. FAB of coated Ag showed better corrosion resistance than FAB of alloyed Ag, as Au dissolved along the periphery of Ag FAB forming into a solid-solution, Ag-Au alloy. Composition of the solid-solution Ag-Au alloy along the periphery ranges between 10 and 28wt% of Au. The diffusion depth of Au is 4μm from surface towards the center of FAB. For precise measurement of the diffusion length of Au into Ag, a solid thin layer is been parted using focus-ion beam (FIB). The solid thin layer is further thinned down to observe in Transmission Electron Microscope (TEM) and analyzed using line scan energy dispersive X-ray analysis (EDX) attached to it. Near the neck of FAB and wire, Au diffusion is high up to 58wt%. On thermal ageing at 150/175°C for 500/1000h, the coated Ag wire bonded to Al-0.5wt%Cu pad revealed no degradation on ball pull/shear. Bond interface revealed significant growth of silver aluminide (AgAl) to a thickness of 3μm for 1000h of ageing and the growth rate fits to square-root power law.

SEM imaging of membranes: Importance of sample preparation and imaging parameters

2014 ◽  
Vol 463 ◽  
pp. 113-125 ◽  
Author(s):  
Syed Z. Abdullah ◽  
Pierre R. Bérubé ◽  
Derrick J. Horne
Keyword(s):  
Sample Preparation ◽  
Imaging Parameters ◽  
Sem Imaging

P3-086: FTO is Not Related to Imaging Parameters of the Hippocampus: A Volumetric and Diffusion Tensor Imaging Study

2016 ◽  
Vol 12 ◽  
pp. P851-P851
Author(s):  
Sebastian Huhn ◽  
Zhang Rui ◽  
Frauke Beyer ◽  
Shahrzad Kharabian Masouleh ◽  
Leonie Lampe ◽  
...  
Keyword(s):  
Diffusion Tensor Imaging ◽  
Diffusion Tensor ◽  
Imaging Study ◽  
Imaging Parameters ◽  
And Diffusion ◽  
Diffusion Tensor Imaging Study

Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

2013 ◽  
Vol 795 ◽  
pp. 522-525 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Intermetallic Compound ◽  
Aging Temperature ◽  
Electronic Packaging ◽  
Isothermal Aging ◽  
Aging Process ◽  
Composite Solder ◽  
Intermetallic Formation ◽  
Imcs Growth ◽  
Packaging Industry ◽  
Growth Formation

Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.

Longitudinal comparison of pre- and postoperative diffusion tensor imaging parameters in young children with hydrocephalus

2010 ◽  
Vol 5 (4) ◽  
pp. 385-391 ◽  
Author(s):  
Ellen L. Air ◽  
Weihong Yuan ◽  
Scott K. Holland ◽  
Blaise V. Jones ◽  
Karin Bierbrauer ◽  
...  
Keyword(s):  
White Matter ◽  
Young Children ◽  
Diffusion Tensor ◽  
Mean Diffusivity ◽  
Imaging Study ◽  
The Other ◽  
Healthy Children ◽  
Shunt Insertion ◽  
Vp Shunt ◽  
Imaging Parameters

Object The goal in this study was to compare the integrity of white matter before and after ventriculoperitoneal (VP) shunt insertion by evaluating the anisotropic diffusion properties with the aid of diffusion tensor (DT) imaging in young children with hydrocephalus. Methods The authors retrospectively identified 10 children with hydrocephalus who underwent both pre- and postoperative DT imaging studies. The DT imaging parameters (fractional anisotropy [FA], mean diffusivity, axial diffusivity, and radial diffusivity) were computed and compared longitudinally in the splenium and genu of the corpus callosum (gCC) and in the anterior and posterior limbs of the internal capsule (PLIC). The patients' values on DT imaging at the pre- and postshunt stages were compared with the corresponding age-matched controls as well as with a large cohort of healthy children in the database. Results In the gCC, 7 of 10 children had abnormally low preoperative FA values, 6 of which normalized postoperatively. All 3 of the 10 children who had normal preoperative FA values had normal FA values postoperatively as well. In the PLIC, 7 of 10 children had abnormally high FA values, 6 of which normalized postoperatively, whereas the other one had abnormally low postoperative FA. Of the remaining 3 children, 2 had abnormally low preoperative FA values in the PLIC; this normalized in 1 patient after surgery. The other child had a normal preoperative FA value that became abnormally low postoperatively. When comparing the presurgery frequency of abnormally low, normal, and abnormally high FA values to those postsurgery, there was a statistically significant longitudinal difference in both gCC (p = 0.02) and PLIC (p = 0.002). Conclusions In this first longitudinal DT imaging study of young children with hydrocephalus, DT imaging anisotropy yielded abnormal results in several white matter regions of the brain, and trended toward normalization following VP shunt placement.

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