scholarly journals On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2

2020 ◽  
Vol 58 (16) ◽  
pp. 2248-2258
Author(s):  
Takafumi Fukushima ◽  
Mariappan Murugesan ◽  
Ji‐Cheol Bea ◽  
Hiroyuki Hashimoto ◽  
Hisashi Kino ◽  
...  
2007 ◽  
Vol 101 (8) ◽  
pp. 084107 ◽  
Author(s):  
El Hassane Oulachgar ◽  
Cetin Aktik ◽  
Mihai Scarlete ◽  
Starr Dostie ◽  
Rob Sowerby ◽  
...  

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