Significantly enhanced thermal conductivity in polyimide composites with the matching of graphene flakes and aluminum nitride by in situ polymerization

Abstract The application of ceramic materials is limited due to the complicated preparation process and intrinsic brittleness. In this work, a pressureless manufacturing route that enables the formation of barium aluminosilicate (BAS) glass-ceramic consisting of internal β-Sialon fibers with enhanced thermal conductivity is developed. By adjusting the carbon source content, composites with different Sialon contents can be easily fabricated. The thermal conductivity of the sample with 3.5 wt.% is improved to 5.845 W/m ∙ K with the Sialon content of 26 wt.% in the composite, which is 112.64 % higher than that of the pure BAS matrix. The theoretical models suggest that the enhanced thermal conductivity is mainly ascribed to the thermal conduction network constructed by Sialon fibers. This work provides a method with industrial application prosperity to fabricate the high temperature ceramic matrix composite of different sizes and complex shapes.

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Significantly enhanced and precisely modeled thermal conductivity in polyimide nanocomposites with chemically modified graphene via in situ polymerization and electrospinning-hot press technology

Journal of Materials Chemistry C ◽

10.1039/c8tc00452h ◽

2018 ◽

Vol 6 (12) ◽

pp. 3004-3015 ◽

Cited By ~ 245

Author(s):

Yongqiang Guo ◽

Genjiu Xu ◽

Xutong Yang ◽

Kunpeng Ruan ◽

Tengbo Ma ◽

...

Keyword(s):

Thermal Conductivity ◽

In Situ Polymerization ◽

Hot Press ◽

Conductivity Model ◽

Chemically Modified ◽

Thermal Conductivity Model ◽

Modified Graphene ◽

Thermal Conductivities

Significantly improved thermal conductivities and a more accurate thermal conductivity model were achieved.

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Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler

Journal of Materials Chemistry A ◽

10.1039/c4ta06417h ◽

2015 ◽

Vol 3 (9) ◽

pp. 4884-4891 ◽

Cited By ~ 118

Author(s):

Wen Dai ◽

Jinhong Yu ◽

Yi Wang ◽

Yingze Song ◽

Fakhr E. Alam ◽

...

Keyword(s):

Thermal Conductivity ◽

Silicon Carbide ◽

Three Dimensional ◽

Graphene Sheets ◽

Polyimide Composites ◽

Polyimide Matrix ◽

Enhanced Thermal Conductivity

3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.

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Manipulating thermal conductivity of polyimide composites by hybridizing micro- and nano-sized aluminum nitride for potential aerospace usage

Journal of Thermoplastic Composite Materials ◽

10.1177/0892705718816352 ◽

2019 ◽

Vol 33 (8) ◽

pp. 1017-1029 ◽

Cited By ~ 1

Author(s):

Honglin Luo ◽

Jikui Liu ◽

Zhiwei Yang ◽

Quanchao Zhang ◽

Haiyong Ao ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Conductivity ◽

Aluminum Nitride ◽

Conductive Polymer ◽

Total Content ◽

Thermally Conductive ◽

Polyimide Composites ◽

First Time ◽

Dielectric And Mechanical Properties ◽

Simple Economic

Electrically insulating yet thermally conductive polymer-based composites are highly sought after in aerospace field. In this work, for the first time, electrically insulating but thermally conductive polyimide (PI) composites are fabricated by simultaneously incorporating micro- and nano-sized aluminum nitride (AlN) particles via a simple, economic, and scalable method of ball milling and subsequent hot-pressing process. The thermal conductivity, dielectric, and mechanical properties of the PI composites depend on the ratio of micro-sized AlN (m-AlN) to nano-sized AlN (n-AlN) and the total content of AlN in the PI composites. The thermal conductivity of the PI composites with 40 wt% m-AlN and 20 wt% n-AlN is 1.5 ± 0.05 W·m−1·K−1, which is 10 times higher than that of bare PI. The PI composites hold a great potential in aerospace industries.

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