Study of spiral inductors using Cu/low-k interconnect for high-performance radio-frequency integrated circuit (RF-IC) applications

2002 ◽  
Vol 34 (1) ◽  
pp. 43-48 ◽  
Author(s):  
Yo-Sheng Lin ◽  
Hum-Ming Hsu
2018 ◽  
Vol 89 (4) ◽  
pp. 560-571 ◽  
Author(s):  
Xiaochen Chen ◽  
Leena Ukkonen ◽  
Johanna Virkki

Passive radio frequency identification-based technology is a convincing approach to the achievement of versatile energy- and cost-efficient wireless platforms for future wearable applications. By using two-part antenna structures, the antenna-electronics interconnections can remain non-stressed, which can significantly improve the reliability of the textile-embedded wireless components. In this article, we describe fabrication of two-part stretchable and non-stretchable passive ultra-high frequency radio frequency identification textile tags using electro-textile and embroidered antennas, and test their reliability when immersed as well as under cyclic strain. The results are compared to tags with traditional one-part dipole antennas fabricated from electro-textiles and by embroidery. Based on the results achieved, the initial read ranges of the two-part antenna tags, around 5 m, were only slightly shorter than those of the one-part antenna tags. In addition, the tag with two-part antennas can maintain high performance in a moist environment and during continuous stretching, unlike the one-part antenna tag where the antenna-integrated circuit attachment is under stress.


Author(s):  
Amy Poe ◽  
Steve Brockett ◽  
Tony Rubalcava

Abstract The intent of this work is to demonstrate the importance of charged device model (CDM) ESD testing and characterization by presenting a case study of a situation in which CDM testing proved invaluable in establishing the reliability of a GaAs radio frequency integrated circuit (RFIC). The problem originated when a sample of passing devices was retested to the final production test. Nine of the 200 sampled devices failed the retest, thus placing the reliability of all of the devices in question. The subsequent failure analysis indicated that the devices failed due to a short on one of two capacitors, bringing into question the reliability of the dielectric. Previous ESD characterization of the part had shown that a certain resistor was likely to fail at thresholds well below the level at which any capacitors were damaged. This paper will discuss the failure analysis techniques which were used and the testing performed to verify the failures were actually due to ESD, and not caused by weak capacitors.


2021 ◽  
Vol 17 (7) ◽  
pp. 155014772110248
Author(s):  
Miaoyu Li ◽  
Zhuohan Jiang ◽  
Yutong Liu ◽  
Shuheng Chen ◽  
Marcin Wozniak ◽  
...  

Physical health diseases caused by wrong sitting postures are becoming increasingly serious and widespread, especially for sedentary students and workers. Existing video-based approaches and sensor-based approaches can achieve high accuracy, while they have limitations like breaching privacy and relying on specific sensor devices. In this work, we propose Sitsen, a non-contact wireless-based sitting posture recognition system, just using radio frequency signals alone, which neither compromises the privacy nor requires using various specific sensors. We demonstrate that Sitsen can successfully recognize five habitual sitting postures with just one lightweight and low-cost radio frequency identification tag. The intuition is that different postures induce different phase variations. Due to the received phase readings are corrupted by the environmental noise and hardware imperfection, we employ series of signal processing schemes to obtain clean phase readings. Using the sliding window approach to extract effective features of the measured phase sequences and employing an appropriate machine learning algorithm, Sitsen can achieve robust and high performance. Extensive experiments are conducted in an office with 10 volunteers. The result shows that our system can recognize different sitting postures with an average accuracy of 97.02%.


Author(s):  
D. Tamilarasi ◽  
P. Ramesh ◽  
Raja Krishnamoorthy ◽  
C. Bharatiraja ◽  
T. Jayasankar

RSC Advances ◽  
2016 ◽  
Vol 6 (73) ◽  
pp. 68560-68567 ◽  
Author(s):  
Lingqiang Kong ◽  
Tianke Qi ◽  
Zhidong Ren ◽  
Yunxia Jin ◽  
Yan Li ◽  
...  

Intrinsic highly cross-linked low-k benzocyclobutene polymer functionalized with adamantyl and perfluorocyclobutylidene.


1991 ◽  
Vol 02 (03) ◽  
pp. 147-162 ◽  
Author(s):  
ROBERT G. SWARTZ

Compound semiconductor technology is rapidly entering the mainstream, and is quickly finding its way into consumer applications where high performance is paramount. But silicon integrated circuit technology is evolving up the performance curve, and CMOS in particular is consuming ever more market share. Nowhere is this contest more clearly evident than in optical communications. Here applications demand performance ranging from a few hundreds of megahertz to multi-gigahertz, from circuits containing anywhere from tens to tens of thousands of devices. This paper reviews the high performance electronics found in optical communication applications from a technology standpoint, illustrating merits and market trends for these competing, yet often complementary IC technologies.


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