On‐wafer
thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for
through‐silicon
via applications: Comparison to
plasma‐enhanced
chemical vapor deposition
SiO
2
Keyword(s):
1997 ◽
Vol 36
(Part 2, No. 2A)
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pp. L150-L153
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2014 ◽
Vol 33
(3-4)
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pp. 149-154
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2009 ◽
Vol 467
(1-2)
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pp. L8-L10
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2002 ◽
Vol 149
(12)
◽
pp. A1584
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1997 ◽
Vol 36
(Part 1, No. 7A)
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pp. 4278-4282
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1996 ◽
Vol 169
(3)
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pp. 474-479
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